XC7Z045-1FFG676I

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XC7Z045-1FFG676I

IC SOC CORTEX-A9 667MHZ 676FCBGA

  • Fabricant
  • Mfr. Partie #XC7Z045-1FFG676I
  • Paquet FCBGA-676
  • Fiche de données
  • En stock3438

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Spécifications

Package Tray
Series Zynq®-7000
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAMSize 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
PrimaryAttributes Kintex™-7 FPGA, 350K Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BBGA, FCBGA

Vue d'ensemble

Description

The XC7Z045-1FFG676I is a high-performance system-on-chip (SoC) from Xilinx's Zynq-7000 series, integrating a dual-core ARM Cortex-A9 processor with 28nm programmable logic. Designed for embedded applications, it features 1GB of DDR3 memory support and offers a combination of high processing power with flexible FPGA capabilities.
Key specifications include a maximum clock frequency of 1GHz, 85,000 logic cells, and multiple I/O options, making it suitable for tasks that require real-time processing and custom hardware acceleration. The device supports various communication interfaces, such as Ethernet, USB, and SPI, facilitating versatile connectivity in industrial, automotive, and consumer applications.
The Zynq-7000 series is renowned for its ability to handle complex algorithms and real-time data processing, making the XC7Z045-1FFG676I an ideal choice for applications like robotics, video processing, and machine learning. Its combination of hard and soft programmable resources allows developers to optimize performance while maintaining flexibility in design.

Features

The XC7Z045-1FFG676I is a member of the Xilinx Zynq-7000 series, integrating a dual-core ARM Cortex-A9 processor with FPGA capabilities. Key features include:
1. Processing System: Dual ARM Cortex-A9 cores, up to 866 MHz, supporting multiple operating systems.
2. FPGA Fabric: 85,000 logic cells, offering extensive programmable logic for custom applications.
3. Memory Interfaces: Supports DDR3, DDR3L, and LPDDR2 memory interfaces with a total of 1,866 MT/s data rates.
4. I/O Capability: 76 user I/Os with various signaling standards, including GPIO, SPI, I2C, UART, and others.
5. Connectivity: Integrated Ethernet, USB 2.0, and support for CAN and JTAG interfaces.
6. Power Management: Low power consumption, with dynamic voltage and frequency scaling.
7. Development Tools: Compatible with Xilinx Vivado Design Suite for design and debugging.
This combination of processing and programmable logic makes the XC7Z045-1FFG676I suitable for a wide range of applications, including embedded systems, industrial control, and communication systems.

Package

The XC7Z045-1FFG676I is packaged in a Fine Pitch Ball Grid Array (FBGA) with 676 balls. This compact and efficient package type is designed for high-performance applications, providing good thermal and electrical characteristics.

Pinout

The XC7Z045-1FFG676I is part of the Xilinx Zynq-7000 series and features a pin count of 676. This device combines a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic, providing both processing and programmable hardware capabilities.
The pins serve various functions, including:
1. Power Supply Pins: For powering the device.
2. Ground Pins: For circuit grounding.
3. I/O Pins: Configurable as general-purpose input/output for interfacing with other devices.
4. High-Speed Transceivers: For high-speed serial communication.
5. Configuration Pins: For device programming and configuration.
6. Clock Pins: For inputting clock signals.
7. Debug and JTAG Pins: For programming and debugging.
Overall, the XC7Z045-1FFG676I is designed for applications requiring both processing power and custom hardware acceleration.

Manufacturer

The XC7Z045-1FFG676I is manufactured by Xilinx, Inc., a company known for its development of programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-chip (SoC) solutions. Xilinx, founded in 1984, is a leader in the semiconductor industry, particularly in the areas of reconfigurable computing and embedded systems. The XC7Z045-1FFG676I is part of the Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor with Xilinx's FPGA fabric, making it suitable for a wide range of applications, including automotive, industrial, consumer electronics, and telecommunications. Xilinx was acquired by AMD in 2020, further expanding its capabilities in the computing and semiconductor sectors.

Application

The XC7Z045-1FFG676I is a Zynq-7000 series SoC, commonly used in applications such as embedded vision systems, industrial automation, automotive, wireless communication, robotics, and medical devices. Its combination of ARM Cortex-A9 processors and programmable logic makes it ideal for tasks requiring high performance, real-time processing, and flexibility.

Equivalent

The XC7Z045-1FFG676I is a Zynq-7000 series SoC from Xilinx. Equivalent products include the XC7Z045-1FFG676C, XC7Z045-1FFG484, and other Zynq-7000 parts with similar specifications. Additionally, alternatives from other manufacturers may include SoCs like Intel's Cyclone V or Microsemi's SmartFusion2, but ensure to verify compatibility based on specific application requirements.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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