XC3S200-4FTG256I

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XC3S200-4FTG256I

IC FPGA 173 I/O 256FTBGA

  • Fabricant
  • Mfr. Partie #XC3S200-4FTG256I
  • Paquet BGA-256
  • Fiche de données
  • En stock3209

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Spécifications

Package Tray
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 480
NumberofLogicElements/Cells 4320
TotalRAMBits 221184
NumberofI/O 173
NumberofGates 200000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 256-LBGA

Vue d'ensemble

Description

The XC3S200-4FTG256I is a Field Programmable Gate Array (FPGA) produced by Xilinx, part of the Spartan-3 family. It features 200,000 system gates and is designed for cost-sensitive applications requiring moderate performance and flexibility. The "4" in its designation indicates the speed grade, with "-4" denoting a faster speed option.
It comes in a 256-pin Fine Pitch Ball Grid Array (FBGA) package, suitable for compact designs. The FPGA supports a variety of I/O standards, enabling compatibility with numerous interfacing requirements. With built-in block RAM and digital signal processing (DSP) slices, it is adept for applications in consumer electronics, automotive systems, and industrial automation.
The XC3S200 is programmed using hardware description languages like VHDL or Verilog and is supported by Xilinx's ISE software for design implementation. Its combination of reconfigurability, performance, and cost-effectiveness makes it a popular choice for engineers looking to prototype and deploy digital systems quickly.

Features

The XC3S200-4FTG256I is a FPGA (Field Programmable Gate Array) from Xilinx's Spartan-3 family. Key features include:
1. Logic Cells: It contains 200,000 system gates and 2,304 logic cells.
2. I/O Pins: Offers up to 112 user I/O pins with various voltage standards.
3. Performance: Operates at speeds up to 200 MHz, suitable for high-performance applications.
4. Configuration: Supports various configuration methods, including JTAG and serial modes.
5. Memory: Includes embedded block RAM (BRAM) with a total of 64 Kbits.
6. DSP Slices: Incorporates DSP slices for efficient digital signal processing.
7. Package: Comes in a fine-pitch BGA package (FTG256) with 256 pins.
8. Power: Low power consumption, making it ideal for portable and battery-operated devices.
9. Development Tools: Compatible with Xilinx’s ISE Design Suite for design and simulation.
Overall, the XC3S200-4FTG256I is designed for a range of applications, including communications, automotive, and consumer electronics.

Package

The XC3S200-4FTG256I is packaged in a Fine Pitch Ball Grid Array (FBGA) format. Specifically, it features a 256-ball configuration, allowing for a compact design with efficient thermal and electrical performance.

Pinout

The XC3S200-4FTG256I is a field-programmable gate array (FPGA) from the Xilinx Spartan-3 family. It has a pin count of 256.
In terms of functionality, the XC3S200-4FTG256I supports various I/O standards and includes features such as:
- Logic Cells: Approximately 200,000 system gates.
- Embedded Block RAM: Up to 4 Kbits of block RAM.
- Digital Signal Processing (DSP) Slices: None in this specific model.
- I/O Pins: Configurable for different functions such as general-purpose I/O, clock inputs, and special functions.
- Configuration Options: Supports multiple configuration modes, including JTAG and serial modes.
This FPGA is suitable for a wide range of applications, including consumer electronics, automotive, and embedded systems, due to its versatility and performance capabilities.

Manufacturer

The XC3S200-4FTG256I is manufactured by Xilinx, Inc., a company renowned for its development of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), CPLDs (Complex Programmable Logic Devices), and software tools for hardware design. Founded in 1984, Xilinx is a key player in the semiconductor industry and is recognized for pioneering the FPGA technology. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in delivering high-performance computing solutions. Xilinx products are widely used in various applications, including telecommunications, automotive, aerospace, and consumer electronics, enabling flexibility and adaptability in digital circuit design.

Application

The XC3S200-4FTG256I is a Spartan-3 FPGA widely used in applications such as digital signal processing, embedded systems, communications, automotive electronics, industrial automation, and consumer electronics. Its versatility allows for custom logic implementations, prototyping, and real-time processing tasks in various fields including medical devices, robotics, and networking equipment.

Equivalent

The XC3S200-4FTG256I is a Spartan-3 FPGA from Xilinx. Equivalent products include:
1. XC3S250-4FTG256I - Slightly lower performance.
2. XC3S300-4FTG256I - Higher performance.
3. Lattice ICE40 series - Alternative low-power FPGAs.
4. Altera Cyclone series - Comparable low-cost FPGAs.
When selecting an equivalent, consider specific requirements such as power, performance, and I/O capabilities. Always verify compatibility for your application.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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