XC7Z035-2FFG676I

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XC7Z035-2FFG676I

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Fabricant
  • Mfr. Partie #XC7Z035-2FFG676I
  • Paquet FCBGA-676
  • Fiche de données
  • En stock5977

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Spécifications

Package Tray
Series Zynq®-7000
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAMSize 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
PrimaryAttributes Kintex™-7 FPGA, 275K Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BBGA, FCBGA

Vue d'ensemble

Description

The XC7Z035-2FFG676I is a versatile System on Chip (SoC) from Xilinx's Zynq-7000 series, combining a dual-core ARM Cortex-A9 processor with programmable logic. It features 35,000 logic cells, making it suitable for a variety of applications including embedded systems, automotive, and industrial control.
Key specifications include:
- Architecture: Dual-core ARM Cortex-A9 for high-performance processing.
- FPGA Fabric: Configurable logic blocks for custom hardware acceleration.
- I/O: 76 I/O pins, supporting various interfaces like SPI, I2C, and UART.
- Memory: Supports external memory interfaces, enhancing flexibility.
- Power: Designed for low power consumption, ideal for portable applications.
The XC7Z035 is favored for applications that require a balance of software programmability and hardware performance, enabling developers to create complex solutions efficiently. Its integration of a processor and FPGA allows for concurrent processing and rapid prototyping.

Features

The XC7Z035-2FFG676I is a member of the Xilinx Zynq-7000 series, combining a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA fabric. Key features include:
- Dual-core ARM Cortex-A9: Operates at up to 1 GHz, supporting advanced processing tasks.
- FPGA Fabric: 35,000 logic cells offering high flexibility for custom hardware accelerations.
- Memory Interfaces: Supports DDR3/DDR3L memory with a maximum of 1 GB.
- I/O Capabilities: 76 programmable I/O pins, including support for various communication interfaces (UART, SPI, I2C, etc.).
- Performance: Capable of high-performance computing with a DSP slice count of 90, enabling efficient signal processing.
- Connectivity: Integrated Gigabit Ethernet and USB 2.0 interfaces for robust connectivity options.
- Package: Available in a 676-ball FFG package.
This SoC is ideal for embedded applications requiring high processing power combined with programmable logic, such as in industrial automation, automotive, and telecommunications.

Package

The XC7Z035-2FFG676I is packaged in a FFG (Fine Pitch Flip Chip) format, specifically a 676-ball FFG package. This packaging type is designed for high-density applications, providing a compact footprint while allowing for improved thermal and electrical performance.

Pinout

The XC7Z035-2FFG676I is a Zynq-7000 series SoC from Xilinx, featuring a total of 676 pins. It integrates a dual-core ARM Cortex-A9 processor with FPGA capabilities. The pin functions include general-purpose I/O (GPIO), power supply pins, ground pins, configuration pins, and various dedicated interfaces such as SPI, I2C, UART, and JTAG.
The device supports multiple functionalities such as digital signal processing, embedded processing, and high-speed communication, making it suitable for applications in automotive, industrial, and consumer electronics. The package type is FFG (Fine Pitch Ball Grid Array), which facilitates high-density connections and efficient thermal management.

Manufacturer

The XC7Z035-2FFG676I is manufactured by Xilinx, Inc., a semiconductor company known for its development of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and CPLDs (Complex Programmable Logic Devices). Xilinx specializes in advanced digital circuits and offers solutions that are widely used in various applications, including telecommunications, automotive, aerospace, industrial automation, and more. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its technological capabilities and market reach. The company is recognized for its innovation in programmable solutions, enabling designers to create customizable hardware solutions tailored to specific needs.

Application

The XC7Z035-2FFG676I is a Zynq-7000 series system-on-chip (SoC) from Xilinx, widely used in applications such as digital signal processing, embedded systems, automotive control, industrial automation, and medical devices. Its combination of ARM Cortex-A9 processors and programmable logic allows for efficient handling of complex algorithms, real-time processing, and hardware acceleration, making it suitable for robotics, communications, and IoT solutions.

Equivalent

The XC7Z035-2FFG676I is part of the Xilinx Zynq-7000 series. Equivalent products include the XC7Z030-2FFG676I, XC7Z035-2FFG676C, and XC7Z045-2FFG676I. For similar functionality in other series, consider the Intel (Altera) Cyclone V SoC or Lattice ECP5 SoC. Always check specific requirements like speed, package, and features when selecting an equivalent.

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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