XCZU7EV-2FBVB900I

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XCZU7EV-2FBVB900I

IC SOC CORTEX-A53 900FCBGA

  • Fabricant
  • Mfr. Partie #XCZU7EV-2FBVB900I
  • Paquet FBGA-900
  • Fiche de données
  • En stock7388

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Spécifications

Package Tray
Series Zynq® UltraScale+™ MPSoC EV
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 900-BBGA, FCBGA

Vue d'ensemble

Description

The XCZU7EV-2FBVB900I is a high-performance System on Chip (SoC) from Xilinx's Zynq UltraScale+ family, designed for applications requiring significant processing power and flexibility. It combines a dual-core ARM Cortex-A53 processor with a real-time ARM Cortex-R5 processor and an array of programmable logic (FPGA) resources.
Key features include:
- Architecture: 64-bit processing with heterogeneous multi-processing capabilities.
- FPGA Fabric: Extensive logic cells, DSP slices, and block RAM for custom hardware acceleration.
- I/O Support: Multiple high-speed interfaces, including PCIe, Ethernet, and USB, enabling connectivity for diverse applications.
- Performance: Supports high-performance computing tasks, making it suitable for industrial automation, automotive, and telecommunications.
- Power Efficiency: Designed for low power consumption while delivering high performance.
This SoC is ideal for developers looking to integrate embedded processing with custom hardware acceleration in a single platform.

Features

The XCZU7EV-2FBVB900I is a member of the Xilinx Zynq UltraScale+ MPSoC family, which combines a traditional processing system with programmable logic. Key features include:
1. Architecture: Dual-core ARM Cortex-A53 processor and a dual-core ARM Cortex-R5 real-time processor.
2. FPGA Fabric: Over 6,800 logic cells and a variety of DSP slices for high-performance applications.
3. Memory Interfaces: Supports DDR4, LPDDR4, and other memory types, enabling high bandwidth and low latency.
4. Connectivity: Multiple high-speed interfaces such as PCIe, USB, Gigabit Ethernet, and SATA.
5. Programmable Logic: Configurable via the Vivado Design Suite, allowing for custom hardware acceleration.
6. Thermal and Power Management: Designed for efficient power management with dynamic voltage and frequency scaling.
7. Security Features: Integrated hardware security features for secure boot and data protection.
This SoC is suitable for applications in communications, automotive, industrial, and medical fields, where both processing and custom logic are required.

Package

The XCZU7EV-2FBVB900I is packaged in a 900-ball FBGAs (Fine Ball Grid Array) form factor. This type of package is designed for high-density applications and provides excellent thermal and electrical performance.

Pinout

The XCZU7EV-2FBVB900I is a part of the Xilinx Zynq UltraScale+ MPSoC family. It features a pin count of 900 pins.
The device integrates both programmable logic (FPGA) and processing system (PS) capabilities, allowing for versatile applications. The PS includes a dual-core ARM Cortex-A53 and a dual-core ARM Cortex-R5 processor, along with various interfaces such as USB, Ethernet, and PCIe. The programmable logic section supports various I/O standards, enabling customization for specific applications.
Overall, this device is designed for high-performance applications, including embedded systems, data processing, and machine learning, providing a combination of processing power and flexibility in design.

Manufacturer

The XCZU7EV-2FBVB900I is manufactured by Xilinx, Inc., which is a company specializing in the development of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays) and SoCs (System on Chips). Founded in 1984 and headquartered in San Jose, California, Xilinx has been a leader in the semiconductor industry, providing solutions for a wide range of applications, including telecommunications, automotive, aerospace, and industrial sectors. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), which expanded AMD's portfolio in high-performance computing and adaptive computing solutions. Xilinx is known for its innovative programmable devices that enable engineers to design custom hardware to meet specific performance and functionality needs.

Application

The XCZU7EV-2FBVB900I is primarily used in applications such as high-performance computing, machine learning, data processing, and real-time video analytics. It is suitable for industries like automotive (ADAS), telecommunications, aerospace, and defense, as well as industrial automation and IoT systems. Its versatility in handling complex algorithms and parallel processing makes it ideal for edge computing and advanced embedded systems.

Equivalent

The XCZU7EV-2FBVB900I is a Zynq UltraScale+ MPSoC from Xilinx. Equivalent products include the XCZU7EV-1FBVB900I, which has a lower performance tier, and other members of the Zynq UltraScale+ family, such as XCZU6EG and XCZU9EG, depending on specific application requirements. Always verify specifications and compatibility for your needs.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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