XC3S2000-4FGG676I

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XC3S2000-4FGG676I

IC FPGA 489 I/O 676FBGA

  • Fabricant
  • Mfr. Partie #XC3S2000-4FGG676I
  • Paquet FBGA676
  • Fiche de données
  • En stock7451

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Spécifications

Package Tray
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 5120
NumberofLogicElements/Cells 46080
TotalRAMBits 737280
NumberofI/O 489
NumberofGates 2000000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BGA

Vue d'ensemble

Description

The XC3S2000-4FGG676I is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3 series. It is designed for various applications, including digital signal processing, communications, and embedded systems. The "XC3S2000" indicates it has approximately 2 million system gates, while "4" signifies the speed grade. The "FGG676" refers to its packaging, a 676-pin Fine Pitch Ball Grid Array (FBGA), facilitating efficient heat dissipation and space-saving designs.
This FPGA supports a wide range of I/O standards, offers a rich set of programmable logic resources, and features built-in blocks for DSP and memory functions. With a low power consumption profile and cost-effectiveness, it is suitable for both prototyping and production environments. The XC3S2000 operates with a core voltage of 1.2V and can be programmed using Xilinx's development tools, such as ISE and Vivado, enabling designers to implement custom logic functions tailored to specific applications.

Features

The XC3S2000-4FGG676I is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family. Key features include:
1. Logic Cells: Approximately 2 million system gates with up to 2000 logic cells.
2. I/O Capabilities: 676 pins with support for various I/O standards, including LVTTL, LVCMOS, and SSTL.
3. Configurable Logic Blocks (CLBs): Combines Look-Up Tables (LUTs) and flip-flops for flexible logic implementation.
4. Block RAM: Up to 128 Kbits of internal memory for data storage and buffering.
5. DSP Slices: Supports dedicated DSP slices for high-performance arithmetic operations.
6. Clock Management: Features built-in clock management through phase-locked loops (PLLs).
7. Power Efficiency: Low power consumption suitable for portable applications.
8. Development Tools: Compatible with Xilinx ISE design suite for programming and configuration.
This FPGA is ideal for applications in telecommunications, automotive, and consumer electronics, providing robust performance and flexibility in design.

Package

The XC3S2000-4FGG676I is packaged in a Fine-Pitch Ball Grid Array (FBGA) format with 676 balls. This package type provides high I/O density and efficient thermal performance, suitable for various applications in FPGA systems.

Pinout

The XC3S2000-4FGG676I is a field-programmable gate array (FPGA) from the Xilinx Spartan-3 series. It has a pin count of 676.
The device features a range of functionalities including logic elements for implementing custom digital circuits, I/O pins for interfacing with external devices, and support for various communication protocols. It provides configurable I/O standards and can support high-speed signal processing applications. The FPGA can be used for various applications such as digital signal processing, embedded systems, and custom hardware acceleration.
This specific model operates with a core voltage of 1.2V and is intended for applications that require moderate to high logic density with flexibility in design.

Manufacturer

The XC3S2000-4FGG676I is manufactured by Xilinx, Inc. Xilinx is a semiconductor company known primarily for its field-programmable gate array (FPGA) technology. Founded in 1984, it pioneered the FPGA market and has since expanded its product offerings to include system-on-a-chip (SoC) designs, application-specific integrated circuits (ASIC), and other programmable logic devices. Xilinx's products are widely used in various applications, including telecommunications, automotive, aerospace, and industrial sectors, providing solutions for data processing, signal processing, and hardware acceleration. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices) to enhance its portfolio in adaptive computing technologies.

Application

The XC3S2000-4FGG676I is a Spartan-3 FPGA from Xilinx, commonly used in applications such as digital signal processing, embedded systems, telecommunications, automotive electronics, industrial automation, and custom hardware accelerators. Its versatility supports prototyping, signal conditioning, data acquisition, and image processing tasks in various fields, including consumer electronics and medical devices.

Equivalent

The XC3S2000-4FGG676I is a Xilinx Spartan-3 FPGA. Equivalent products can include the Lattice ECP3-70, Altera Cyclone III EP3C40, and Microsemi Igloo 2. These alternatives offer similar logic density, performance, and application suitability, though specific features may vary. Always verify compatibility based on your project requirements.

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FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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