XC3S500E-4FGG320I

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XC3S500E-4FGG320I

IC FPGA 232 I/O 320FBGA

  • Fabricant
  • Mfr. Partie #XC3S500E-4FGG320I
  • Paquet BGA320
  • Fiche de données
  • En stock2777

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Spécifications

Package Tray
Series Spartan®-3E
ProductStatus Active
NumberofLABs/CLBs 1164
NumberofLogicElements/Cells 10476
TotalRAMBits 368640
NumberofI/O 232
NumberofGates 500000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 320-BGA

Vue d'ensemble

Description

The XC3S500E-4FGG320I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3E series. Designed for cost-sensitive applications, it features 500,000 system gates, enabling a balance between performance and affordability. The device operates at a maximum clock frequency of 200 MHz and supports various I/O standards, making it versatile for diverse applications.
With a 320-pin Fine Pitch Ball Grid Array (FBGA) package, it offers a compact form factor suitable for space-constrained designs. The XC3S500E is equipped with advanced digital signal processing (DSP) capabilities, allowing for efficient handling of complex algorithms in applications such as communications, automotive, and consumer electronics.
Key features include integrated block RAM, programmable logic cells, and a rich set of I/O pins, which facilitate easy integration into existing systems. Additionally, Xilinx provides a comprehensive development environment with tools like ISE Design Suite, which simplifies design implementation and simulation. Overall, the XC3S500E-4FGG320I is an excellent choice for engineers seeking to leverage FPGA technology for innovative solutions in a wide range of fields.

Features

The XC3S500E-4FGG320I is a Spartan-3E FPGA from Xilinx, designed for cost-sensitive applications. Key features include:
- Logic Cells: Approximately 500,000 system gates with a flexible architecture.
- I/O Pins: Up to 208 I/O pins with support for various voltage levels and I/O standards.
- Memory: Integrated block RAM (BRAM) with 12K bits per block, allowing efficient data storage and processing.
- Speed Grade: Grade -4 offers a maximum performance of up to 200 MHz.
- Configurable Logic Blocks (CLBs): Each CLB contains multiple 4-input Lookup Tables (LUTs) and flip-flops for implementing complex logic functions.
- Embedded Multipliers: Supports up to 18x18-bit multiplication for DSP applications.
- JTAG and SelectMAP: Support for various configuration modes including JTAG for easy programming and debugging.
- Power Consumption: Optimized for low power, making it suitable for portable applications.
The XC3S500E is widely used in communications, automotive, and industrial applications due to its balance of performance and cost.

Package

The XC3S500E-4FGG320I is packaged in a Fine-Pitch Ball Grid Array (FBGA) with 320 balls. It has a 20mm x 20mm footprint and is designed for high-density applications, offering efficient thermal performance and compact design suitable for various FPGA implementations.

Pinout

The XC3S500E-4FGG320I is a Spartan-3E FPGA from Xilinx with a pin count of 320. It is housed in a Fine Pitch Ball Grid Array (FBGA) package.
The functions of the pins include:
- I/O Pins: Configurable for various digital signal interfaces.
- Power Supply Pins: For VCC (core voltage) and VCCIO (I/O voltage).
- Ground Pins: Common ground connections.
- Clock Pins: Dedicated inputs for global clock signals.
- Configuration Pins: For bitstream loading and configuration management.
- JTAG Pins: For boundary-scan testing and programming.
- User-defined Pins: Can be used for custom logic and functions as per design requirements.
The XC3S500E supports a range of applications including digital signal processing, video processing, and embedded systems.

Manufacturer

The manufacturer of the XC3S500E-4FGG320I is Xilinx, Inc. Xilinx is a technology company known for designing and manufacturing field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and other semiconductor products. Founded in 1984, Xilinx was a pioneer in the FPGA market and has played a significant role in advancing programmable logic technology. The company's products are widely used in various applications, including telecommunications, automotive, aerospace, industrial automation, and data centers, due to their flexibility and adaptability in hardware design. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in the semiconductor landscape.

Application

The XC3S500E-4FGG320I is a Spartan-3E FPGA used in various applications, including digital signal processing, embedded systems, automotive electronics, industrial automation, and telecommunications. It supports high-speed data processing, real-time control, and custom logic implementations, making it suitable for tasks like image processing, motor control, and communication protocols. Its flexibility and programmability enable rapid prototyping and deployment in diverse electronic designs.

Equivalent

The XC3S500E-4FGG320I is a Spartan-3E FPGA from Xilinx. Equivalent products include:
1. LatticeECP2-M: Lattice Semiconductor's ECP2 series.
2. Altera Cyclone II: Intel's Cyclone II series.
3. Microsemi Igloo: Microsemi's low-power FPGA family.
These alternatives offer similar features and performance for applications in digital logic design and processing.

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DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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