XC7Z030-2SBG485I

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XC7Z030-2SBG485I

IC SOC CORTEX-A9 800MHZ 485FCBGA

  • Fabricant
  • Mfr. Partie #XC7Z030-2SBG485I
  • Paquet FBGA-484
  • Fiche de données
  • En stock2153

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Spécifications

Package Tray
Series Zynq®-7000
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAMSize 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
PrimaryAttributes Kintex™-7 FPGA, 125K Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 484-FBGA, FCBGA

Vue d'ensemble

Description

The XC7Z030-2SBG485I is a member of the Xilinx Zynq-7000 series, combining a dual-core ARM Cortex-A9 processor with Xilinx 7-Series FPGA fabric. This SoC (System on Chip) integrates both hardware and software capabilities, allowing for flexible design in embedded applications.
Key features include:
- Processing System: Dual-core ARM Cortex-A9 running up to 1 GHz, supporting advanced operating systems like Linux.
- FPGA Fabric: 30,000 logic cells for custom hardware acceleration and real-time processing.
- Memory Interfaces: Supports DDR3/2 memory, providing high-bandwidth data access.
- Connectivity: Multiple I/O options, including GPIO, UART, SPI, and I2C, enabling diverse peripheral integration.
- Power Efficiency: Optimized for low power consumption, suitable for portable and embedded systems.
Ideal for applications in automotive, industrial automation, and telecommunications, the XC7Z030-2SBG485I offers a scalable platform for developers seeking high performance and flexibility.

Features

The XC7Z030-2SBG485I is a member of Xilinx's Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor with programmable logic. Key features include:
1. Processing System: Dual-core ARM Cortex-A9 up to 1 GHz, with NEON technology for advanced multimedia processing.
2. FPGA Fabric: 30,000 logic cells, with support for various I/O standards and high-speed interfaces.
3. Memory: Supports up to 1 GB of DDR3/DDR2 memory with integrated memory controllers.
4. Connectivity: Multiple high-speed interfaces, including USB, Ethernet (10/100/1000), and SPI.
5. Configurable I/O: 85 user-configurable I/O pins supporting LVTTL, LVCMOS, and other standards.
6. Power Management: Low-power operation ideal for battery-powered applications.
7. Development Support: Compatible with Vivado Design Suite for hardware and software development.
This device is widely used in applications such as embedded systems, automotive, and industrial automation due to its flexibility and processing power.

Package

The XC7Z030-2SBG485I is packaged in a 485-ball BGA (Ball Grid Array) configuration. This type of package is known for its compact size and effective thermal and electrical performance, making it suitable for high-density applications.

Pinout

The XC7Z030-2SBG485I is a part of the Xilinx Zynq-7000 series, specifically designed for SoC (System on Chip) applications. It has a pin count of 485 pins.
Functionally, it integrates a dual-core ARM Cortex-A9 processor along with Xilinx 7-series FPGA architecture. This combination allows for both software and hardware processing, enabling high-performance applications in fields such as automotive, industrial, and consumer electronics. The device supports various interfaces, including USB, UART, I2C, SPI, and GPIO, making it versatile for different connectivity needs. Additionally, it features programmable logic that can be customized for specific tasks, enhancing its utility in complex designs.
Overall, the XC7Z030-2SBG485I is suited for applications requiring both processing power and flexibility in hardware configuration.

Manufacturer

The manufacturer of the XC7Z030-2SBG485I is Xilinx, Inc., which is a subsidiary of AMD (Advanced Micro Devices). Xilinx is known for designing and manufacturing Field Programmable Gate Arrays (FPGAs), SoCs (System on Chips), and software development tools used in various applications, including telecommunications, automotive, industrial, aerospace, and consumer electronics. The XC7Z030-2SBG485I is part of the Zynq-7000 series, which combines a powerful ARM Cortex-A9 processor with FPGA fabric for high-performance, programmable applications. Xilinx focuses on providing solutions that enable developers to create customizable hardware and software systems, catering to a wide range of industries and applications.

Application

The XC7Z030-2SBG485I, part of the Xilinx Zynq-7000 series, is widely used in applications such as industrial automation, automotive systems, robotics, medical imaging, and telecommunications. Its integration of ARM Cortex-A9 processors with FPGA capabilities allows for high-performance computing, real-time processing, and customizable hardware acceleration in embedded systems, making it suitable for edge computing, smart manufacturing, and IoT devices.

Equivalent

The XC7Z030-2SBG485I chip, part of the Xilinx Zynq-7000 series, can be compared to other SoC products in the same family, such as the XC7Z010 or XC7Z020. For similar functionality, consider alternatives like Intel/Altera Cyclone V or Lattice ECP5 series. However, direct equivalents may not exist due to variations in architecture and features. Always verify specific requirements and compatibility in your application.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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