XC6SLX9-2CSG324C

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XC6SLX9-2CSG324C

IC FPGA 200 I/O 324CSBGA

  • Fabricant
  • Mfr. Partie #XC6SLX9-2CSG324C
  • Paquet BGA-324
  • Fiche de données
  • En stock7952

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Spécifications

Package Tray
Series Spartan®-6 LX
ProductStatus Active
NumberofLABs/CLBs 715
NumberofLogicElements/Cells 9152
TotalRAMBits 589824
NumberofI/O 200
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 324-LFBGA, CSPBGA

Vue d'ensemble

Description

The XC6SLX9-2CSG324C is a member of Xilinx's Spartan-6 FPGA family, designed for cost-sensitive applications requiring moderate performance and flexibility. It features 9,216 logic cells, 576 Kbits of embedded block RAM, and 36 DSP slices, making it suitable for various digital signal processing and control applications.
The FPGA is housed in a 324-pin CSG (Chip Scale Grid) package, allowing for a compact design footprint. It operates at a maximum clock frequency of 450 MHz and supports various I/O standards, enhancing its versatility in interfacing with different components.
With a power-efficient architecture, the XC6SLX9 is ideal for applications in telecommunications, automotive, and consumer electronics where power consumption is a critical factor. Xilinx provides a comprehensive development environment, including the ISE Design Suite, facilitating design, simulation, and implementation. The XC6SLX9-2CSG324C balances performance, power, and cost, making it a popular choice among engineers for implementing custom logic solutions.

Features

The XC6SLX9-2CSG324C is a member of the Xilinx Spartan-6 FPGA family, designed for low-power and cost-effective applications. Key features include:
1. Logic Cells: It contains 9,152 logic cells, providing significant processing capability for various applications.

2. I/O Pins: The device has 324 I/O pins, allowing for extensive connectivity options.
3. Memory: It includes 576 Kbits of Block RAM, which is useful for data storage and buffering.
4. DSP Slices: The FPGA features 36 DSP slices, enabling efficient signal processing tasks.
5. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated and portable devices.
6. Configuration Options: Supports multiple configuration interfaces, including JTAG and Serial.
7. High-Speed Transceivers: It offers integrated high-speed transceivers, enhancing data transfer rates.
8. Development Tools: Compatible with Xilinx's ISE design suite, facilitating easy design and implementation.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial automation.

Package

The XC6SLX9-2CSG324C is packaged in a 324-ball Ceramic BGA (Ball Grid Array) format. This type of package provides a compact design with good thermal performance and electrical connectivity, suitable for high-density applications.

Pinout

The XC6SLX9-2CSG324C is a member of the Xilinx Spartan-6 FPGA family. It features a pin count of 324 pins. This device is designed for versatile applications, offering a range of programmable logic resources, including lookup tables (LUTs), flip-flops, and DSP slices.
The primary functions of the XC6SLX9 include digital signal processing, high-speed data processing, and various control applications. It supports multiple I/O standards, providing flexibility for interfacing with different components. The specific features also include embedded memory blocks, clock management features, and a range of programmable logic resources, making it suitable for applications in consumer electronics, automotive, and communications.
Overall, the XC6SLX9-2CSG324C is well-suited for both low-power and high-performance tasks in a compact form factor.

Manufacturer

The manufacturer of the XC6SLX9-2CSG324C is Xilinx, Inc. Xilinx is a semiconductor company that specializes in the design and production of field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and other programmable logic solutions. Founded in 1984, Xilinx is known for pioneering the FPGA technology, which allows for customizable hardware configurations to suit various applications in telecommunications, automotive, industrial, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its reach in the semiconductor industry.

Application

The XC6SLX9-2CSG324C is a Spartan-6 FPGA used in various applications such as embedded systems, digital signal processing, and telecommunications. It is suitable for low-power designs in consumer electronics, automotive systems, industrial automation, and medical devices. Its flexibility allows for implementation of custom logic, signal conditioning, and data processing tasks. Additionally, it is often utilized in prototyping and educational projects due to its cost-effectiveness and versatility.

Equivalent

The XC6SLX9-2CSG324C is a Spartan-6 FPGA from Xilinx. Equivalent products include:
1. Lattice ECP5: LFE5U-25F-7MG285C
2. Intel Cyclone IV: EP4CE6E22C8N
3. Microsemi SmartFusion: M2S050-1FGG484
4. Xilinx Spartan-7: XCS7S10-1FTG256
These devices offer comparable functionality but may differ in performance and specific features. Always verify compatibility for your application.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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