XCVU19P-2FSVB3824E

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XCVU19P-2FSVB3824E

IC FPGA VIRTEX-UP 3824FCBGA

  • Fabricant
  • Mfr. Partie #XCVU19P-2FSVB3824E
  • Paquet 3824-BBGA
  • Fiche de données
  • En stock5608

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Spécifications

Package Tray
Series Virtex® UltraScale+™
ProductStatus Active
NumberofLABs/CLBs 510720
NumberofLogicElements/Cells 8937600
TotalRAMBits 79586918
NumberofI/O 1760
Voltage-Supply 0.825V ~ 0.876V
MountingType Surface Mount
OperatingTemperature 0°C ~ 100°C (TJ)
Package/Case 3824-BBGA, FCBGA

Vue d'ensemble

Description

The XCVU19P-2FSVB3824E is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx, part of the Versal series, designed for data center, AI, and high-performance computing applications. It features a 7nm process technology, offering enhanced processing capabilities and energy efficiency.
Key specifications include a large number of programmable logic cells, high-speed serial transceivers, and integrated DSP slices, making it suitable for complex algorithms and real-time processing. The device supports various connectivity options including PCIe, Ethernet, and CXL, facilitating integration into modern data infrastructures.
The architecture is optimized for adaptability, enabling developers to implement custom hardware accelerators and optimize workloads for specific applications. Additionally, it supports advanced software frameworks for ease of development and deployment, catering to a wide range of industries from telecommunications to automotive.
Overall, the XCVU19P-2FSVB3824E is ideal for users seeking flexible, high-performance solutions to tackle demanding computational tasks and drive innovation in various technological domains.

Features

The XCVU19P-2FSVB3824E is a high-performance FPGA (Field Programmable Gate Array) from Xilinx's Virtex UltraScale+ series. Key features include:
1. Architecture: Utilizes advanced 16nm FinFET technology, providing improved performance and power efficiency.
2. Logic Cells: Offers a substantial number of logic cells for complex processing tasks.
3. Memory: Integrates large amounts of on-chip memory, including block RAM and UltraRAM, enabling efficient data handling.
4. I/O Capabilities: Supports a wide range of high-speed I/O interfaces, including PCIe Gen4, allowing for fast data transfer.
5. DSP Slices: Incorporates numerous DSP slices optimized for signal processing applications.
6. Clocking Resources: Features advanced clock management capabilities for enhanced performance.
7. Scalability: Suitable for diverse applications from data centers to telecommunications, automotive, and industrial systems.
In summary, the XCVU19P-2FSVB3824E is designed for high-performance and versatile applications, making it ideal for demanding computational tasks.

Package

The XCVU19P-2FSVB3824E is packaged in a FSVB (Fine Pitch Ball Grid Array) form factor, specifically designed for high-performance applications. This package type provides efficient thermal management and high pin density, suitable for complex FPGA designs.

Pinout

The Xilinx Virtex UltraScale+ FPGA model XCVU19P-2FSVB3824E has a pin count of 3824. This FPGA is designed for high-performance applications and offers capabilities for extensive digital signal processing, high-speed connectivity, and high bandwidth.
The device features a rich set of functionalities including programmable logic, high-speed transceivers, and various I/O standards. It supports multiple interfaces such as PCIe, Ethernet, and serial connectivity, making it suitable for applications in data centers, telecommunications, and high-performance computing.
Additionally, it provides enhanced power efficiency and advanced features like integrated DSP slices and block RAM, catering to a wide range of use cases in complex computing environments.

Manufacturer

The manufacturer of the XCVU19P-2FSVB3824E is Xilinx, Inc., which is now part of AMD (Advanced Micro Devices, Inc.). Xilinx specializes in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and other advanced semiconductor solutions. The company is known for its innovation in adaptive computing and provides solutions for various applications, including data centers, automotive, aerospace, telecommunications, and industrial sectors. Xilinx's products are widely used in high-performance computing, machine learning, and real-time processing applications. The acquisition by AMD in 2022 has further strengthened its position in the semiconductor industry, enabling the integration of Xilinx's adaptive computing capabilities with AMD's high-performance computing portfolio.

Application

The XCVU19P-2FSVB3824E is a versatile FPGA from Xilinx, suitable for high-performance applications including machine learning, data center acceleration, high-speed networking, video processing, and digital signal processing. Its capabilities make it ideal for edge computing, 5G infrastructure, and automotive systems, where high bandwidth and low latency are critical.

Equivalent

The XCVU19P-2FSVB3824E chip is part of the Xilinx Virtex UltraScale+ FPGA family. Equivalent products include:
1. XCVU19P-2FSVB2104E
2. XCVU19P-2FSVB2112E
3. XCVU19P-2FSVB3824E (other speed grades may vary)
Always verify specific features, I/O capabilities, and power requirements for your application.

Expédition

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FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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