XCZU3EG-1SFVC784E

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XCZU3EG-1SFVC784E

IC SOC CORTEX-A53 784FCBGA

  • Fabricant
  • Mfr. Partie #XCZU3EG-1SFVC784E
  • Paquet FBGA-784
  • Fiche de données
  • En stock2448

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Spécifications

Package Tray
Series Zynq® UltraScale+™ MPSoC EG
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
OperatingTemperature 0°C ~ 100°C (TJ)
Package/Case 784-BFBGA, FCBGA

Vue d'ensemble

Description

The XCZU3EG-1SFVC784E is a member of the Xilinx Zynq UltraScale+ MPSoC family, which combines a multi-core ARM Cortex-A53 processor with programmable logic (FPGA), enabling high-performance computing, real-time processing, and flexible hardware customization. The "XCZU3EG" designation indicates it belongs to the Zynq UltraScale class, while the "1SFVC784E" part specifies its package and speed grade.
This device features up to 3 programmable logic regions, offering substantial FPGA resources including configurable logic blocks, digital signal processing (DSP) slices, and memory options. It supports various I/O standards and high-speed connectivity options, making it suitable for diverse applications such as telecommunications, automotive, industrial control, and more.
The integration of a processing system alongside programmable logic allows for efficient data handling and parallel processing, providing a versatile platform for developing complex systems-on-chip (SoCs). The XCZU3EG is particularly valued for its balance of performance, power efficiency, and scalability in embedded applications.

Features

The XCZU3EG-1SFVC784E is a part of Xilinx's Zynq UltraScale+ MPSoC family, combining a programmable logic (PL) fabric with a processing system (PS) based on ARM Cortex-A53 cores. Key features include:
1. Processing System: Quad-core ARM Cortex-A53, dual-core ARM Cortex-R5 real-time processor.
2. Programmable Logic: Up to 85K logic cells with up to 260 DSP slices for high-performance processing.
3. Memory Interfaces: Supports DDR4 memory, offering substantial bandwidth for data-intensive applications.
4. Connectivity: Multiple high-speed interfaces including PCIe, USB 3.0, SATA, and Gigabit Ethernet.
5. I/O Count: 70 I/O pins, configurable for various applications.
6. Integrated Features: Includes a video codec unit, high-speed transceivers, and security features for enhanced performance and safety.
7. Power Efficiency: Optimized for low power consumption while maintaining high performance.
This device is suitable for applications in automotive, industrial, and consumer electronics, providing flexibility for custom hardware acceleration.

Package

The XCZU3EG-1SFVC784E is packaged in a 784-ball FCLGA (Fine Pitch Ball Grid Array) format. This type of packaging provides a compact design, enabling efficient thermal management and electrical performance for the Zynq UltraScale+ MPSoC.

Pinout

The XCZU3EG-1SFVC784E is a member of the Xilinx Zynq UltraScale+ MPSoC family. It features a pin count of 784.
In terms of functionality, this device integrates an ARM-based processing system (PS) with programmable logic (PL), enabling a versatile architecture for various applications. The PS includes dual-core ARM Cortex-A53 processors, a dual-core ARM Cortex-R5 real-time processor, and a range of peripherals such as USB, Ethernet, and UART. Meanwhile, the PL allows for custom hardware acceleration, digital signal processing, and other programmable functions.
The XCZU3EG is designed for high-performance applications, providing capabilities for embedded systems, automotive, industrial, and communication devices.

Manufacturer

The XCZU3EG-1SFVC784E is manufactured by Xilinx, which is now a part of AMD (Advanced Micro Devices). Xilinx is known for its development of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and other related technologies. The company specializes in providing solutions for various applications, such as telecommunications, automotive, aerospace, industrial, and more. Xilinx products are widely used in areas that require high performance, flexibility, and customization, enabling engineers to implement complex digital designs. In 2020, AMD acquired Xilinx to enhance its capabilities in data centers, artificial intelligence, and high-performance computing.

Application

The XCZU3EG-1SFVC784E is a versatile heterogeneous system-on-chip (SoC) from Xilinx's Zynq UltraScale+ series, ideal for applications such as industrial automation, automotive, robotics, communications, machine learning, and video processing. Its combination of programmable logic and ARM processing cores makes it suitable for edge computing, smart cameras, and real-time data analysis in various sectors, including IoT and aerospace.

Equivalent

The XCZU3EG-1SFVC784E is part of the Xilinx Zynq UltraScale+ series. Equivalent products include the XCZU3EG-1SFVC784, XCZU2EG-1SFVC784E, and XCZU4EG-1SFVC784E, which may vary in performance and I/O capabilities. Other alternatives could be Zynq-7000 series or FPGA solutions from competitors like Intel (e.g., Cyclone or Arria series) based on specific requirements. Always check datasheets for detailed specifications and compatibility.

Expédition

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FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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