XC7Z030-2FFG676I

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XC7Z030-2FFG676I

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Fabricant
  • Mfr. Partie #XC7Z030-2FFG676I
  • Paquet 676-BGA
  • Fiche de données
  • En stock5265

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Spécifications

Package Tray
Series Zynq®-7000
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAMSize 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
PrimaryAttributes Kintex™-7 FPGA, 125K Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BBGA, FCBGA

Vue d'ensemble

Description

The XC7Z030-2FFG676I is a member of the Xilinx Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA fabric. This SoC (System on Chip) is designed for applications requiring high performance and flexibility, such as embedded systems, automotive, industrial control, and communications.
Key features of the XC7Z030-2FFG676I include:
- Processing System (PS): Dual ARM Cortex-A9 cores running up to 1 GHz, supporting multiple operating systems.
- Programmable Logic (PL): 30K logic cells, enabling custom hardware accelerators and signal processing.
- Memory Interfaces: Supports DDR3/2 RAM, providing high-speed data processing.
- I/O Flexibility: Rich set of I/O options, including USB, Ethernet, and GPIO, enabling versatile connectivity.
- Power Efficiency: Designed for low power consumption, making it suitable for battery-operated devices.
This integration of software and hardware allows developers to create sophisticated applications with optimized performance and reduced latency.

Features

The XC7Z030-2FFG676I is a member of the Xilinx Zynq-7000 family, combining a dual-core ARM Cortex-A9 processor with programmable logic (FPGA). Key features include:
- Processor: Dual-core ARM Cortex-A9 MPCore, up to 1 GHz.
- FPGA Fabric: 30,000 logic cells, offering flexibility for custom hardware acceleration.
- Memory: Supports DDR3/DDR2 memory interfaces, with up to 1 GB of external memory.
- I/O: 76 user I/O pins, supporting various protocols including I2C, SPI, UART, and GPIO.
- Connectivity: Integrated high-speed interfaces such as Gigabit Ethernet and USB 2.0.
- Power: Low power consumption with multiple power management options.
- Package: 676-ball FFG package, providing a compact form factor.
This device is suitable for applications in embedded systems, industrial automation, automotive systems, and more, thanks to its combination of processing power and customizable logic.

Package

The XC7Z030-2FFG676I is packaged in a FFG (Fine Pitch Ball Grid Array) format with 676 balls. This type of package provides efficient thermal management and a compact footprint, suitable for high-density applications.

Pinout

The XC7Z030-2FFG676I is a Zynq-7000 series SoC (System on Chip) from Xilinx. It has a pin count of 676 pins in a FFG package. The device features a combination of a dual-core ARM Cortex-A9 processor and programmable logic, allowing for versatile applications in embedded systems.
Key functions of the pins include:
- Power Supply Pins: For providing power to the chip.
- Ground Pins: For grounding the device.
- I/O Pins: Configurable as input or output for interfacing with external components.
- Clock Pins: For supplying clock signals.
- Configuration Pins: Used for loading the configuration data into the programmable logic.
- Serial Communication Pins: Support protocols like UART, SPI, and I2C for communication with other devices.
- JTAG Pins: For debugging and programming the device.
This SoC is commonly used in applications such as automotive, telecommunications, and industrial control.

Manufacturer

The XC7Z030-2FFG676I is manufactured by Xilinx, Inc., a company that specializes in the design and production of programmable logic devices, including FPGAs (Field Programmable Gate Arrays), SoCs (System on Chips), and other related technologies. Founded in 1984, Xilinx is known for its innovation in the semiconductor industry, particularly for its contributions to reconfigurable computing. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), expanding its portfolio to include advanced processing solutions. Xilinx's products are widely used in various applications, including telecommunications, automotive, industrial, and aerospace sectors, enabling customers to implement custom hardware solutions that can be updated and modified after manufacturing.

Application

The XC7Z030-2FFG676I is a Zynq-7000 SoC used in various application areas, including embedded systems, industrial automation, automotive control systems, robotics, telecommunications, and medical devices. Its combination of ARM processing and programmable logic enables high-performance computing, real-time processing, and flexible design, making it ideal for applications requiring both software and hardware integration.

Equivalent

The XC7Z030-2FFG676I is a part of the Xilinx Zynq-7000 series. Equivalent products include the XC7Z035-2FFG676I and XC7Z045-2FFG676I, offering more resources and features while maintaining compatibility. For similar functionality, consider the Intel (Altera) Cyclone V SoC series. Always verify specific requirements for compatibility and performance before substitution.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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