XC3S700A-4FGG400I

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XC3S700A-4FGG400I

IC FPGA 311 I/O 400FBGA

  • Fabricant
  • Mfr. Partie #XC3S700A-4FGG400I
  • Paquet FBGA-400
  • Fiche de données
  • En stock2842

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Spécifications

Package Tray
Series Spartan®-3A
ProductStatus Active
NumberofLABs/CLBs 1472
NumberofLogicElements/Cells 13248
TotalRAMBits 368640
NumberofI/O 311
NumberofGates 700000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 400-BGA

Vue d'ensemble

Description

The XC3S700A-4FGG400I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A series, designed for cost-sensitive applications requiring moderate performance. It features a capacity of 700,000 system gates and is built on a 90nm process technology. The device offers 400 I/O pins and operates at a maximum clock frequency of around 250 MHz.
The XC3S700A integrates a variety of resources, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory blocks. It supports various I/O standards, making it versatile for interfacing with other components. The FPGA is particularly well-suited for applications in consumer electronics, automotive systems, and industrial control.
Its architecture includes multiple I/O banks, enhanced power management features, and a robust toolchain for design implementation, making it an excellent choice for developers needing flexibility and rapid prototyping capabilities. The XC3S700A-4FGG400I is widely recognized for its balance of performance, power efficiency, and cost-effectiveness in the FPGA market.

Features

The XC3S700A-4FGG400I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A series. Key features include:
1. Logic Cells: Approximately 700,000 system gates with a flexible architecture.
2. I/O Pins: Up to 400 I/O pins, compatible with various I/O standards (LVTTL, LVCMOS, etc.).
3. Memory: Includes up to 88 Kbits of block RAM for data storage and processing.
4. DSP Slices: Contains 24 DSP slices optimized for digital signal processing applications.
5. Configuration: Supports multiple configuration methods including JTAG, SPI, and SelectMAP.
6. Performance: Operates at a maximum clock frequency of 100 MHz.
7. Power Consumption: Low power consumption suitable for battery-operated devices.
8. Development Tools: Compatible with Xilinx ISE Design Suite for comprehensive design support.
These features make the XC3S700A-4FGG400I suitable for various applications, including embedded systems, communications, and industrial automation.

Package

The XC3S700A-4FGG400I is packaged in a Fine Pitch Ball Grid Array (FBGA) format with 400 balls. This package type is designed for high-density applications, providing improved performance and thermal characteristics.

Pinout

The XC3S700A-4FGG400I is a Spartan-3A FPGA from Xilinx. It features a pin count of 400 in a Fine-Pitch Ball Grid Array (FBGA) package.
The functions of the pins include power supply, ground, configuration, input/output (I/O) ports, and dedicated signals for various functionalities such as clocks, JTAG for programming, and other control signals. The device supports a wide range of I/O standards and can be configured to interface with various peripherals and systems, making it versatile for applications in communications, automotive, and consumer electronics.
In summary, the XC3S700A-4FGG400I has 400 pins, supporting diverse functionalities essential for FPGA applications.

Manufacturer

The XC3S700A-4FGG400I is manufactured by Xilinx, Inc., a company that specializes in programmable logic devices. Xilinx is known for its development of Field Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and System on Chip (SoC) products. Founded in 1984, Xilinx has been a pioneer in the FPGA market and continues to be a leading provider of high-performance, adaptable solutions for various applications, including telecommunications, automotive, industrial, and aerospace. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in the semiconductor industry.

Application

The XC3S700A-4FGG400I is a Spartan-3 FPGA from Xilinx, commonly used in areas such as telecommunications, automotive systems, industrial automation, consumer electronics, and medical devices. Its applications include digital signal processing, image and video processing, embedded systems, and rapid prototyping due to its flexibility, low power consumption, and cost-effectiveness.

Equivalent

The XC3S700A-4FGG400I is a Spartan-3 FPGA from Xilinx. Equivalent products include the XC3S700A-4FGG400C (same series with minor variations) and potentially other devices in the Spartan-3 family with similar specifications, such as the XC3S500E or XC3S1000, depending on your application requirements. For newer alternatives, consider the Spartan-6 or Artix-7 series, which offer enhanced performance and features. Always verify compatibility based on specific application needs.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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