XC3S1400A-4FGG484C

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XC3S1400A-4FGG484C

IC FPGA 375 I/O 484FBGA

  • Fabricant
  • Mfr. Partie #XC3S1400A-4FGG484C
  • Paquet BGA-484
  • Fiche de données
  • En stock6604

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Spécifications

Package Tray
Series Spartan®-3A
ProductStatus Active
NumberofLABs/CLBs 2816
NumberofLogicElements/Cells 25344
TotalRAMBits 589824
NumberofI/O 375
NumberofGates 1400000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 484-BBGA

Vue d'ensemble

Description

The XC3S1400A-4FGG484C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A series, designed for cost-sensitive applications requiring moderate performance and flexibility. It features 1,400 logic cells, allowing for a wide range of digital circuit implementations. This FPGA operates at a core voltage of 1.2V and has a maximum performance grade of -4, enabling operation at higher frequencies while maintaining low power consumption.
The device is housed in a 484-pin Fine Pitch Ball Grid Array (FBGA) package, facilitating compact designs. It supports various I/O standards, including LVCMOS, LVTTL, and SSTL, making it versatile for different interfacing needs. The XC3S1400A-4FGG484C is commonly used in applications such as communications, consumer electronics, automotive, and industrial control systems. Its programmability allows for rapid prototyping and design iterations, making it an ideal choice for engineers looking to implement custom logic without the need for ASIC design.

Features

The XC3S1400A-4FGG484C is a Spartan-3A FPGA from Xilinx, designed for a range of applications including communications, automotive, and consumer electronics. Key features include:
- Logic Cells: Approximately 1,400 configurable logic cells, offering flexibility in design.
- I/O Pins: 484-ball FGG package with numerous I/O pins, supporting various voltage levels and interface standards.
- Memory: Embedded block RAM (BRAM) for data storage, along with support for distributed RAM.
- DSP Slices: Efficient DSP (Digital Signal Processing) slices for performance in signal processing applications.
- Power Efficiency: Low power consumption, making it suitable for battery-operated devices.
- Configuration Options: Supports multiple configuration modes, including JTAG and SPI.
- Development Tools: Compatible with Xilinx ISE design suite for streamlined development and implementation.
These features make the XC3S1400A-4FGG484C suitable for diverse applications requiring customizable hardware logic and efficient processing capabilities.

Package

The XC3S1400A-4FGG484C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 484-ball configuration. This type of package provides a high pin count and is suitable for applications requiring compact designs and efficient thermal management.

Pinout

The XC3S1400A-4FGG484C is a Field Programmable Gate Array (FPGA) from the Xilinx Spartan-3A family. It features a pin count of 484 pins.
The primary functions of the FPGA include digital logic implementation, signal processing, and various configurable applications such as communication systems, embedded systems, and custom hardware designs. It offers a blend of programmable logic resources, including Look-Up Tables (LUTs), flip-flops, and I/O blocks, allowing designers to create complex digital circuits tailored to specific performance and functionality requirements. The device operates at a core voltage of 1.2V and supports multiple I/O voltage levels, enhancing compatibility with various external components.

Manufacturer

The manufacturer of the XC3S1400A-4FGG484C is Xilinx, Inc., which is a leading company in the field of programmable logic devices. Xilinx specializes in developing Field Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and System-on-Chip (SoC) solutions. Founded in 1984, Xilinx is known for its innovation in the semiconductor industry, particularly for offering customizable hardware solutions that enable designers to implement specific functions in a flexible and efficient manner. The company is particularly prominent in applications such as telecommunications, automotive, aerospace, and industrial automation. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities and market reach.

Application

The XC3S1400A-4FGG484C is a Spartan-3 FPGA by Xilinx, commonly used in applications such as digital signal processing, communications, automotive systems, industrial automation, and consumer electronics. Its versatility allows for implementation in video processing, embedded systems, robotics, and prototyping of custom hardware solutions. The FPGA's capacity for parallel processing makes it suitable for tasks requiring high performance and rapid data handling.

Equivalent

The XC3S1400A-4FGG484C is a Spartan-3 FPGA from Xilinx. Equivalent products include the XC3S1400A-4FGG484, XC3S1500A, and other Spartan-3 variants like XC3S200 or XC3S400, depending on specific application requirements. For newer technology, consider the Artix-7 series like XC7A100T, which offers enhanced features and performance. Always verify compatibility based on your project specifications.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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