XC3SD3400A-4FGG676I

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XC3SD3400A-4FGG676I

IC FPGA 469 I/O 676FBGA

  • Fabricant
  • Mfr. Partie #XC3SD3400A-4FGG676I
  • Paquet BGA676
  • Fiche de données
  • En stock3418

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Spécifications

Package Tray
Series Spartan®-3A DSP
ProductStatus Active
NumberofLABs/CLBs 5968
NumberofLogicElements/Cells 53712
TotalRAMBits 2322432
NumberofI/O 469
NumberofGates 3400000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BGA

Vue d'ensemble

Description

The XC3SD3400A-4FGG676I is a FPGA (Field-Programmable Gate Array) from Xilinx's Spartan-3 generation, designed for digital design applications. This specific model features a high-density, low-cost architecture, making it suitable for a range of applications, including automotive, consumer electronics, and industrial control systems.
Key specifications include 3.3V operation, over 3400 logical cells, multiple I/O pins, and support for various communication protocols. It comes in a FGG676 package, allowing for dense board layouts. The device is programmable, enabling designers to implement custom logic functions and reconfigure designs as needed, which enhances flexibility and reduces time to market.
The Spartan-3 family is particularly noted for its balance of performance and power efficiency, making the XC3SD3400A-4FGG676I an ideal choice for cost-sensitive projects requiring moderate processing power and versatility.

Features

The XC3SD3400A-4FGG676I is a Spartan-3A DSP FPGA from Xilinx designed for high-performance digital signal processing applications. Key features include:
- 3400 Logic Cells: Provides ample logic resources for complex designs.
- High DSP Performance: Equipped with dedicated DSP slices for efficient signal processing.
- Configurable I/O: Supports various I/O standards, facilitating integration with different systems.
- On-chip Memory: Includes block RAM for data storage.
- Fast Configuration: Can be configured via JTAG, SPI, or other methods.
- Power Efficiency: Optimized for low power consumption, ideal for portable applications.
- Flexible Clock Management: Supports multiple clock domains and clock management features.
- 676-pin FGG Package: Provides a compact footprint suitable for space-constrained applications.
Overall, the XC3SD3400A is suitable for applications in communications, automotive, and industrial control, providing reliability and scalability in designs.

Package

The XC3SD3400A-4FGG676I is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 676-ball configuration. This package type provides a compact design with enhanced thermal performance and reduced inductance, ideal for high-density applications.

Pinout

The XC3SD3400A-4FGG676I is a Spartan-3A DSP FPGA from Xilinx, featuring a pin count of 676. This device is designed for digital signal processing and general-purpose applications. It includes various I/O standards, multiple configuration options, and several dedicated DSP slices, which are optimized for high-performance arithmetic operations.
The FPGA offers a range of functionalities, including programmable logic, memory interfaces, and advanced signal processing capabilities. It supports various communication protocols and can be utilized in applications such as telecommunications, automotive systems, and industrial control. The 676 pins encompass power, ground, configuration, and user I/O pins, providing flexibility for interfacing with other components in a system.

Manufacturer

The manufacturer of the XC3SD3400A-4FGG676I is Xilinx, Inc., which is a semiconductor company known for developing programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and other advanced integrated circuits. Xilinx is recognized for its contributions to the field of digital design and is a leader in providing solutions for a wide range of applications, including telecommunications, automotive, aerospace, industrial automation, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its position in the semiconductor market.

Application

The XC3SD3400A-4FGG676I is a Spartan-3A DSP FPGA, commonly used in applications such as digital signal processing, video and image processing, telecommunications, automotive systems, and embedded systems. Its flexibility allows for custom hardware acceleration, making it suitable for tasks like algorithm development, real-time data processing, and high-performance computing in various industries.

Equivalent

The XC3SD3400A-4FGG676I is a Spartan-3A DSP FPGA by Xilinx. Equivalent products include the XC3SD3400A-4FG676I (same family, different packaging), XC6SD3400-4FGG676I (Spartan-6 series), or other FPGA families with similar logic capacity and features, like some models in the Lattice or Intel FPGA families. Always verify specific requirements such as I/O count, speed grade, and available features when selecting alternatives.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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