XC7Z030-L2FFG676I

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XC7Z030-L2FFG676I

IC SOC CORTEX-A9 800MHZ 676FCBGA

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  • Mfr. Partie #XC7Z030-L2FFG676I
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  • En stock2920

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Spécifications

Series Zynq®-7000
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Base Product Number XC7Z030

Vue d'ensemble

Description

The XC7Z030-L2FFG676I is a model from Xilinx's Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor with Xilinx's 7-series FPGA fabric, enabling system-on-chip (SoC) designs. This specific variant features 30,000 programmable logic cells, making it suitable for various applications, including embedded systems, automotive, and industrial automation.
Key specifications include a 1 GHz processing speed, support for advanced connectivity interfaces, and multiple I/O options. The chip is housed in a 676-ball FFG package and is designed for low power consumption while maintaining high performance. The architecture allows for flexible hardware and software integration, enabling developers to leverage both the processing power of the ARM cores and the configurability of the FPGA.
This SoC is ideal for applications requiring real-time processing, signal processing, and complex algorithm implementations, making it a popular choice in the development of innovative solutions across various industries.

Features

The XC7Z030-L2FFG676I is a member of the Xilinx Zynq-7000 series, combining a dual-core ARM Cortex-A9 processor with programmable logic. Key features include:
1. Processing System: Dual-core ARM Cortex-A9 running up to 1 GHz.
2. FPGA Logic: 30,000 logic cells with high-speed configurable logic blocks.
3. Memory: Supports DDR3, DDR2, and LPDDR2 memory interfaces.
4. I/O Capabilities: 54 general-purpose I/O (GPIO) pins and various communication interfaces, including UART, SPI, I2C, and CAN.
5. Performance: Up to 1.0 TFLOPS (theoretical peak performance).
6. Power: Low power consumption, typically around 5W.
7. Package: Available in a 676-ball FFG package.
8. Connectivity: Integrated Ethernet MAC and USB 2.0 support.
This device is ideal for applications in embedded systems, automotive, industrial, and consumer electronics.

Package

The XC7Z030-L2FFG676I is packaged in a FFG (Fine Pitch Ball Grid Array) format with 676 balls. This package type provides a compact footprint and enables efficient thermal management and signal integrity for high-performance applications in the Zynq-7000 series FPGA.

Pinout

The XC7Z030-L2FFG676I is a member of the Xilinx Zynq-7000 series, specifically designed with a total of 676 pins. This device combines a dual-core ARM Cortex-A9 processor with Xilinx 7 series FPGA logic, providing both programmable logic and processing capabilities.
The pin functions include general-purpose I/O (GPIO), dedicated power and ground pins, configuration pins, and various interfaces such as I2C, SPI, UART, and more. The device also supports high-speed connectivity through interfaces like USB, Ethernet, and PCIe, depending on the specific configuration and design requirements.
The package type is FFG (Fine Pitch Ball Grid Array), providing a compact footprint suitable for various applications in embedded systems, communications, automotive, and industrial control.

Manufacturer

The XC7Z030-L2FFG676I is manufactured by Xilinx, Inc., which is a leading semiconductor company. Xilinx specializes in programmable logic devices, specifically FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and other related technologies. The XC7Z030-L2FFG676I is part of the Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor with programmable logic, allowing for versatile applications in embedded systems, automotive, industrial automation, and telecommunications. Xilinx is known for its innovation in reconfigurable computing and is a key player in the field of digital design and processing solutions. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in the semiconductor industry.

Application

The XC7Z030-L2FFG676I is a Zynq-7000 SoC (System on Chip) that combines a dual-core ARM Cortex-A9 processor with programmable logic. Its application areas include embedded systems, industrial automation, automotive systems, medical devices, IoT solutions, and digital signal processing. It is particularly suited for applications requiring real-time processing, complex algorithms, and high-speed data processing due to its integration of both hardware and software capabilities.

Equivalent

The XC7Z030-L2FFG676I is a Zynq-7000 series SoC from Xilinx. Equivalent products include the XC7Z030-1FFG676I and XC7Z030-2FFG676I, which offer similar functionality but with different performance grades. Additionally, other Zynq-7000 models with varying logic resources and features, such as the XC7Z020 and XC7Z035, can be considered based on specific application requirements. Always verify compatibility and specifications for your particular use case.

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DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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