XC3S2000-4FGG676C

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XC3S2000-4FGG676C

IC FPGA 489 I/O 676FBGA

  • Fabricant
  • Mfr. Partie #XC3S2000-4FGG676C
  • Paquet FBGA-676
  • Fiche de données
  • En stock5451

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Spécifications

Package Tray
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 5120
NumberofLogicElements/Cells 46080
TotalRAMBits 737280
NumberofI/O 489
NumberofGates 2000000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 676-BGA

Vue d'ensemble

Description

The XC3S2000-4FGG676C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family, designed for a wide range of applications including digital signal processing, embedded systems, and custom logic design. It features 2 million system gates, 576 kbits of block RAM, and up to 192 user I/O pins. The device operates at a core voltage of 1.2V and supports a variety of I/O standards, making it suitable for both low-power and high-performance applications.
The "4" in the part number indicates the speed grade, while "FGG" signifies the package type, which is a Fine Pitch Ball Grid Array (FBGA), allowing for a compact design with a high pin count. The XC3S2000 is programmable via standard design tools like Vivado and ISE, making it accessible for developers to implement custom logic. Its versatility, combined with cost-effectiveness and reliability, makes it a popular choice for prototyping and production in industries such as telecommunications, automotive, and consumer electronics.

Features

The XC3S2000-4FGG676C is a field-programmable gate array (FPGA) from the Xilinx Spartan-3 family. Key features include:
1. Logic Cells: Approximately 2,000 logic cells, allowing for a variety of digital designs.
2. Configurable I/O: 676 I/O pins with support for various standards including LVTTL, LVCMOS, and PCI.
3. Dynamically Reconfigurable: Supports partial reconfiguration, enabling updates without halting operation.
4. Memory: 128 Kbits of distributed RAM and 4 Mbits of block RAM for data storage.
5. DSP Slices: Integrated DSP slices for efficient digital signal processing tasks.
6. Clock Management: Features global clock networks and phase-locked loops (PLLs) for timing management.
7. Power Consumption: Designed for low power operation, making it suitable for battery-powered applications.
8. Development Tools: Compatible with Xilinx ISE development environment for design and simulation.
Overall, the XC3S2000-4FGG676C is ideal for embedded systems, automotive applications, and other designs requiring flexibility and scalability.

Package

The XC3S2000-4FGG676C is packaged in a Fine Pitch Ball Grid Array (FBGA) with 676 balls. This package type offers a compact design suitable for high-density applications, facilitating efficient thermal performance and electrical connectivity.

Pinout

The XC3S2000-4FGG676C is a Field Programmable Gate Array (FPGA) from the Xilinx Spartan-3 family. It features a pin count of 676 pins.
The main functions of the XC3S2000 include:
- Implementing digital logic circuits.
- Supporting a variety of I/O standards such as LVTTL, LVCMOS, and others.
- Enabling high-speed serial communication protocols.
- Providing programmable interconnect resources for custom circuit designs.
- Supporting embedded block RAM for data storage.
This FPGA is used in applications such as communications, automotive, industrial control, and consumer electronics, among others, where customization and adaptability are essential.

Manufacturer

The XC3S2000-4FGG676C is manufactured by Xilinx, Inc., a company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and other integrated circuits. Xilinx is known for its innovative solutions in the field of digital design and is a key player in the semiconductor industry. The company provides products and technologies that enable engineers to create customized hardware solutions for various applications, including telecommunications, automotive, aerospace, and industrial automation. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities and market reach.

Application

The XC3S2000-4FGG676C is a Spartan-3 FPGA used in various applications such as telecommunications, automotive systems, consumer electronics, industrial automation, and embedded systems. It supports digital signal processing, image processing, and hardware acceleration tasks, making it suitable for prototyping, data acquisition, and control applications. Its versatility and reconfigurability make it ideal for both development and production environments.

Equivalent

The XC3S2000-4FGG676C is a FPGA from Xilinx's Spartan-3 series. Equivalent products include the XC3S2000-4FGG676, XC3S1500-5FGG676, and other Spartan-3 FPGAs with similar or lower logic capacity and performance. For newer technology, consider the Artix-7 series (e.g., XC7A200T) as a modern alternative. Always check specific requirements like I/O count and configuration.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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