XC7Z030-2FBG676I

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XC7Z030-2FBG676I

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Fabricant
  • Mfr. Partie #XC7Z030-2FBG676I
  • Paquet BGA-676
  • Fiche de données
  • En stock7042

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Spécifications

Package Tray
Series Zynq®-7000
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAMSize 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
PrimaryAttributes Kintex™-7 FPGA, 125K Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BBGA, FCBGA

Vue d'ensemble

Description

The XC7Z030-2FBG676I is a System on Chip (SoC) from Xilinx's Zynq-7000 series, integrating a dual-core ARM Cortex-A9 processor with Xilinx's 7-series FPGA fabric. This combination allows for a high degree of flexibility, enabling software and hardware co-design.
Key features include:
- Dual ARM Cortex-A9 cores running up to 1 GHz.
- 30,000 logic cells, providing ample FPGA resources for custom hardware acceleration.
- Integrated peripherals such as USB, Ethernet, and SPI.
- A 676-ball FBG package, suitable for various applications requiring compact design.
The XC7Z030 is ideal for applications in automotive, industrial control, and telecommunications, where both processing power and programmability are essential. This device supports various development tools, including the Xilinx Vivado Design Suite, allowing developers to efficiently design and implement both hardware and software components together.

Features

The XC7Z030-2FBG676I is a Zynq-7000 series System on Chip (SoC) from Xilinx, featuring a combination of a dual-core ARM Cortex-A9 processor and FPGA fabric. Key features include:
1. Architecture: Dual ARM Cortex-A9 cores, up to 1 GHz.
2. FPGA Fabric: 30K logic cells, providing flexibility for hardware customization.
3. Memory: 512 MB DDR3 memory controller, supporting various memory types.
4. I/O: 76 programmable I/O pins with various standard interfaces, including GPIO, I2C, SPI, UART, and more.
5. High-Speed Connectivity: Supports PCIe, USB 2.0/3.0, Ethernet, and Serial RapidIO.
6. Integrated Components: Includes various peripherals such as timers, PWM, and ADC.
7. Power Consumption: Optimized for low power, suitable for portable applications.
8. Development Tools: Compatible with Xilinx Vivado Design Suite for hardware design and software development.
This combination makes it suitable for a wide range of applications in embedded systems, automotive, industrial, and communications.

Package

The XC7Z030-2FBG676I is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 676-ball configuration. This package type provides efficient thermal performance and space-saving advantages for the Zynq-7000 series FPGA.

Pinout

The XC7Z030-2FBG676I is a member of the Xilinx Zynq-7000 series of System on Chips (SoCs). It has a total pin count of 676 pins.
The device features a dual-core ARM Cortex-A9 processor along with programmable logic. The pins serve various functions, including:
- Power Supply: Pins for VCC and GND.
- I/O Interfaces: General-purpose I/O (GPIO) pins for interfacing with other components.
- Configuration: Pins for JTAG and other configuration methods.
- Memory Interfaces: Dedicated pins for connecting to DDR memory and other peripherals.
- Clock Input: Pins for clock signals.
- High-Speed Transceivers: Pins used for serial communication interfaces like USB, Ethernet, and more.
The XC7Z030-2FBG676I is utilized in applications ranging from industrial automation to consumer electronics, leveraging both its processing and FPGA capabilities.

Manufacturer

The manufacturer of the XC7Z030-2FBG676I is Xilinx, Inc., which is now a part of Advanced Micro Devices, Inc. (AMD) following its acquisition in 2020. Xilinx is known for designing and producing programmable logic devices, including Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and adaptive system-on-chip (SoC) solutions. The XC7Z030-2FBG676I is part of the Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor with Xilinx’s programmable logic, enabling diverse applications in embedded systems, automotive, and industrial markets. Xilinx is recognized for its innovation in digital circuit design and is a key player in the semiconductor industry.

Application

The XC7Z030-2FBG676I is a Zynq-7000 series SoC from Xilinx, commonly used in embedded systems. Its application areas include automotive systems, industrial automation, robotics, medical devices, and consumer electronics. It combines programmable logic with ARM Cortex-A9 processing, making it suitable for high-performance computing, real-time processing, and hardware acceleration tasks, including image processing, machine learning, and signal processing.

Equivalent

The XC7Z030-2FBG676I is part of the Xilinx Zynq-7000 series. Equivalent products include:
1. XC7Z020-1FBG676I - Slightly lower performance.
2. XC7Z035-1FBG676I - Higher performance.
3. XC7Z045-2FBG676I - More resources, higher performance.
For similar functionality, consider the Intel (Altera) Cyclone V SoC or Microchip (Atmel) SAM E70 series, but these may require design adaptation. Always check specific requirements and compatibility.

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FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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