XC3S1500-4FG456I

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XC3S1500-4FG456I

IC FPGA 333 I/O 456FBGA

  • Fabricant
  • Mfr. Partie #XC3S1500-4FG456I
  • Paquet 456-BBGA
  • Fiche de données
  • En stock7911

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Spécifications

Package Tray
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 3328
NumberofLogicElements/Cells 29952
TotalRAMBits 589824
NumberofI/O 333
NumberofGates 1500000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 456-BBGA

Vue d'ensemble

Description

The XC3S1500-4FG456I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3 family. Designed for cost-sensitive applications, it features 1.5 million system gates, enabling versatile digital logic designs. The "4" in its designation indicates that it operates at a maximum speed grade of 4, suitable for moderate performance requirements.
The package type, "FG456," refers to a Fine-Pitch BGA (Ball Grid Array) with 456 pins, allowing for extensive I/O connectivity. It supports various I/O voltages and standards, making it adaptable for interfacing with different components. The XC3S1500 is ideal for applications in automotive, industrial, and consumer electronics, as well as for prototyping and educational purposes.
Key features include built-in memory blocks, high-speed DSP slices for signal processing, and a rich set of programmable logic resources. The FPGA can be configured using VHDL or Verilog, making it flexible for developers. Overall, the XC3S1500-4FG456I is a reliable choice for implementing custom digital designs efficiently.

Features

The XC3S1500-4FG456I is a member of the Xilinx Spartan-3 family of FPGAs (Field-Programmable Gate Arrays). Key features include:
- Logic Cells: 1,500 logic cells, allowing for a broad range of applications.
- Configurable I/O: Up to 232 I/O pins, supporting various I/O standards, including LVTTL and LVCMOS.
- Embedded Memory: Includes up to 512 Kbits of block RAM for data storage.
- DSP Slices: Equipped with dedicated DSP slices for high-performance digital signal processing tasks.
- Clock Management: Features clock management tiles with phase-locked loop (PLL) for clock generation and distribution.
- Configuration Options: Supports multiple configuration methods, including JTAG, SPI, and parallel modes.
- Power Efficiency: Designed for low power consumption, making it suitable for battery-operated devices.
- Package: Available in a 456-pin Fine Pitch Ball Grid Array (FBGA) package.
These features make the XC3S1500-4FG456I suitable for a variety of applications, including consumer electronics, automotive, and communication systems.

Package

The XC3S1500-4FG456I is packaged in a Fine-pitch Ball Grid Array (FBGA) format with 456 balls. This package type is designed for high-density applications and offers improved thermal performance and electrical characteristics.

Pinout

The XC3S1500-4FG456I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3 series. It features a total of 456 pins. The functions of these pins include:
1. I/O Pins: Configurable input/output pins that can be used for interfacing with external devices.
2. Power Supply Pins: For connecting to the necessary power supplies, including VCC and ground.
3. Configuration Pins: Used for programming the FPGA, including JTAG and other configuration modes.
4. Dedicated Clock Pins: For clock signals to synchronize operations within the FPGA.
5. Internal Logic Interconnects: Not directly exposed but utilized for routing signals within the chip.
The XC3S1500-4FG456I supports various applications in digital signal processing, embedded systems, and custom hardware solutions.

Manufacturer

The manufacturer of the XC3S1500-4FG456I is Xilinx, Inc., which is a company specializing in the design and development of programmable logic devices, specifically field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and associated software tools. Founded in 1984, Xilinx is known for pioneering the FPGA technology and has established itself as a leader in the semiconductor industry. The company provides solutions for a wide range of applications, including telecommunications, automotive, aerospace, industrial automation, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in high-performance computing and adaptive computing solutions.

Application

The XC3S1500-4FG456I is a Spartan-3 FPGA used in various application areas such as digital signal processing, embedded systems, telecommunications, automotive, industrial automation, and consumer electronics. Its low power consumption and flexibility make it suitable for applications requiring custom logic, high-speed data processing, and rapid prototyping.

Equivalent

The XC3S1500-4FG456I is a Xilinx Spartan-3 FPGA. Equivalent products include the Lattice MachXO3L-256, Intel (Altera) Cyclone IV EP4CE15, and Microchip (Actel) ProASIC3 A3P125. For similar performance, consider the Xilinx Artix-7 series. Always verify specific requirements like I/O count and power consumption when selecting alternatives.

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DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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