XC7K325T-1FBG900I

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XC7K325T-1FBG900I

IC FPGA 500 I/O 900FCBGA

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  • Mfr. Partie #XC7K325T-1FBG900I
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Spécifications

Series Kintex®-7
Part Status Active
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 326080
Total RAM Bits 16404480
Number of I/O 500
Voltage - Supply 0.97V ~ 1.03V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Base Product Number XC7K325
Number of LABs/CLBs 25475

Vue d'ensemble

Description

The XC7K325T-1FBG900I is a Field-Programmable Gate Array (FPGA) from Xilinx's Kintex-7 series. Designed for high-performance applications, it features a maximum of 325,000 logic cells and supports various connectivity options, including multiple high-speed transceivers and general-purpose I/O. The "1" in the part number denotes the speed grade, indicating its performance characteristics, while "FBG" refers to the Fine Pitch Ball Grid Array package type, which ensures efficient thermal management and compact design.
With a maximum clock frequency of around 1 GHz, the XC7K325T is suitable for applications in telecommunications, automotive, aerospace, and industrial control. It supports various digital signal processing functions and can be efficiently programmed using Xilinx's Vivado Design Suite, offering a rich development environment for hardware and software integration. The XC7K325T-1FBG900I is ideal for scenarios where flexibility, performance, and rapid prototyping are critical.

Features

The XC7K325T-1FBG900I is a member of the Xilinx Kintex-7 FPGA family, designed for high-performance applications. Key features include:
- Logic Cells: 325,000 system logic cells, enabling complex designs.
- DSP Slices: 840 DSP slices for efficient processing of digital signal processing tasks.
- Block RAM: 20 Mb of Block RAM for high-speed memory storage.
- I/O Pins: Up to 540 user I/O pins, supporting various interfaces.
- Transceivers: Up to 12 high-speed serial transceivers, facilitating data rates up to 6.6 Gbps.
- Power Efficiency: Optimized for low power consumption, making it suitable for battery-operated devices.
- Temperature Range: Industrial-grade operation from -40°C to 100°C.
- Programmable Logic: Flexibility to implement custom logic functions.
- Development Support: Compatible with Xilinx design tools, including Vivado for design and programming.
This FPGA is ideal for applications in telecommunications, aerospace, automotive, and industrial automation.

Package

The XC7K325T-1FBG900I is packaged in a Fine Pitch Ball Grid Array (FBGA) format with 900 balls. This package type is designed for high-density applications, providing excellent thermal performance and signal integrity.

Pinout

The XC7K325T-1FBG900I is a member of the Xilinx 7 Series FPGAs, specifically the Kintex-7 family. It has a total of 900 pins.
The primary functions of these pins include:
1. I/O Pins: These can be configured for various input/output standards (e.g., LVDS, LVCMOS) to interface with other devices.
2. Power Pins: For supplying core and I/O power.
3. Configuration Pins: Used to configure the FPGA during startup (e.g., JTAG, SPI).
4. Clock Pins: For receiving external clock signals.
5. Dedicated High-Speed Serial Transceiver Pins: For high-speed communication protocols.
The XC7K325T-1FBG900I is suitable for a wide range of applications due to its flexibility and performance capabilities, including digital signal processing, communications, and other complex logic tasks.

Manufacturer

The XC7K325T-1FBG900I is manufactured by Xilinx, Inc., which is a company known for its development of programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-chip (SoC) products. Founded in 1984 and headquartered in San Jose, California, Xilinx has been a leader in the semiconductor industry, particularly in providing solutions for applications in telecommunications, automotive, industrial, and consumer electronics. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its capabilities in the high-performance computing market. Xilinx is recognized for its innovation in reconfigurable computing, enabling designers to implement custom hardware solutions efficiently.

Application

The XC7K325T-1FBG900I is a Kintex-7 FPGA used in various application areas, including:
1. Telecommunications: For high-speed data processing and signal processing.
2. Aerospace and Defense: In radar and imaging systems.
3. Medical Devices: For advanced imaging and diagnostics.
4. Industrial Automation: In control systems and robotics.
5. Broadcast and Pro Audio: For media processing.
6. Automotive: In advanced driver-assistance systems (ADAS).
Its flexibility and performance make it suitable for diverse applications requiring high computational power.

Equivalent

The XC7K325T-1FBG900I is a Xilinx Kintex-7 FPGA. Equivalent products include the following:
1. XC7K325T-1FBG676I - Similar specifications but in a different package.
2. Lattice ECP5 - Another mid-range FPGA option.
3. Intel Arria 10 - Comparable performance in a different architecture.
4. Xilinx Artix-7 - Slightly lower performance but similar family.
Ensure to check specific requirements like I/O count, speed grade, and power consumption before selecting an equivalent.

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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