XC3S200A-4FTG256I

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XC3S200A-4FTG256I

IC FPGA 195 I/O 256FTBGA

  • Fabricant
  • Mfr. Partie #XC3S200A-4FTG256I
  • Paquet BGA256
  • Fiche de données
  • En stock7386

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Spécifications

Package Tray
Series Spartan®-3A
ProductStatus Active
NumberofLABs/CLBs 448
NumberofLogicElements/Cells 4032
TotalRAMBits 294912
NumberofI/O 195
NumberofGates 200000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 256-LBGA

Vue d'ensemble

Description

The XC3S200A-4FTG256I is a Field Programmable Gate Array (FPGA) manufactured by Xilinx, part of the Spartan-3A family. Designed for low-cost, high-performance applications, it features 200,000 system gates, 144 user I/O pins, and a range of digital signal processing capabilities.
The device operates at a maximum clock speed of 200 MHz and supports various I/O standards, making it versatile for different applications. It has an integrated 18 Kbit block RAM and configurable logic blocks, allowing for efficient implementation of complex algorithms and designs. The "4" in the part number indicates the speed grade, while "FTG256" refers to the 256-ball Fine-Pitch Ball Grid Array (FBGA) package.
Ideal for applications in consumer electronics, automotive systems, and industrial automation, the XC3S200A-4FTG256I supports a wide range of development tools and has a rich ecosystem for designers, facilitating rapid prototyping and deployment in embedded systems.

Features

The XC3S200A-4FTG256I is a Spartan-3A FPGA (Field Programmable Gate Array) from Xilinx, designed for a variety of applications. Key features include:
- Logic Cells: 200,000 system gates with 4-input look-up tables (LUTs).
- I/O Pins: Up to 256 user-configurable I/O pins.
- Block RAM: 4.5 Mbits of embedded block RAM for data storage.
- DSP Slices: Supports digital signal processing with dedicated DSP slices.
- Power Supply: Operates at a voltage of 1.2V with low power consumption.
- Configuration: Flexibility in configuration options including JTAG and serial modes.
- Packages: Available in a Fine Pitch Ball Grid Array (FBGA) package for compact designs.
The XC3S200A is suitable for various applications including consumer electronics, automotive systems, and industrial automation, offering a balance of performance, power efficiency, and cost-effectiveness.

Package

The XC3S200A-4FTG256I is packaged in a Fine Pitch Ball Grid Array (FBGA) with 256 balls. The "FTG" designation indicates a specific form factor and package type, suitable for high-density applications.

Pinout

The XC3S200A-4FTG256I is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3A family. It features a pin count of 256 in a fine-pitch ball grid array (FBGA) package.
The primary functions of the XC3S200A include logic implementation, digital signal processing, and interfacing with various peripherals. It provides programmable logic resources, such as lookup tables (LUTs), flip-flops, and dedicated hardware for DSP functions. The device supports various I/O standards and has a range of configuration options, making it suitable for applications in communications, automotive, industrial, and consumer electronics.
The "4" in the part number indicates the speed grade, while "I" denotes the industrial temperature range.

Manufacturer

The XC3S200A-4FTG256I is manufactured by Xilinx, Inc., a company that specializes in programmable logic devices, including Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and software tools for design. Founded in 1984, Xilinx is known for its innovative contributions to the semiconductor industry, particularly in enabling the development of customizable hardware solutions for a variety of applications, including telecommunications, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), thereby expanding its portfolio to include a wider range of computing solutions. The XC3S200A is part of the Spartan-3 family, which is aimed at cost-sensitive applications while still providing a good balance of performance and power efficiency.

Application

The XC3S200A-4FTG256I is a Spartan-3 FPGA used in various applications, including digital signal processing, embedded systems, telecommunications, automotive electronics, industrial automation, consumer electronics, and prototyping. Its versatility allows for custom logic designs, real-time processing, and interfacing with multiple peripherals, making it suitable for both low to mid-range complexity tasks.

Equivalent

The XC3S200A-4FTG256I is a Spartan-3 FPGA from Xilinx. Equivalent products include the XC3S200-4FTG256 and other Spartan-3 devices like XC3S50, XC3S100, or XC3S150, depending on your specific requirements for logic capacity and performance. For newer options, consider Spartan-6 or Artix-7 FPGAs for improved features and performance. Always check compatibility with your specific application.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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