XC3S1600E-4FGG320C

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XC3S1600E-4FGG320C

IC FPGA 250 I/O 320FBGA

  • Fabricant
  • Mfr. Partie #XC3S1600E-4FGG320C
  • Paquet 320FBGA
  • Fiche de données
  • En stock6263

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Spécifications

Package Tray
Series Spartan®-3E
ProductStatus Active
NumberofLABs/CLBs 3688
NumberofLogicElements/Cells 33192
TotalRAMBits 663552
NumberofI/O 250
NumberofGates 1600000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 320-BGA

Vue d'ensemble

Description

The XC3S1600E-4FGG320C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family, designed for cost-sensitive applications. It features 1,600 logic cells, 36 Kbits of block RAM, and up to 128 I/O pins, making it suitable for a variety of digital designs, including signal processing, communications, and control systems.
With a 90nm process technology, the XC3S1600E can operate at speeds up to 400 MHz, delivering a balance of performance and power efficiency. It supports various I/O standards, such as LVTTL and LVCMOS, allowing flexibility in interfacing with other components.
Key features include an extensive library of pre-built IP cores, integrated DSP slices for efficient arithmetic operations, and advanced configuration options, including JTAG and SPI. The FPGA is also supported by Xilinx's ISE Design Suite for development, simulation, and implementation, simplifying the design process. Overall, the XC3S1600E-4FGG320C is a versatile choice for applications requiring reliable, programmable logic solutions.

Features

The XC3S1600E-4FGG320C is a Spartan-3E FPGA from Xilinx, designed for cost-sensitive applications. Key features include:
1. Logic Cells: Up to 1,600 logic cells for flexible programmable logic.
2. I/O Pins: 32 I/O pins with support for various I/O standards.
3. Memory: Integrated block RAM (up to 576 Kbits) and distributed RAM for efficient data storage.
4. DSP Slices: Equipped with DSP slices for high-performance digital signal processing.
5. Flexible Configuration: Supports multiple configuration modes including JTAG and serial configurations.
6. Operating Voltage: Typically operates at a voltage of 1.2V for core and 3.3V for I/O.
7. Package: Available in a 320-pin Fine Pitch Ball Grid Array (FBGA) package.
8. Performance: Capable of operating at a maximum clock frequency of around 250 MHz.
These features position the XC3S1600E-4FGG320C as a versatile solution for applications in consumer electronics, automotive, and industrial automation.

Package

The XC3S1600E-4FGG320C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 320-ball configuration. This type of packaging offers a compact design, facilitating high-density connections and efficient thermal performance, suitable for various applications in programmable logic devices.

Pinout

The XC3S1600E-4FGG320C is a Spartan-3E FPGA from Xilinx, featuring a pin count of 320. This device belongs to the Spartan-3E family, designed for low-cost and power-efficient applications. It operates at a maximum speed grade of -4 and is housed in a Fine-Pitch Ball Grid Array (FBGA) package.
The functionality of the XC3S1600E includes configurable logic blocks (CLBs), digital signal processing (DSP) slices, block RAM, and embedded multipliers. It supports various I/O standards and features such as JTAG for programming and debugging, making it suitable for a range of applications including communications, automotive, and consumer electronics. The FPGA can be programmed to implement custom logic and perform complex computations, allowing for flexibility in design.

Manufacturer

The manufacturer of the XC3S1600E-4FGG320C is Xilinx, Inc. Xilinx is a semiconductor company that specializes in the development and production of programmable logic devices, including Field Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and software tools for design and development. Founded in 1984 and headquartered in San Jose, California, Xilinx is known for its innovation in reconfigurable computing technology and is a leader in the FPGA market. The company's products are widely used in various applications, including telecommunications, automotive, aerospace, consumer electronics, and data center infrastructure. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities and market reach.

Application

The XC3S1600E-4FGG320C is a Spartan-3E FPGA used in various applications including digital signal processing, embedded systems, automotive electronics, telecommunications, industrial automation, and consumer electronics. Its features support tasks like image processing, data acquisition, and real-time control, making it suitable for prototyping and low-to-mid volume production in diverse fields such as robotics, medical devices, and IoT solutions.

Equivalent

The XC3S1600E-4FGG320C is a Spartan-3E FPGA from Xilinx. Equivalent products include:
1. Lattice ECP3 series (e.g., LFE3-35EA).
2. Altera Cyclone III series (e.g., EP3C16).
3. Intel MAX 10 series (e.g., 10M08SAE144C8G).
These alternatives offer comparable performance and features for similar applications.

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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