D2PAK-3 (TO-263-3)

Autre paquet

• 68-BCPGA
• 64-DIP (0.750", 19.05mm)
• H-37248-4
• 28-SOIC
• PowerPAK® 8 x 8 Dual
• 16-VFCQFN Exposed Pad
• Disc 23mm
• 8-DSBGA
• SOD-123H
• SPD-4
• DO-214AC
• OM-780-4L
• 56-VFQFN Exposed Pad, CSP
• 170-LFBGA
• 44-SOIC (0.525, 13.34mm Width)