XC6SLX9-3FTG256C

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XC6SLX9-3FTG256C

IC FPGA 186 I/O 256FTBGA

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  • Mfr. Partie #XC6SLX9-3FTG256C
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Spécifications

Series Spartan®-6 LX
Part Status Active
Base Product Number XC6SLX9
DigiKey Programmable Not Verified
Number of LABs/CLBs 715
Number of Logic Elements/Cells 9152
Total RAM Bits 589824
Number of I/O 186
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Packaging Tray

Vue d'ensemble

Description

The XC6SLX9-3FTG256C is a member of the Xilinx Spartan-6 FPGA family, designed for cost-sensitive applications. It features a 256-ball Fine-Pitch Ball Grid Array (FBGA) package and operates at a maximum clock speed of 450 MHz. The device offers 9,152 logic cells, 576 Kbits of block RAM, and up to 36 DSP slices, making it suitable for a range of applications including digital signal processing, communications, and automotive systems.
The Spartan-6 series is known for its low power consumption and high performance, supporting various I/O standards such as LVDS and LVCMOS. It also includes built-in support for advanced configuration interfaces like SPI and JTAG. The XC6SLX9-3FTG256C is ideal for users seeking a balance between functionality and cost, providing essential features for both development and deployment in embedded systems. Moreover, it is programmable using the Xilinx ISE Design Suite, allowing for versatile application development.

Features

The XC6SLX9-3FTG256C is a member of Xilinx's Spartan-6 FPGA family, designed for a variety of applications requiring low power and cost-effectiveness. Key features include:
- Logic Cells: 9,152 logic cells with configurable logic blocks (CLBs) for flexible design.
- I/O Pins: Up to 144 I/O pins, supporting various standards including LVTTL, LVCMOS, and more.
- Embedded Memory: 576 Kbits of block RAM for efficient data storage.
- DSP Slices: 16 DSP slices for high-performance digital signal processing.
- Power Consumption: Optimized for low power operation, suitable for battery-powered devices.
- Configuration: Supports various configuration methods, including JTAG and SPI.
- Package: Available in a 256-ball FGT package, offering good thermal performance.
This FPGA is ideal for applications in telecommunications, automotive, and industrial control systems, providing a balance of performance and efficiency.

Package

The XC6SLX9-3FTG256C is packaged in a Fine Pitch BGA (Ball Grid Array) format with 256 balls. This type of package is designed for high-density circuit board applications, offering efficient thermal and electrical performance.

Pinout

The XC6SLX9-3FTG256C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-6 family. It features a pin count of 256 pins.
The device is designed for low-power applications and includes several key functions:
- It has 9,152 logic cells.
- Supports up to 216 user I/O pins.
- Incorporates configurable digital signal processing (DSP) blocks.
- Features embedded block RAM (BRAM) for efficient data storage.
- Supports various communication interfaces, including SPI, I2C, and UART.
This FPGA is suitable for diverse applications such as automotive, industrial, and consumer electronics, providing flexibility and performance in a compact form factor.

Manufacturer

The XC6SLX9-3FTG256C is manufactured by Xilinx, Inc., which is a technology company known for its development of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), CPLDs (Complex Programmable Logic Devices), and software tools for design and development. Founded in 1984 and headquartered in San Jose, California, Xilinx has been a pioneer in the FPGA market, enabling a wide range of applications in industries such as telecommunications, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in high-performance computing and adaptive computing solutions.

Application

The XC6SLX9-3FTG256C is a Spartan-6 FPGA from Xilinx, commonly used in applications such as digital signal processing, embedded systems, industrial automation, telecommunications, and automotive systems. It is ideal for low-power applications, enabling tasks like image processing, motor control, and data acquisition. Its versatility makes it suitable for prototyping, custom hardware acceleration, and design of complex logic functions across various industries.

Equivalent

Equivalent products to the XC6SLX9-3FTG256C FPGA from Xilinx include the Lattice ECP5 series, such as the LFE5U-85, and Intel's Cyclone IV series, like the EP4CE22. Other alternatives may include Microsemi's SmartFusion2 or IGLOO2 FPGAs, depending on specific application requirements like performance, power consumption, and available logic resources. Always verify compatibility with design specifications.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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