XCZU9CG-L1FFVB1156I

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XCZU9CG-L1FFVB1156I

IC SOC CORTEX-A53 1156FCBGA

  • Fabricant
  • Mfr. Partie #XCZU9CG-L1FFVB1156I
  • Paquet FCBGA-1156
  • Fiche de données
  • En stock7236

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Spécifications

Package Bulk
Series Zynq® UltraScale+™ MPSoC CG
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 1156-BBGA, FCBGA

Vue d'ensemble

Description

The XCZU9CG-L1FFVB1156I is a member of the Xilinx Zynq UltraScale+ MPSoC family, designed for high-performance, embedded applications. It integrates a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic via an FPGA. This combination allows for versatile computing, enabling both software and hardware acceleration for complex tasks.
Key features include a large number of configurable I/O pins, extensive memory interfaces, and high-speed connectivity options such as PCIe and Ethernet. The device operates at a maximum clock frequency of up to 1.5 GHz and offers multiple power options, making it suitable for a range of applications, from automotive and industrial automation to telecommunications and AI inference.
With its rich development ecosystem, including the Vitis and Vivado toolchains, engineers can streamline their design processes while leveraging hardware/software co-design capabilities. Overall, the XCZU9CG-L1FFVB1156I is ideal for applications requiring high performance, flexibility, and efficient integration of processing and programmable logic.

Features

The XCZU9CG-L1FFVB1156I is a part of Xilinx's Zynq UltraScale+ MPSoC family, which combines a powerful ARM Cortex-A53 quad-core processor with a dual-core Cortex-R5 real-time processor and programmable logic. Key features include:
1. Processing Power: Quad-core ARM Cortex-A53 for high-performance applications, and dual-core Cortex-R5 for real-time processing.
2. FPGA Fabric: Large FPGA resources with configurable logic blocks, DSP slices, and high-speed I/O for custom hardware acceleration.
3. Memory Interfaces: Supports multiple memory interfaces, including DDR4, providing high bandwidth and capacity.
4. Connectivity: Integrated Gigabit Ethernet, PCIe, and high-speed serial transceivers for flexible communication options.
5. Security: Advanced security features, including hardware-based encryption and secure boot capabilities.
6. Thermal Performance: Designed for efficient thermal management, suitable for various industrial applications.
Overall, the XCZU9CG-L1FFVB1156I is ideal for applications requiring a combination of high processing power and customizable hardware, such as communications, automotive, and industrial control systems.

Package

The XCZU9CG-L1FFVB1156I is packaged in a FFG (Fine Pitch Ball Grid Array) format, specifically with 1156 balls. This type of package is designed for high-density applications, providing a compact footprint and efficient thermal performance.

Pinout

The XCZU9CG-L1FFVB1156I is part of the Xilinx Zynq UltraScale+ MPSoC family. It features a total pin count of 1156. This device integrates a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and programmable logic (FPGA) resources.
The key functions of the XCZU9CG include:
1. Processing System (PS): Combines ARM processors for general computing tasks.
2. Programmable Logic (PL): Provides FPGA capabilities for custom hardware acceleration and parallel processing.
3. High-speed I/O: Supports multiple interfaces such as PCIe, USB, and Ethernet.
4. Storage Interfaces: Includes support for SD/SDIO, QSPI, and other memory interfaces.
5. Analog and Mixed-Signal Processing: Some variants may include integrated ADCs/DACs.
This combination of features makes the XCZU9CG-L1FFVB1156I suitable for a wide range of applications, including industrial automation, telecommunications, and automotive systems.

Manufacturer

The manufacturer of the XCZU9CG-L1FFVB1156I is Xilinx, Inc., which is now part of AMD (Advanced Micro Devices, Inc.). Xilinx is a semiconductor company that specializes in field-programmable gate arrays (FPGAs), adaptive compute acceleration platforms, and system-on-chip (SoC) devices. The XCZU9CG-L1FFVB1156I is part of Xilinx's Zynq UltraScale+ MPSoC family, which combines programmable logic with ARM-based processing capabilities, making it suitable for a wide range of applications, including telecommunications, automotive, industrial, and aerospace. Xilinx focuses on enabling flexible and efficient design solutions for engineers and developers through its innovative products and technologies.

Application

The XCZU9CG-L1FFVB1156I is a high-performance Zynq UltraScale+ MPSoC from Xilinx, typically used in applications such as telecommunications, data centers, industrial automation, automotive systems, medical imaging, and aerospace. Its versatility supports complex algorithms, high-speed processing, and real-time data handling, making it suitable for edge computing, AI inference, and high-throughput signal processing tasks.

Equivalent

The XCZU9CG-L1FFVB1156I is a part of the Xilinx Zynq UltraScale+ MPSoC family. Equivalent products include the XCZU9CG-L1FFVC1156I and other variants in the Zynq UltraScale+ series, like XCZU7CG and XCZU11EG, depending on the specific requirements for resources, performance, and features. Always check the datasheets for detailed comparisons.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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