XC7Z100-L2FFG900I

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XC7Z100-L2FFG900I

IC SOC CORTEX-A9 800MHZ 900FCBGA

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  • Mfr. Partie #XC7Z100-L2FFG900I
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Spécifications

Series Zynq®-7000
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 444K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Base Product Number XC7Z100

Vue d'ensemble

Description

The XC7Z100-L2FFG900I is a member of Xilinx's Zynq-7000 series, which integrates a dual-core ARM Cortex-A9 processor with Xilinx's 7-series FPGA technology. This System-on-Chip (SoC) is designed for high-performance embedded applications, offering a balance of processing power and programmable logic.
Key features include:
- Processing System: Dual ARM Cortex-A9 cores capable of running at up to 1 GHz, enabling complex software applications.
- FPGA Fabric: A significant amount of programmable logic, offering flexibility for custom hardware acceleration and interfacing.
- Memory Interfaces: Supports various memory types, including DDR3, providing high bandwidth for data-intensive applications.
- Connectivity: Multiple I/O options, including GPIO, UART, SPI, and Ethernet, facilitating diverse communication needs.
The XC7Z100-L2FFG900I is suitable for applications in automotive, industrial automation, telecommunications, and consumer electronics, where performance, adaptability, and real-time processing are critical.

Features

The XC7Z100-L2FFG900I is a member of Xilinx's Zynq-7000 series, integrating a dual-core ARM Cortex-A9 processor and FPGA fabric. Key features include:
1. Processing System: Dual-core ARM Cortex-A9 running up to 1 GHz.
2. FPGA Fabric: 28nm technology with 100K logic cells, 6,840 LUTs, and 240 DSP slices.
3. Memory Support: Up to 1 GB of DDR3/LPDDR2 memory interface.
4. I/O Capabilities: 100+ programmable I/O pins, supporting various standards (GPIO, I2C, SPI, UART).
5. High-Speed Interfaces: Supports PCIe, Gigabit Ethernet, and USB 2.0.
6. Power Efficiency: Operates with low power consumption, typically around 1W for the processing system.
7. Package Type: Available in a FGG900 package, suitable for extensive thermal and mechanical reliability.
Ideal for applications in automotive, industrial, and communications sectors, the XC7Z100-L2FFG900I offers a flexible architecture for embedded systems.

Package

The XC7Z100-L2FFG900I is packaged in a FFG (Fine Pitch Ball Grid Array) configuration, specifically featuring a 900-ball layout. This type of package is designed for high-density applications and provides excellent thermal performance and electrical connectivity.

Pinout

The XC7Z100-L2FFG900I is a member of the Xilinx Zynq-7000 series, specifically designed for embedded processing applications. It features a total of 900 pins.
The device combines a dual-core ARM Cortex-A9 processor with programmable logic, allowing for flexible hardware acceleration and processing capabilities. The pins serve various functions including:
- Power and Ground Pins: Supply power to the device.
- I/O Pins: Configurable for general-purpose input/output, enabling communication with external peripherals.
- Dedicated High-Speed Interfaces: Such as USB, Ethernet, and PCIe for connectivity.
- Analog Inputs: For interfacing with sensors and other analog devices.
- Configuration and Programming Pins: Used for programming the FPGA and configuring the system on-chip.
Overall, the pin count and arrangement support a wide range of applications in embedded systems, automotive, industrial, and consumer electronics.

Manufacturer

The XC7Z100-L2FFG900I is manufactured by Xilinx, Inc., a prominent company that specializes in programmable logic devices and semiconductor solutions. Xilinx is known for its field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-chip (SoC) products. The company's focus lies in providing high-performance computing and programmable solutions for a wide range of applications, including telecommunications, automotive, aerospace, and industrial sectors. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in the semiconductor market.

Application

The XC7Z100-L2FFG900I is a Zynq-7000 series SoC used in various application areas including industrial automation, automotive systems, medical devices, aerospace, and defense. Its integration of ARM processing with FPGA allows for high-performance computing, real-time processing, and custom hardware acceleration, making it suitable for robotics, data acquisition, image processing, and IoT applications.

Equivalent

The XC7Z100-L2FFG900I is a Xilinx Zynq-7000 series SoC. Equivalent products include:
1. Xilinx Z-7030 - Similar performance with fewer resources.
2. Xilinx Z-7010 - Lower performance and resource count.
3. Microsemi SmartFusion2 - Alternative ARM-based SoC with FPGA capabilities.
4. Altera Cyclone V SoC - Comparable in FPGA features and ARM integration.
Always verify specific requirements like I/O, memory, and performance for your application.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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