XC3S250E-4FTG256I

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XC3S250E-4FTG256I

IC FPGA 172 I/O 256FTBGA

  • Fabricant
  • Mfr. Partie #XC3S250E-4FTG256I
  • Paquet BGA-256
  • Fiche de données
  • En stock7266

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Spécifications

Package Tray
Series Spartan®-3E
ProductStatus Active
NumberofLABs/CLBs 612
NumberofLogicElements/Cells 5508
TotalRAMBits 221184
NumberofI/O 172
NumberofGates 250000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 256-LBGA

Vue d'ensemble

Description

The XC3S250E-4FTG256I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family, designed for cost-sensitive applications. It features 250,000 system gates, 4,608 logic cells, and up to 12,288 Kbits of block RAM, making it suitable for a range of digital designs like communications, automotive, and consumer electronics.
Key attributes include:
- Speed Grade: -4 indicates a maximum performance at a clock frequency of up to 200 MHz.
- Package: Available in a fine-pitch BGA (Ball Grid Array) 256-pin package, facilitating easy integration into compact designs.
- I/O Support: Up to 110 user I/O pins, with compatibility for various I/O standards.
- Power Efficiency: Designed for low power consumption, making it ideal for battery-operated devices.
The XC3S250E is programmable using VHDL or Verilog, allowing for flexible design implementations, and it's commonly used in prototyping and development due to its versatility and reliability.

Features

The XC3S250E-4FTG256I is a member of the Xilinx Spartan-3E FPGA family, designed for cost-sensitive applications requiring moderate performance. Key features include:
- Architecture: Configurable logic blocks (CLBs), distributed RAM, and dedicated DSP slices enhance versatility.
- Logic Cells: 250,000 system gates and up to 20,000 logic cells support complex designs.
- I/O: 256 I/O pins with support for various voltage levels and standards (e.g., LVTTL, LVCMOS).
- Speed Grade: Operates at a speed grade of -4, ensuring effective performance for timing-critical applications.
- Memory: Up to 8 Mb of block RAM and support for multiple memory types.
- Power: Low power consumption, making it suitable for portable applications.
- Development Support: Compatible with Xilinx development tools, providing a robust environment for design and simulation.
The XC3S250E-4FTG256I is ideal for applications in telecommunications, automotive, and industrial control systems.

Package

The XC3S250E-4FTG256I is packaged in a Fine-Pitch Ball Grid Array (FBGA) format with 256 balls. This type of package is designed for high-density applications, providing efficient thermal management and reduced footprint on the PCB.

Pinout

The XC3S250E-4FTG256I is a Spartan-3E FPGA from Xilinx, featuring a pin count of 256. It is packaged in a Fine-Pitch Ball Grid Array (FBGA). This FPGA is designed for various applications, including digital signal processing, communications, and embedded systems.
The XC3S250E-4FTG256I has multiple I/O pins that can be configured for different functions, including general-purpose input/output (GPIO), differential signaling, and various communication protocols (such as SPI, I2C, and UART). It supports multiple voltage levels, allowing flexibility in interfacing with different components. The device also includes dedicated resources such as block RAM, multipliers, and digital signal processing (DSP) slices, making it suitable for high-performance applications. The "4" in the part number indicates the speed grade, which signifies the maximum frequency the device can achieve.

Manufacturer

The XC3S250E-4FTG256I is manufactured by Xilinx, Inc., a company known for its programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), CPLDs (Complex Programmable Logic Devices), and associated software tools. Founded in 1984, Xilinx pioneered the FPGA market and has established itself as a leader in adaptive computing solutions. The company focuses on providing advanced technology for various applications, including telecommunications, automotive, aerospace, and industrial sectors. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in high-performance computing while continuing to innovate in the field of programmable devices.

Application

The XC3S250E-4FTG256I is a Spartan-3 FPGA primarily used in applications such as digital signal processing, communications, embedded systems, industrial automation, and video/image processing. Its versatility allows for custom hardware implementations in consumer electronics, automotive systems, medical devices, and prototyping.

Equivalent

The XC3S250E-4FTG256I is a Spartan-3E FPGA from Xilinx. Equivalent products include:
1. XC6SLX9-2FTG256 - Spartan-6 Low Power FPGA
2. Lattice ECP3-70 - Lattice Semiconductor ECP3 FPGA
3. Intel MAX 10 (10M08SAU169) - Intel’s MAX 10 FPGA
These alternatives offer similar features and performance levels suitable for various applications.

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DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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