XC3S200AN-4FT256I

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XC3S200AN-4FT256I

IC FPGA 195 I/O 256FTBGA

  • Fabricant
  • Mfr. Partie #XC3S200AN-4FT256I
  • Paquet BGA-256
  • Fiche de données
  • En stock2840

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Spécifications

Package Tray
Series Spartan®-3AN
ProductStatus Active
NumberofLABs/CLBs 448
NumberofLogicElements/Cells 4032
TotalRAMBits 294912
NumberofI/O 195
NumberofGates 200000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 256-LBGA

Vue d'ensemble

Description

The XC3S200AN-4FT256I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A family. It features 200,000 system gates and is designed for low-cost, low-power applications. The device is housed in a 256-pin Fine Pitch Ball Grid Array (FBGA) package.
Key specifications include:
- Logic Cells: Approximately 6,144, allowing for versatile digital logic design.
- I/O Pins: Supports up to 124 user I/O pins, configurable for various functions.
- Memory: Includes 80 Kbits of block RAM and support for distributed RAM, enabling efficient data handling.
- Performance: Capable of operating at speeds up to 200 MHz, suitable for high-speed applications.
- Development: Compatible with the Xilinx ISE design suite, facilitating easy programming and implementation.
The XC3S200AN is ideal for applications in automotive, consumer electronics, and industrial control, where flexibility and power efficiency are crucial.

Features

The XC3S200AN-4FT256I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A family. Key features include:
1. Logic Cells: 200,000 system gates with a combination of configurable logic blocks (CLBs) for versatile logic implementation.
2. I/O Pins: Up to 256 user-configurable I/O pins, supporting various I/O standards.
3. Memory: 12 Kbits of block RAM, enabling efficient on-chip data storage.
4. DSP Slices: Contains dedicated DSP slices for digital signal processing applications.
5. Internal Clock Speed: Maximum clock frequency of up to 200 MHz, allowing high-speed operations.
6. Configuration: Supports various configuration options, including JTAG and SPI.
7. Power Consumption: Low power operation, making it suitable for battery-powered applications.
8. Package: Available in a Fine Pitch Quad Flatpack (FT256) package, facilitating compact designs.
These features make the XC3S200AN suitable for a range of applications, including embedded systems, communications, and industrial control.

Package

The XC3S200AN-4FT256I is packaged in a Fine-Pitch Ball Grid Array (FBGA) form factor with a 256-ball configuration. This package type is designed for high-density applications, providing efficient thermal and electrical performance.

Pinout

The XC3S200AN-4FT256I is a Field Programmable Gate Array (FPGA) from the Xilinx Spartan-3A series. It features a pin count of 256.
The primary functions of the XC3S200AN include:
- Logic implementation for digital circuits with programmable interconnects.
- Configurable I/O pins for interfacing with other devices and peripherals.
- Support for various voltage levels and I/O standards.
- Built-in memory blocks and multipliers for DSP applications.
This FPGA is designed for various applications, including consumer electronics, industrial automation, and communication systems, offering flexibility and reconfigurability to meet specific design needs.

Manufacturer

The manufacturer of the XC3S200AN-4FT256I is Xilinx, Inc. Xilinx is a semiconductor company known for its development of field-programmable gate arrays (FPGAs), programmable systems-on-chip (SoCs), and complementary software tools. Founded in 1984, Xilinx was a pioneer in FPGA technology and has a strong focus on providing solutions for a wide range of applications, including telecommunications, automotive, aerospace, and industrial automation. The XC3S200AN-4FT256I specifically is part of the Spartan-3A family of FPGAs, which are designed for cost-sensitive applications while still delivering high performance. In October 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in the semiconductor industry.

Application

The XC3S200AN-4FT256I is a Spartan-3A FPGA used in various application areas, including embedded systems, digital signal processing, telecommunications, automotive electronics, industrial automation, and consumer electronics. Its versatility allows for customizable logic design, enabling tasks such as image processing, data acquisition, and real-time control in diverse fields.

Equivalent

The XC3S200AN-4FT256I is a Spartan-3A FPGA from Xilinx. Equivalent products include:
1. XC3S200A - Improved variant within the Spartan-3A family.
2. XC3S1000 - A more powerful option in the Spartan-3 family.
3. Lattice ECP3 series - Comparable performance in a different manufacturer.
For specific applications, ensure that the pin count, logic capacity, and performance metrics align with your requirements.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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