XC3S1000-4FGG676C

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XC3S1000-4FGG676C

IC FPGA 391 I/O 676FBGA

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  • Mfr. Partie #XC3S1000-4FGG676C
  • Paquet
  • Fiche de données
  • En stock2239

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Spécifications

Series Spartan®-3
Part Status Obsolete
DigiKey Programmable Not Verified
Total RAM Bits 442368
Number of I/O 391
Number of Gates 1000000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XC3S1000
Number of Logic Elements/Cells 17280
Number of LABs/CLBs 1920

Vue d'ensemble

Description

The XC3S1000-4FGG676C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family. It features 1,000,000 system gates, making it suitable for a variety of digital designs, including embedded systems, communications, and automotive applications. This chip operates at a maximum clock speed of 200 MHz and offers a range of I/O options, supporting various voltage levels.
With a 676-ball Fine-Pitch Ball Grid Array (FBGA) package, the XC3S1000 integrates a rich set of resources, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and block RAM. It supports multiple design methodologies, including VHDL and Verilog, and is programmable via JTAG.
The device is optimized for low power consumption and high performance, making it ideal for cost-sensitive applications. The Spartan-3 family is known for its balance between performance, power efficiency, and affordability, catering to a broad range of industries and applications.

Features

The XC3S1000-4FGG676C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family. Key features include:
- Capacity: 1,000 logic cells, supporting up to 56,000 system gates.
- I/O: 30 programmable I/O pins with support for various I/O standards including LVTTL, LVCMOS, and SSTL.
- Performance: Maximum clock frequency of approximately 200 MHz.
- Logic Resources: Contains 5,000+ flip-flops and 4,500+ look-up tables (LUTs).
- Block RAM: Features 32 kbits of embedded Block RAM for data storage.
- Configurable Logic Blocks (CLBs): Each CLB consists of a combination of LUTs and flip-flops.
- Power Consumption: Low power consumption, making it suitable for battery-operated applications.
- Package: Available in a 676-pin Fine-Pitch Ball Grid Array (FBGA) form factor.
This FPGA is ideal for applications requiring moderate performance and flexibility, such as digital signal processing, communication systems, and embedded systems design.

Package

The XC3S1000-4FGG676C is a Field Programmable Gate Array (FPGA) from Xilinx, packaged in a Fine Pitch Ball Grid Array (FBGA) format with 676 balls. The "4" indicates the speed grade, and "FGG" denotes the package type.

Pinout

The XC3S1000-4FGG676C is a member of the Xilinx Spartan-3 FPGA family. It has a total pin count of 676. The device features a variety of I/O pins that can be configured for different functions including general-purpose I/O (GPIO), dedicated clock inputs, and configuration signals. The FPGA supports multiple I/O standards and voltages, enabling it to interface with various types of peripherals and components. Additionally, the XC3S1000 includes dedicated pins for power supply, ground, and JTAG for programming and debugging purposes. The configuration of these pins allows the user to optimize the FPGA for specific applications, making it versatile for tasks in digital signal processing, embedded systems, and more.

Manufacturer

The XC3S1000-4FGG676C is manufactured by Xilinx, Inc., a company known for its development of programmable logic devices, including Field Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and System on Chips (SoCs). Xilinx, founded in 1984, is a key player in the semiconductor industry, focusing on providing high-performance, flexible solutions for various applications in telecommunications, automotive, aerospace, and industrial sectors. The company is recognized for its innovative technologies and has been a pioneer in the FPGA market, which allows for customizable hardware solutions that can be reconfigured post-manufacturing. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its influence in the tech industry.

Application

The XC3S1000-4FGG676C is a Spartan-3 FPGA used in various applications, including digital signal processing, automotive systems, industrial automation, telecommunications, and embedded systems. Its versatility allows for implementation in consumer electronics, robotics, and prototyping circuits, enabling custom logic designs, data processing, and interfacing with various peripherals.

Equivalent

The XC3S1000-4FGG676C is a Xilinx Spartan-3 FPGA. Equivalent products include the Xilinx Spartan-6 series (e.g., XC6SLX9), Lattice MachXO2 series, Intel/Altera Cyclone IV (e.g., EP4CE6), and Microsemi SmartFusion2 (e.g., M2S010). Always verify specific requirements like logic cells, I/O, and power consumption before selecting a substitute.

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FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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