XC7Z030-1FBG484I

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XC7Z030-1FBG484I

IC SOC CORTEX-A9 667MHZ 484FCBGA

  • Fabricant
  • Mfr. Partie #XC7Z030-1FBG484I
  • Paquet
  • Fiche de données
  • En stock9965

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Spécifications

Series Zynq®-7000
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 484-BBGA, FCBGA
Supplier Device Package 484-FCBGA (23x23)
Base Product Number XC7Z030

Vue d'ensemble

Description

The XC7Z030-1FBG484I is a part of the Xilinx Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic fabric. This SoC (System on Chip) is designed for applications requiring high-performance processing and real-time hardware acceleration.
Key features include:
- Processing System: Dual ARM Cortex-A9 processors, capable of running Linux or other operating systems.
- FPGA Fabric: 30,000 logic cells for custom hardware acceleration and processing.
- Memory Interfaces: Support for DDR3 memory, enabling high-speed data access.
- I/O Options: A variety of configurable I/O options, including high-speed serial transceivers and GPIO.
- Power Efficiency: Optimized for low power consumption, making it suitable for embedded applications.
The XC7Z030-1FBG484I is widely used in applications such as automotive, industrial automation, medical devices, and communications due to its flexibility and performance. It is housed in a 484-ball FBG (Fine Pitch Ball Grid Array) package.

Features

The XC7Z030-1FBG484I is a Zynq-7000 Series System on Chip (SoC) from Xilinx, combining a dual-core ARM Cortex-A9 processor with FPGA programmable logic. Key features include:
1. Processing System: Dual-core ARM Cortex-A9 running up to 1 GHz, with support for Linux and other operating systems.
2. FPGA Fabric: 30,000 logic cells, allowing for custom hardware acceleration and parallel processing.
3. Memory Interfaces: Integrated support for DDR3/DDR2 memory, enabling high-speed data access.
4. I/O Ports: 84 multi-purpose I/O pins, supporting various interfaces like SPI, I2C, UART, and GPIO.
5. Performance: Capable of handling complex algorithms and data-intensive applications, ideal for embedded systems.
6. Power Management: Designed for low power consumption, suitable for mobile and battery-powered applications.
7. Development Ecosystem: Supported by Xilinx Vivado Design Suite and SDK for development and debugging.
This SoC is widely used in automotive, industrial, and communication applications.

Package

The XC7Z030-1FBG484I is packaged in a FBG (Fine Pitch Ball Grid Array) format, specifically a 484-ball BGA package. This package type provides a compact design with a high pin count, suitable for high-performance applications in Zynq-7000 SoCs.

Pinout

The XC7Z030-1FBG484I is a member of the Xilinx Zynq-7000 series, specifically designed for embedded applications. This device features a total of 484 pins.
It integrates a dual-core ARM Cortex-A9 processor alongside FPGA fabric, enabling both processing and programmable logic on a single chip. The pins are used for various functions, including:
- Power supply (VCC and GND)
- General-purpose I/O (GPIO)
- High-speed serial interfaces (e.g., MIO for ARM Cortex, and dedicated FPGA I/O)
- Configuration and programming interfaces (JTAG)
- Clock inputs
- Dedicated programming pins for configuration
The pin configuration supports extensive connectivity options for peripherals, memory, and other devices, making it suitable for a wide range of applications in industrial, automotive, and consumer markets.

Manufacturer

The XC7Z030-1FBG484I is manufactured by Xilinx, Inc., which is a leading company in the field of programmable logic devices and FPGAs (Field-Programmable Gate Arrays). Founded in 1984, Xilinx specializes in the design and production of integrated circuits that can be configured by customers after manufacturing. Their products are widely used in various applications, including telecommunications, automotive, industrial automation, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), a major player in the semiconductor industry, further enhancing its capabilities and market reach. Xilinx is known for its innovative technology and solutions that enable designers to create high-performance and adaptable systems.

Application

The XC7Z030-1FBG484I is a Zynq-7000 SoC that combines a dual-core ARM Cortex-A9 processor with FPGA fabric. Its application areas include embedded systems, industrial automation, automotive control, medical devices, image processing, video analytics, communications, and IoT solutions. Its versatility makes it suitable for both real-time processing and complex algorithms in various fields.

Equivalent

The XC7Z030-1FBG484I chip, part of the Xilinx Zynq-7000 series, has several equivalent products, including the XC7Z030-1FFG676I, XC7Z020-1FBG484I, and XC7Z035-1FBG484I. Compatibility may vary based on specific application requirements, such as I/O count, performance, and power consumption. Always verify datasheets for detailed specifications before substitution.

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FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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