XC7S75-2FGGA676C

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XC7S75-2FGGA676C

IC FPGA 400 I/O 676FPBGA

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  • Mfr. Partie #XC7S75-2FGGA676C
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  • En stock3335

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Spécifications

Series Spartan®-7
Part Status Active
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 76800
Total RAM Bits 4331520
Number of I/O 400
Voltage - Supply 0.95V ~ 1.05V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FPBGA (27x27)
Base Product Number XC7S75
Number of LABs/CLBs 6000

Vue d'ensemble

Description

The XC7S75-2FGGA676C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-7 series, designed for low-power, cost-sensitive applications. It features 75,000 logic cells, offering a balance between performance and resource efficiency. The device operates at a maximum clock frequency of 400 MHz and includes various I/O options, supporting multiple interfaces like UART, SPI, and I2C.
The FPGA comes in a 676-ball Grid Array (FGGA) package, facilitating easy integration into compact designs. It supports multiple voltage levels, enhancing flexibility for various applications, including automotive, industrial, and consumer electronics.
Key features include programmable logic, digital signal processing (DSP) capabilities, and embedded memory blocks. The XC7S75 is supported by Xilinx’s Vivado Design Suite, which provides tools for efficient design, simulation, and implementation. This makes it suitable for both prototyping and production environments, allowing developers to create custom hardware solutions tailored to specific requirements.

Features

The XC7S75-2FGGA676C is a member of the Xilinx Spartan-7 FPGA family, designed for low power and cost-sensitive applications. Key features include:
- Logic Cells: 75,000 logic cells for implementing various designs.
- I/O Pins: Up to 120 I/O pins with support for multiple voltage levels.
- Block RAM: 4.9 Mb of block RAM for data storage and buffering.
- DSP Slices: 30 DSP slices for efficient digital signal processing.
- Embedded Cores: Support for various embedded cores, including USB and PCIe.
- Performance: Operates at speeds up to 450 MHz with a maximum power consumption of around 1.8W.
- Configuration Options: Supports multiple configuration options, including JTAG and SPI.
- Development Tools: Compatible with Xilinx Vivado Design Suite for programming and simulation.
- Form Factor: Available in a compact 676-ball FGG package.
This FPGA is ideal for applications in automotive, consumer electronics, and industrial automation, where flexibility and efficiency are essential.

Package

The XC7S75-2FGGA676C is packaged in a Fine Pitch Ball Grid Array (FBGA) format with 676 balls. This package type is designed for high-density applications, providing efficient thermal management and electrical performance.

Pinout

The XC7S75-2FGGA676C is a Field-Programmable Gate Array (FPGA) from the Xilinx 7 Series, specifically the Spartan-7 family. It comes in a package with 676 pins.
The pin functions can be categorized as follows:
1. Logic I/O Pins: Used for general-purpose input/output operations.
2. Dedicated Clock Pins: For clock signal inputs and outputs, essential for timing operations.
3. Configuration Pins: For programming the FPGA and loading the bitstream.
4. Power/Ground Pins: Provide power and ground connections necessary for the device operation.
5. JTAG Pins: For boundary scan and debugging purposes.
The XC7S75-2FGGA676C supports various I/O standards and protocols, allowing it to interface with other devices effectively. It is designed for applications requiring low power consumption and flexibility in digital logic design.

Manufacturer

The XC7S75-2FGGA676C is manufactured by Xilinx, Inc., a prominent semiconductor company known for its field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-chip (SoC) solutions. Founded in 1984 and headquartered in San Jose, California, Xilinx specializes in adaptive and intelligent computing technologies, focusing on applications in various industries, including telecommunications, automotive, aerospace, and data centers. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its capabilities in high-performance computing and programmable solutions.

Application

The XC7S75-2FGGA676C is a Spartan-7 FPGA from Xilinx, commonly used in applications such as automotive, industrial automation, consumer electronics, and communication systems. Its low power consumption and cost-effectiveness make it suitable for IoT devices, video processing, and embedded systems. Additionally, it is employed in machine learning, signal processing, and custom hardware acceleration tasks.

Equivalent

The XC7S75-2FGGA676C is a Xilinx Spartan-7 FPGA. Equivalent products include:
1. Intel (Altera) Cyclone 10 LP series (e.g., EP10K20).
2. Lattice ECP5 series.
3. Microchip (Microsemi) SmartFusion2.
These alternatives vary in specifications, so it's essential to compare performance, I/O count, and power consumption for specific applications.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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