XCZU4EV-2SFVC784I

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XCZU4EV-2SFVC784I

IC SOC CORTEX-A53 784FCBGA

  • Fabricant
  • Mfr. Partie #XCZU4EV-2SFVC784I
  • Paquet FBGA-784
  • Fiche de données
  • En stock7621

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Spécifications

Package Tray
Series Zynq® UltraScale+™ MPSoC EV
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 784-BFBGA, FCBGA

Vue d'ensemble

Description

The XCZU4EV-2SFVC784I is a part of Xilinx's Zynq UltraScale+ MPSoC family, which combines a high-performance processing system with programmable logic. Specifically, this model features a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a variety of programmable logic resources.
The XCZU4EV variant offers a significant amount of resources, including 4MB of on-chip memory, up to 4,096 programmable logic cells, and integrated high-speed I/O options. The device is designed for applications requiring robust processing capabilities alongside flexible hardware customization, making it ideal for industrial automation, automotive applications, and advanced communications.
The 784-ball FCLGA package provides a compact form factor suitable for space-constrained designs, while extensive connectivity options, including PCIe, USB, and Ethernet, enhance its versatility. The XCZU4EV-2SFVC784I is supported by Xilinx's Vitis and Vivado design environments, facilitating the development of complex systems that leverage both software and hardware innovation.

Features

The XCZU4EV-2SFVC784I is a member of Xilinx's Zynq UltraScale+ family, specifically designed for applications requiring high performance and versatility. Key features include:
1. Architecture: Combines a dual-core ARM Cortex-A53 processor with a real-time ARM Cortex-R5 processor and programmable logic (FPGA).
2. Logic Cells: Approximately 6,840 logic cells for customizable hardware configurations.
3. DSP Slices: 140 DSP slices for high-performance signal processing.
4. Memory: Supports up to 1.5 MB of block RAM for data storage and processing.
5. I/O Capabilities: Offers multiple high-speed I/O interfaces, including PCIe, USB, and Ethernet, facilitating connectivity.
6. Power: Designed for efficient power usage, making it suitable for embedded applications.
7. Package: Comes in a compact 784-ball FCBGA package for space-constrained designs.
8. Applications: Ideal for automotive, industrial automation, and telecommunications.
This combination of processing power and flexible hardware makes the XCZU4EV-2SFVC784I suitable for a wide range of advanced applications.

Package

The XCZU4EV-2SFVC784I is packaged in a 784-ball FCLGA (Fine-Pitch Ball Grid Array) format. This type of package is designed for high-density applications and provides efficient thermal and electrical performance.

Pinout

The XCZU4EV-2SFVC784I is a part of the Xilinx Zynq UltraScale+ MPSoC family. It features a pin count of 784. This device integrates both programmable logic (FPGA) and a processing system (ARM Cortex-A53 and Cortex-R5 cores), allowing for versatile applications in embedded systems.
The functions of the pins include various interfaces such as GPIO, I2C, SPI, UART, and high-speed protocols like PCIe and Ethernet. Additionally, it supports analog functions and configuration interfaces. The device is designed for high-performance applications, making it suitable for automotive, industrial, and communication systems.
For detailed pin assignments and functionality, referring to the specific data sheet or user guide is recommended.

Manufacturer

The XCZU4EV-2SFVC784I is manufactured by Xilinx, a company known for its field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and other related semiconductor products. Xilinx, now part of AMD (Advanced Micro Devices) following its acquisition in 2022, specializes in adaptive computing technology that enables a wide range of applications, including telecommunications, automotive, industrial, and data centers. The XCZU4EV-2SFVC784I is part of the Zynq UltraScale+ series, which integrates a processing system with programmable logic, allowing for versatile and efficient designs in embedded systems.

Application

The XCZU4EV-2SFVC784I is a versatile SoC from Xilinx's Zynq UltraScale+ family, suitable for applications in automotive, industrial automation, machine learning, high-performance computing, and embedded systems. It supports advanced processing tasks, real-time data processing, and high-speed connectivity, making it ideal for applications like video processing, robotics, IoT gateways, and wireless communication systems.

Equivalent

The XCZU4EV-2SFVC784I is part of the Xilinx Zynq UltraScale+ series. Equivalent products include the XCZU4EV-1SFVC784I and other Zynq UltraScale+ devices like the XCZU3EG or XCZU5EG, depending on specific requirements for performance, power consumption, and I/O configuration. For precise alternatives, consider factors like FPGA capacity, processing capabilities, and available interfaces.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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