XC3S700A-4FGG484I

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XC3S700A-4FGG484I

IC FPGA 372 I/O 484FBGA

  • Fabricant
  • Mfr. Partie #XC3S700A-4FGG484I
  • Paquet FCBGA-484
  • Fiche de données
  • En stock4187

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Spécifications

Package Tray
Series Spartan®-3A
ProductStatus Active
NumberofLABs/CLBs 1472
NumberofLogicElements/Cells 13248
TotalRAMBits 368640
NumberofI/O 372
NumberofGates 700000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 484-BBGA

Vue d'ensemble

Description

The XC3S700A-4FGG484I is a field-programmable gate array (FPGA) from Xilinx, part of the Spartan-3A series. This device features 700,000 system gates and is designed for high-performance applications requiring a balance of cost and versatility. It operates at a maximum clock frequency of 200 MHz and supports various input/output standards, making it suitable for a wide range of digital designs.
The “-4” denotes the speed grade, indicating that this particular FPGA operates at a moderate speed. The “FGG484” package indicates a fine-pitch ball grid array (FBGA) with 484 balls, allowing for a compact design that is ideal for space-constrained applications. Additionally, the “I” suffix indicates the industrial temperature range, ensuring the FPGA can operate reliably in harsher environments.
The XC3S700A is commonly used in applications such as communications, automotive, defense, and consumer electronics, providing flexibility in design and the ability to implement complex algorithms and custom logic on demand.

Features

The XC3S700A-4FGG484I is a member of Xilinx's Spartan-3A FPGA family, designed for a variety of applications including communications, automotive, and industrial automation. Key features include:
1. Logic Cells: Approximately 700,000 system gates with 4-input look-up tables (LUTs) and flip-flops.
2. I/O Pins: 484-ball grid array (BGA) package with up to 232 I/O pins, supporting various I/O standards.
3. Memory: Integrated block RAM (BRAM) with 36 Kbit configurations, allowing for efficient data storage.
4. DSP Slices: Up to 24 DSP slices for high-performance signal processing applications.
5. Clock Management: Equipped with phase-locked loops (PLLs) for flexible clock management.
6. Power Efficiency: Low power consumption, suitable for battery-operated devices.
7. Development Support: Compatible with Xilinx ISE Design Suite for design and implementation.
Overall, the XC3S700A-4FGG484I offers a balance of performance, flexibility, and power efficiency, making it ideal for a wide range of digital design applications.

Package

The XC3S700A-4FGG484I is packaged in a Fine Pitch Ball Grid Array (FBGA) format. It features a 484-ball configuration, providing a compact and efficient way to connect the FPGA to a circuit board.

Pinout

The XC3S700A-4FGG484I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A family. It features a pin count of 484 pins.
The primary functions of the XC3S700A include digital signal processing, logic design, and hardware acceleration for various applications. It supports a range of I/O standards and offers flexibility in programming, allowing for custom logic implementations. The device is suitable for applications in communications, automotive, industrial control, and consumer electronics due to its balance of performance, power efficiency, and integration capabilities.
The "4" in the designation indicates its speed grade, while "FGG" refers to the package type (Fine Pitch Ball Grid Array). The "I" at the end denotes the industrial temperature grade, indicating it operates effectively in a wider temperature range.

Manufacturer

The XC3S700A-4FGG484I is manufactured by Xilinx, Inc., which is a leading company in the semiconductor industry. Xilinx specializes in Field Programmable Gate Arrays (FPGAs), as well as Complex Programmable Logic Devices (CPLDs) and System-on-Chip (SoC) solutions. Founded in 1984 and headquartered in San Jose, California, Xilinx is known for its innovative programmable logic devices that are widely used in various applications, including telecommunications, automotive, aerospace, industrial, and consumer electronics. The XC3S700A is part of the Spartan-3A series of FPGAs, designed for low-cost, high-performance applications. Xilinx was acquired by AMD in February 2022, further enhancing its capabilities in adaptive computing.

Application

The XC3S700A-4FGG484I is a Spartan-3 FPGA used in various applications, including digital signal processing, communications systems, industrial automation, automotive electronics, and consumer electronics. It is suitable for prototyping, embedded systems, and applications requiring high performance with low power consumption, such as image processing, data acquisition, and real-time control systems. Its versatility makes it ideal for custom hardware solutions across multiple industries.

Equivalent

The XC3S700A-4FGG484I is a Spartan-3 FPGA from Xilinx. Equivalent products include the XC3S700A-5FGG484I (higher speed grade) and other Spartan-3 devices like XC3S500E and XC3S1000, depending on specific requirements. For newer alternatives, consider the Xilinx Artix-7 series, such as the XC7A100T, which offers improved performance and features. Always verify compatibility based on your application needs.

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FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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