XC7A75T-2FGG676C

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XC7A75T-2FGG676C

IC FPGA 300 I/O 676FBGA

  • Fabricant
  • Mfr. Partie #XC7A75T-2FGG676C
  • Paquet BGA676
  • Fiche de données
  • En stock4760

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Spécifications

Package Tray
Series Artix-7
ProductStatus Active
NumberofLABs/CLBs 5900
NumberofLogicElements/Cells 75520
TotalRAMBits 3870720
NumberofI/O 300
Voltage-Supply 0.95V ~ 1.05V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 676-BGA

Vue d'ensemble

Description

The XC7A75T-2FGG676C is a field-programmable gate array (FPGA) from Xilinx’s Artix-7 family, designed for low-power, high-performance applications. It features 75,000 logic cells and is optimized for cost-sensitive and power-efficient designs, making it ideal for embedded systems, signal processing, and data communication applications.
Key specifications include:
- Package Type: FGG676, a ball grid array (BGA) package with 676 balls.
- Logic Resources: Contains a mix of LUTs, flip-flops, and DSP slices for versatile design capabilities.
- I/O Pins: Up to 120 I/O pins, supporting various voltage standards.
- Performance: Supports a maximum clock frequency of up to 450 MHz.
- Memory: Integrated block RAM and configurable logic for efficient data handling.
The XC7A75T-2FGG676C is commonly used in applications like automotive systems, industrial automation, and consumer electronics, providing flexibility and scalability for custom hardware development.

Features

The XC7A75T-2FGG676C is a member of the Xilinx Artix-7 FPGA family. Key features include:
1. Logic Cells: Approximately 75,000 logic cells, enabling efficient handling of complex algorithms.
2. DSP Slices: 90 DSP slices for high-performance signal processing tasks.
3. Block RAM: 4.9 Mb of integrated block RAM for efficient data storage and retrieval.
4. I/O Ports: 76 user I/O pins with support for various I/O standards, including LVDS and LVCMOS, providing flexibility in interfacing.
5. Maximum Clock Frequency: Up to 450 MHz, supporting high-speed applications.
6. Transceivers: Up to 6 GTP transceivers for high-speed serial communication.
7. Power Efficiency: Low power consumption, making it suitable for battery-operated devices.
8. Development Tools: Compatible with Xilinx Vivado Design Suite for streamlined design and development.
Overall, the XC7A75T-2FGG676C combines performance, flexibility, and efficiency, making it ideal for a wide range of applications, including communications, automotive, and industrial control.

Package

The XC7A75T-2FGG676C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 676-ball configuration. This type of packaging provides a compact design with a high pin count, suitable for applications requiring efficient space utilization and thermal performance.

Pinout

The XC7A75T-2FGG676C is a member of the Xilinx Artix-7 FPGA family. It features a pin count of 676 pins in a Fine Pitch Ball Grid Array (FBGA) package.
The primary functions of the pins include:
- I/O Pins: Configurable for various input/output operations, including digital logic, high-speed interfaces, and communication protocols (e.g., SPI, I2C, UART).
- Power Pins: Supply power to the FPGA, including VCC and ground (GND).
- Clock Pins: Dedicated pins for clock signals, supporting global and local clock distribution.
- Configuration Pins: Used for programming the FPGA and initializing its functions during power-up.
- JTAG Pins: Support boundary scan and in-system programming for debugging and configuration.
Overall, the XC7A75T-2FGG676C is designed for a broad range of applications, including signal processing, communications, and embedded systems.

Manufacturer

The XC7A75T-2FGG676C is manufactured by Xilinx, Inc., a prominent technology company specializing in the design and production of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and CPLDs (Complex Programmable Logic Devices). Founded in 1984, Xilinx is known for its innovative solutions in digital design and is a leader in the semiconductor industry. The company primarily serves various sectors, including telecommunications, automotive, aerospace, industrial, and consumer electronics, offering versatile and customizable hardware solutions that cater to complex computing needs. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), expanding its reach and resources in the semiconductor space.

Application

The XC7A75T-2FGG676C, a member of the Xilinx Artix-7 FPGA family, is used in various applications, including digital signal processing, embedded systems, communications, automotive systems, and industrial control. Its features support high-speed data processing, low power consumption, and flexibility in design, making it suitable for applications like image processing, motor control, and network infrastructure.

Equivalent

The XC7A75T-2FGG676C is a Xilinx Artix-7 FPGA. Equivalent products include the Intel (Altera) Cyclone V GX series, Lattice ECP5 series, and Microsemi (now part of Microchip) SmartFusion2 FPGAs. For similar performance and features, look at the Xilinx Artix-7 variants like XC7A100T or XC7A50T, depending on specific application requirements.

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FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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