XC3S2000-5FGG676C

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XC3S2000-5FGG676C

IC FPGA 489 I/O 676FBGA

  • Fabricant
  • Mfr. Partie #XC3S2000-5FGG676C
  • Paquet BGA-676
  • Fiche de données
  • En stock5837

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Spécifications

Package Tray
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 5120
NumberofLogicElements/Cells 46080
TotalRAMBits 737280
NumberofI/O 489
NumberofGates 2000000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 676-BGA

Vue d'ensemble

Description

The XC3S2000-5FGG676C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3 family. It features over 2 million system gates, offering a balance of high performance and low power consumption. The device is designed for various applications, including digital signal processing, communications, and embedded systems.
Key specifications include a 5-volt tolerant I/O, a maximum clock speed of 200 MHz, and support for various configuration modes. The FPGA is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, ideal for compact designs. Its architecture includes logic cells, DSP slices, and block RAM, allowing for flexible and efficient design implementations.
Developers can leverage Xilinx's ISE Design Suite for design entry, simulation, and synthesis, making it accessible for both novice and experienced users. The XC3S2000 is suitable for applications that require rapid prototyping and high adaptability in hardware design.

Features

The XC3S2000-5FGG676C is a member of the Xilinx Spartan-3 family of FPGAs (Field Programmable Gate Arrays). Key features include:
1. Logic Cells: Approximately 2 million system gates with 2000 logic cells.
2. Configurable I/O: 576 I/O pins with support for various I/O standards, including LVTTL and LVCMOS.
3. RAM: Up to 144 Kbits of block RAM available for data storage.
4. DSP Slices: Supports digital signal processing with dedicated DSP slices.
5. Speed Grade: Rated at speed grade -5, suitable for high-performance applications.
6. Packages: Available in a FGG package (676-ball grid array), facilitating dense designs.
7. Power Efficiency: Optimized for low power consumption, making it ideal for portable and battery-operated devices.
8. Development Support: Compatible with Xilinx design tools for effective programming and debugging.
This FPGA is well-suited for applications in telecommunications, automotive, and consumer electronics due to its flexibility and performance.

Package

The XC3S2000-5FGG676C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 676-pin configuration. This package type offers a compact footprint and high pin density, making it suitable for various applications in FPGA designs.

Pinout

The XC3S2000-5FGG676C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family, specifically designed for high-performance applications. It features a pin count of 676 pins in a Fine Pitch Ball Grid Array (FBGA) package.
The primary functions of the XC3S2000-5FGG676C include:
1. Configurable Logic Blocks (CLBs): It contains a large number of CLBs for implementing custom logic.
2. Digital Signal Processing (DSP): Supports DSP applications with dedicated DSP slices.
3. I/O Capabilities: Offers versatile I/O standards to interface with various peripherals and systems.
4. Memory: Includes Block RAM for data storage and buffering.
5. Multiple Clock Domains: Supports designs requiring complex clock management.
The device is suitable for applications such as consumer electronics, automotive systems, telecommunications, and industrial automation.

Manufacturer

The XC3S2000-5FGG676C is manufactured by Xilinx, Inc., a company known for its design and production of programmable logic devices, including Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and other related technologies. Xilinx, founded in 1984, is a leading player in the semiconductor industry, focusing on innovative solutions for a variety of applications in areas like telecommunications, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in high-performance computing and adaptive computing solutions.

Application

The XC3S2000-5FGG676C is a high-performance FPGA from Xilinx, commonly used in applications such as digital signal processing, telecommunications, automotive, consumer electronics, industrial automation, and embedded systems. Its versatility supports various functions, including custom logic design, real-time processing, and interfacing with other hardware, making it suitable for prototyping, product development, and academic research.

Equivalent

The XC3S2000-5FGG676C is a Spartan-3 FPGA from Xilinx. Equivalent products include the XC3S1500 and XC3S4000 from the Spartan-3 family, as well as newer alternatives like the Artix-7 series (e.g., XC7A200T), which offer enhanced performance and features. The choice depends on specific application requirements such as I/O count, logic cell count, and power consumption.

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FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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