XC3S400-4FTG256I

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XC3S400-4FTG256I

IC FPGA 173 I/O 256FTBGA

  • Fabricant
  • Mfr. Partie #XC3S400-4FTG256I
  • Paquet BGA-256
  • Fiche de données
  • En stock4413

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Spécifications

Package Tray
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 896
NumberofLogicElements/Cells 8064
TotalRAMBits 294912
NumberofI/O 173
NumberofGates 400000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 256-LBGA

Vue d'ensemble

Description

The XC3S400-4FTG256I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family. It features 400,000 system gates and is designed for low-cost, high-performance applications. The "4" in the part number indicates the speed grade, while "FTG256" refers to the package type and pin count, specifically a 256-pin Fine Pitch Ball Grid Array (FBGA) package.
Key features include programmable logic blocks, digital signal processing (DSP) slices, and a rich set of I/O options, making it suitable for various applications such as automotive, consumer electronics, and telecommunications. The device operates with a 3.3V supply voltage and supports multiple I/O standards, including LVTTL and LVCMOS.
Additionally, it offers high flexibility and efficiency in design, coupled with the capability to implement complex algorithms and data processing tasks on a single chip. The XC3S400 is popular among engineers for prototyping and deploying custom hardware solutions.

Features

The XC3S400-4FTG256I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3 series. Key features include:
1. Logic Cells: 400, with configurable logic blocks (CLBs) and dedicated digital signal processing (DSP) slices.
2. Programmable I/O: 256 I/O pins supporting various voltage levels and standards.
3. Memory: Up to 18Kbits of block RAM for data storage.
4. Speed Grade: Grade -4, allowing for operational speeds up to 200 MHz.
5. Embedded Multipliers: 18x18 multipliers for efficient arithmetic operations.
6. Configuration: Supports multiple configuration modes including JTAG and SPI.
7. Power Consumption: Low-power design ideal for portable and battery-operated devices.
8. Development Tools: Compatible with Xilinx ISE for design and simulation.
This FPGA is suitable for applications in communications, automotive, consumer electronics, and industrial control systems due to its versatility and performance.

Package

The XC3S400-4FTG256I is packaged in a Fine-Pitch Ball Grid Array (FBGA) with 256 balls. It features a 15 mm x 15 mm footprint and a 0.8 mm ball pitch, designed for efficient thermal performance and space-saving in electronic applications.

Pinout

The XC3S400-4FTG256I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3 family. It has a total pin count of 256.
The primary functions of the pins include:
1. I/O Pins: Configurable for various input/output operations (logic, high-speed signals, etc.).
2. Power Supply Pins: For connecting to the necessary power sources (VCC and GND).
3. Configuration Pins: For programming the FPGA, allowing it to load its configuration on power-up.
4. Clock Pins: For connecting external clock signals to synchronize the operations within the FPGA.
5. Control Pins: Such as JTAG pins, used for boundary scan and debugging.
The XC3S400-4FTG256I is suitable for a range of applications, including digital signal processing, embedded systems, and custom logic designs.

Manufacturer

The XC3S400-4FTG256I is manufactured by Xilinx, Inc., a subsidiary of AMD. Xilinx is a leading company in the field of programmable logic devices, specializing in field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-a-chip (SoC) solutions. Founded in 1984, Xilinx pioneered the FPGA technology and has been instrumental in advancing the capabilities of programmable logic for a wide range of applications, including telecommunications, automotive, aerospace, and industrial markets. The XC3S400 specifically belongs to the Spartan-3 series, designed for cost-sensitive applications while offering a balance between performance and power efficiency.

Application

The XC3S400-4FTG256I is a Spartan-3 FPGA from Xilinx, commonly used in applications such as digital signal processing, embedded systems, image processing, motor control, and telecommunications. Its versatility allows for custom logic design, making it suitable for prototyping, consumer electronics, automotive systems, and industrial automation. The device's low power consumption and cost-effectiveness also make it ideal for portable and battery-operated applications.

Equivalent

The XC3S400-4FTG256I is a Spartan-3 FPGA from Xilinx. Equivalent products include:
1. Lattice MachXO2 - Low-power FPGA.
2. Altera Cyclone IV - Cost-effective FPGA solution.
3. Microsemi IGLOO2 - Low power and high performance.
4. Xilinx Spartan-6 - Newer generation with similar features.
These alternatives vary in specifications, power consumption, and performance, so select based on specific application needs.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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