XC3S1400A-4FTG256C

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XC3S1400A-4FTG256C

IC FPGA 161 I/O 256FTBGA

  • Fabricant
  • Mfr. Partie #XC3S1400A-4FTG256C
  • Paquet BGA-256
  • Fiche de données
  • En stock6953

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Spécifications

Package Tray
Series Spartan®-3A
ProductStatus Active
NumberofLABs/CLBs 2816
NumberofLogicElements/Cells 25344
TotalRAMBits 589824
NumberofI/O 161
NumberofGates 1400000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 256-LBGA

Vue d'ensemble

Description

The XC3S1400A-4FTG256C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A series. It features 1,400 logic cells and is designed for cost-sensitive applications requiring moderate performance. The device operates at a maximum clock frequency of 200 MHz and supports various I/O standards, making it versatile for different interfacing needs.
The FPGA is housed in a 256-ball fine-pitch ball grid array (FBGA) package, allowing for a compact design. It includes built-in block RAM for data storage, digital signal processing (DSP) slices for efficient algorithm implementation, and configurable I/O pins for flexible interfacing. The XC3S1400A is ideal for applications in consumer electronics, automotive systems, and industrial automation, where programmable logic can enhance functionality and reduce time-to-market. Its architecture supports design scalability and is compatible with Xilinx's development tools, facilitating easier programming and integration into larger systems.

Features

The XC3S1400A-4FTG256C is a member of the Xilinx Spartan-3A FPGA family, designed for a variety of applications requiring cost-effective, low-power solutions. Key features include:
1. Logic Cells: It offers 1,400 logical cells, providing flexibility for implementing digital circuits.
2. I/O Pins: The device features up to 256 I/O pins, enabling extensive connectivity options.
3. Configurable Logic Blocks (CLBs): Each CLB includes flip-flops and combinatorial functions that can be configured for various designs.
4. DSP Slices: Integrated DSP slices for efficient digital signal processing applications.
5. Memory: Supports both distributed and block RAM, enhancing data storage capabilities.
6. Low Power Consumption: Designed to operate within low power budgets, making it suitable for portable applications.
7. Development Tools: Compatible with Xilinx ISE design tools for ease of development and configuration.
This FPGA is ideal for applications in communications, automotive, industrial, and consumer electronics.

Package

The XC3S1400A-4FTG256C is packaged in a Fine-Pitch BGA (Ball Grid Array) format, specifically a 256-pin TFBGA (Thin Fine Pitch Ball Grid Array) package.

Pinout

The XC3S1400A-4FTG256C is a Spartan-3A FPGA from Xilinx. It features a pin count of 256.
The primary functions of this FPGA include:
1. Configurable Logic Blocks (CLBs): Comprising look-up tables (LUTs) and flip-flops for implementing digital logic.
2. I/O Blocks: Support for various I/O standards, allowing interfacing with different peripherals and devices.
3. Block RAM: Integrated memory blocks for data storage and buffers.
4. Digital Signal Processing (DSP): Capable of executing complex mathematical operations efficiently.
5. Clock Management: Includes dedicated clock management resources for improved timing and performance.
The device is suitable for various applications, including communications, automotive, and industrial control.

Manufacturer

The XC3S1400A-4FTG256C is manufactured by Xilinx, Inc., a leading company in the semiconductor industry. Xilinx specializes in producing programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-chips (SoCs). Founded in 1984, Xilinx is recognized for its innovative contributions to the field of digital design and is particularly known for its FPGA technology, which allows designers to create custom hardware solutions for a wide range of applications, such as telecommunications, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in high-performance computing and adaptive computing solutions.

Application

The XC3S1400A-4FTG256C, a Spartan-3 FPGA, is used in diverse applications such as digital signal processing, telecommunications, automotive systems, industrial automation, and consumer electronics. Its versatility supports tasks like image processing, motor control, and data acquisition, making it suitable for prototyping, embedded systems, and custom hardware solutions.

Equivalent

The XC3S1400A-4FTG256C is a Spartan-3 FPGA from Xilinx. Equivalent products include the XC3S2000 and XC3S1200, also from the Spartan-3 family, which offer similar functionality but with different logic and I/O resources. Additionally, newer families like the Xilinx Artix-7 (e.g., XC7A100T) may serve as alternatives due to improved performance and features. Always consider specific application requirements when selecting an equivalent.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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