XC3S500E-4FTG256C

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XC3S500E-4FTG256C

IC FPGA 190 I/O 256FTBGA

  • Fabricant
  • Mfr. Partie #XC3S500E-4FTG256C
  • Paquet BGA-256
  • Fiche de données
  • En stock7010

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Spécifications

Package Tray
Series Spartan®-3E
ProductStatus Active
NumberofLABs/CLBs 1164
NumberofLogicElements/Cells 10476
TotalRAMBits 368640
NumberofI/O 190
NumberofGates 500000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 256-LBGA

Vue d'ensemble

Description

The XC3S500E-4FTG256C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3E family. It features 500,000 system gates and includes a range of configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory resources, making it suitable for various digital applications.
Key specifications include a 256-ball Thin Fine Pitch Ball Grid Array (TFBGA) package, operating voltage of 3.3V, and a maximum clock frequency of up to 200 MHz. The device supports multiple I/O standards and provides flexible interfacing options, enabling integration with various peripherals.
It is particularly favored in applications such as automotive, industrial control, and consumer electronics due to its balance of performance, power efficiency, and cost-effectiveness. The XC3S500E also benefits from Xilinx's comprehensive development tools, including the ISE Design Suite, which aids in design, simulation, and programming. Overall, it's an ideal choice for engineers looking to implement custom digital circuits in a versatile and scalable manner.

Features

The XC3S500E-4FTG256C is a member of the Xilinx Spartan-3E FPGA family. Key features include:
1. Logic Cells: It has 500,000 system gates and offers a significant number of configurable logic blocks (CLBs) for versatile design capabilities.
2. I/O Pins: 256 available I/O pins, supporting various I/O standards for flexible interfacing.
3. Memory: Integrated block RAM (BRAM) with a total of 18 Kbits per block, allowing efficient data storage and processing.
4. DSP Blocks: Includes dedicated DSP slices for high-performance digital signal processing applications.
5. Configuration: Support for multiple configuration modes, including JTAG and serial configurations.
6. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated applications.
7. Operating Voltage: Typically operates at 1.2V core voltage with I/O voltage options ranging from 1.2V to 3.3V.
The XC3S500E is ideal for a wide range of applications, including embedded systems, communications, and consumer electronics.

Package

The XC3S500E-4FTG256C is packaged in a Fine Pitch Ball Grid Array (FBGA) format with 256 balls. This package type allows for a compact design and efficient heat dissipation, suitable for high-density applications.

Pinout

The XC3S500E-4FTG256C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family. It features a pin count of 256. The device is designed for various applications, providing flexible logic resources, digital signal processing capabilities, and I/O options.
Key functional specifics include:
- Configurable Logic Blocks (CLBs): Used for implementing combinational and sequential logic.
- I/O Blocks: Supports multiple I/O standards, allowing for interfacing with other digital components.
- Dedicated DSP Slices: For high-performance digital signal processing tasks.
- Memory: Contains block RAM for data storage.
- Clock Management: Features clock management tiles for efficient clock distribution.
This FPGA is particularly suited for applications in consumer electronics, automotive, and industrial control systems where integration and performance are crucial.

Manufacturer

The manufacturer of the XC3S500E-4FTG256C is Xilinx, Inc. Xilinx is a semiconductor company that specializes in the design and production of field-programmable gate arrays (FPGAs), programmable SoCs (System on Chips), and other related technologies. Founded in 1984, Xilinx is known for its innovative solutions in digital design, enabling engineers to create highly flexible and customizable hardware for various applications, including telecommunications, automotive, aerospace, and industrial automation. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in high-performance computing and adaptive computing solutions.

Application

The XC3S500E-4FTG256C is a Spartan-3E FPGA commonly used in various applications, including digital signal processing, embedded systems, communication devices, automotive electronics, consumer electronics, industrial automation, and prototyping. Its flexibility and moderate performance make it suitable for tasks like image processing, control systems, and hardware acceleration, enabling rapid development and customization in diverse fields.

Equivalent

Equivalent products to the XC3S500E-4FTG256C chip include the Lattice ECP3-70, Altera Cyclone III EP3C500, and Xilinx Spartan-6 XC6SLX25. These alternatives offer similar FPGAs with comparable performance and logic resources, suitable for various applications in digital design. Always verify compatibility based on specific project requirements.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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