XC3S1400A-4FTG256I

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XC3S1400A-4FTG256I

IC FPGA 161 I/O 256FTBGA

  • Fabricant
  • Mfr. Partie #XC3S1400A-4FTG256I
  • Paquet BGA-256
  • Fiche de données
  • En stock4440

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Spécifications

Package Tray
Series Spartan®-3A
ProductStatus Active
NumberofLABs/CLBs 2816
NumberofLogicElements/Cells 25344
TotalRAMBits 589824
NumberofI/O 161
NumberofGates 1400000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 256-LBGA

Vue d'ensemble

Description

The XC3S1400A-4FTG256I is a member of the Spartan-3 family of FPGAs (Field Programmable Gate Arrays) developed by Xilinx. It features a capacity of 1.4 million system gates and is designed for cost-sensitive applications requiring moderate performance. The device operates at a maximum clock frequency of up to 200 MHz, making it suitable for a variety of tasks including digital signal processing, communications, and embedded system designs.
This FPGA is housed in a 256-pin Fine Pitch BGA (FTG) package, facilitating efficient layout and thermal management. The device offers a range of I/O standards, including TTL, LVTTL, and LVCMOS, providing flexibility in interfacing with various peripherals. The XC3S1400A also supports advanced features like configuration memory and enhanced routing options, allowing designers to implement complex logic functions and optimize performance.
Overall, the XC3S1400A-4FTG256I is ideal for applications in consumer electronics, automotive, and industrial sectors, where reliability and efficiency are essential.

Features

The XC3S1400A-4FTG256I is a Spartan-3A FPGA (Field Programmable Gate Array) from Xilinx. Key features include:
1. Logic Cells: It contains around 1,400 logic cells for implementing various digital circuits.
2. I/O Pins: Offers up to 256 user-configurable I/O pins, supporting various signaling standards.
3. Configurable DSP Blocks: Integrated DSP slices for high-performance digital signal processing applications.
4. Memory: Includes block RAM (BRAM) for data storage and management.
5. Embedded Multipliers: Provides efficient multiplication capabilities for arithmetic operations.
6. Low Power Consumption: Designed for power efficiency, suitable for battery-operated devices.
7. Flexible Configuration: Supports multiple configuration modes, including JTAG and serial flash.
8. Development Tools: Compatible with Xilinx ISE tools for design, simulation, and programming.
9. Temperature Grade: Industrial grade (I) for operation in challenging environments.
These features make the XC3S1400A ideal for a variety of applications, including communications, automotive, and consumer electronics.

Package

The XC3S1400A-4FTG256I is packaged in a Fine-Pitch Plastic Ball Grid Array (FBGA) with 256 balls. This type of package provides a compact layout and efficient thermal performance, making it suitable for high-density applications.

Pinout

The XC3S1400A-4FTG256I is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3A series. It features a total pin count of 256 pins. This FPGA is designed for various applications including digital signal processing, embedded systems, and other logic-intensive tasks.
The primary functions of the pins include:
1. I/O Pins: Configurable input/output pins for interfacing with other devices.
2. Power Supply Pins: Pins for VCC and ground (GND) to power the FPGA.
3. Configuration Pins: Pins used to load the FPGA configuration data.
4. Clock Pins: Dedicated clock input pins for synchronizing operations.
5. JTAG Pins: For boundary scan and programming using the JTAG interface.
Overall, the XC3S1400A-4FTG256I provides flexibility and functionality for various digital logic applications, offering a balance of performance and power efficiency.

Manufacturer

The manufacturer of the XC3S1400A-4FTG256I is Xilinx, Inc. Xilinx is a semiconductor company that specializes in the design and production of advanced programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), CPLDs (Complex Programmable Logic Devices), and software tools for hardware development. Founded in 1984, Xilinx has played a significant role in the evolution of programmable logic technology, allowing engineers to create customizable hardware solutions for various applications, including telecommunications, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), expanding its capabilities in the semiconductor industry.

Application

The XC3S1400A-4FTG256I is a Spartan-3 FPGA from Xilinx, commonly used in applications such as digital signal processing, embedded systems, communications, automotive control systems, and video/image processing. Its versatility allows it to support various functionalities, including high-speed data manipulation, protocol conversion, and customized hardware acceleration in consumer electronics, industrial automation, and medical devices.

Equivalent

The XC3S1400A-4FTG256I is a Xilinx Spartan-3 FPGA. Equivalent products include the XC3S1400A-4FG256I (different package), XC3S1500A-4FTG256I (higher density), and other Spartan-3 family members like XC3S200 or XC3S400. Additionally, newer series like the Xilinx Artix-7 or Lattice Semiconductor's ECP5 may serve as alternatives, depending on specific application requirements. Always verify compatibility with your design needs.

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UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

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EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

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