XC6SLX16-2CSG324I

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XC6SLX16-2CSG324I

IC FPGA 232 I/O 324CSBGA

  • Fabricant
  • Mfr. Partie #XC6SLX16-2CSG324I
  • Paquet BGA-324
  • Fiche de données
  • En stock7122

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Spécifications

Package Tray
Series Spartan®-6 LX
ProductStatus Active
NumberofLABs/CLBs 1139
NumberofLogicElements/Cells 14579
TotalRAMBits 589824
NumberofI/O 232
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 324-LFBGA, CSPBGA

Vue d'ensemble

Description

The XC6SLX16-2CSG324I is a member of the Xilinx Spartan-6 FPGA family, known for its low power consumption and high performance. It features 16,000 logic cells, making it suitable for a variety of applications, including digital signal processing, embedded processing, and control systems.
Key characteristics include:
- Architecture: It utilizes a 45nm process technology, offering a balance between performance and power efficiency.
- I/O Pins: The CSG324 package has 324 pins, providing ample I/O options for diverse connectivity.
- Memory: It supports distributed RAM and block RAM, allowing for efficient data handling.
- Speed Grade: The ‘-2’ indicates a speed grade that balances performance with thermal management.
- Applications: Commonly used in automotive, industrial, and consumer electronics.
The XC6SLX16-2CSG324I is ideal for users requiring a cost-effective solution with scalability and versatility in design.

Features

The XC6SLX16-2CSG324I is a member of the Xilinx Spartan-6 FPGA family. Key features include:
1. Logic Cells: 16,000 logic cells for various applications.
2. Embedded Memory: Up to 4.9 Mb of block RAM, allowing for data storage and processing.
3. DSP Slices: 48 DSP slices for efficient digital signal processing tasks.
4. I/O Pins: 24 user-configurable I/O pins with support for multiple voltage standards.
5. Speed Grade: -2 speed grade, indicating moderate performance and power consumption.
6. Configuration: Supports JTAG and SPI configuration modes.
7. Power Efficiency: Optimized for low power consumption, making it suitable for battery-operated devices.
8. Temperature Range: Industrial grade (-40°C to +100°C) suitable for harsh environments.
9. Development Environment: Compatible with Xilinx ISE Design Suite for design and simulation.
This FPGA is ideal for various applications, including automotive, industrial control, and telecommunications, where reliability and performance are critical.

Package

The XC6SLX16-2CSG324I is packaged in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package. This compact type allows for efficient thermal management and space-saving on PCBs, suitable for various applications in the field of digital design and embedded systems.

Manufacturer

The XC6SLX16-2CSG324I is manufactured by Xilinx, Inc., a company known for its development of programmable logic devices, including Field Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and System on a Chip (SoC) solutions. Xilinx operates in the semiconductor industry, focusing on providing innovative design solutions that enable engineers to create customizable hardware for various applications, including communications, automotive, industrial, and consumer electronics. The XC6SLX16 is part of the Spartan-6 FPGA family, which is designed for cost-sensitive applications while delivering high performance and low power consumption. Xilinx is widely recognized for its contributions to the field of programmable logic and was acquired by AMD in 2020, further enhancing its capabilities in advanced technologies.

Application

The XC6SLX16-2CSG324I is a low-power, Spartan-6 FPGA used in various applications, including embedded systems, automotive electronics, industrial automation, telecommunications, and consumer electronics. Its versatility supports tasks such as signal processing, image processing, and real-time data handling, making it suitable for both prototyping and production in diverse fields.

Equivalent

The XC6SLX16-2CSG324I is a Spartan-6 FPGA from Xilinx. Equivalent products include:
1. Lattice ECP5 - Offers similar performance and density.
2. Intel Cyclone IV - Provides comparable features for low-power applications.
3. Microsemi SmartFusion2 - Combines FPGA with ARM CPU; suitable for embedded applications.
Always verify specific feature requirements and compatibility for your application.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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