XC2V3000-4FF1152I

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XC2V3000-4FF1152I

IC FPGA 720 I/O 1152FCBGA

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Spécifications

Series Virtex®-II
Part Status Obsolete
DigiKey Programmable Not Verified
Total RAM Bits 1769472
Number of I/O 720
Number of Gates 3000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Base Product Number XC2V3000
Number of LABs/CLBs 3584

Vue d'ensemble

Description

The XC2V3000-4FF1152I is a field-programmable gate array (FPGA) from Xilinx's Virtex-II series, designed for high-performance applications. It features 3,000 logic cells, which can be configured to implement a wide range of digital circuits. The "4" in the part number indicates the speed grade, with a faster performance compared to lower grades.
The package type "FF1152" refers to a Fine Pitch Ball Grid Array (FBGA) with 1,152 balls, allowing for a compact design and efficient heat dissipation. The "I" at the end signifies the industrial temperature range, making it suitable for applications in harsh environments.
Key features include high-speed performance, advanced DSP capabilities, and support for multiple I/O standards. The XC2V3000 is commonly used in telecommunications, automotive, and aerospace applications, where flexibility and reliability are crucial. Its programmability allows for rapid prototyping and design iterations, making it a popular choice among engineers and developers.

Features

The XC2V3000-4FF1152I is a Field Programmable Gate Array (FPGA) from Xilinx's Virtex-II series. Key features include:
1. Logic Cells: It contains approximately 3,000 logic cells, which allow for complex digital designs.
2. Embedded Memory: Up to 128 Kbits of block RAM facilitates efficient data storage and manipulation.
3. I/O Capabilities: Supports up to 152 user-configurable I/O pins with various voltage levels.
4. High Performance: Operates at a maximum clock frequency of around 200 MHz, enabling fast processing.
5. Configurable Resources: Includes DSP slices for high-performance arithmetic operations.
6. Power Management: Designed for low power consumption, suitable for portable applications.
7. Package: Housed in a Fine Pitch Ball Grid Array (FBGA) package for compact integration.
8. Development Support: Compatible with Xilinx development tools for design, simulation, and debugging.
This combination of features makes the XC2V3000-4FF1152I suitable for a wide range of applications, from telecommunications to embedded systems.

Package

The XC2V3000-4FF1152I is packaged in a Fine-Pitch Flip Chip (FF) format with a 1152-ball grid array. This type of package is designed for high-density applications and provides efficient thermal performance and signal integrity.

Pinout

The XC2V3000-4FF1152I is a Field Programmable Gate Array (FPGA) from the Xilinx Virtex-II series. It features a pin count of 1,152 pins.
The device is designed for high-performance applications and includes various functionalities such as configurable logic blocks, digital signal processing (DSP) slices, embedded memory, and multiple I/O options. The "4" in the part number indicates the speed grade, which affects performance characteristics. The "FF" indicates the package type, which is a Fine Pitch Ball Grid Array (FBGA). The "I" at the end signifies that it is an industrial-grade part, suitable for extended temperature ranges.
Overall, the XC2V3000-4FF1152I is suitable for applications requiring high levels of integration and flexibility in logic design.

Manufacturer

The XC2V3000-4FF1152I is manufactured by Xilinx, Inc. Xilinx is a semiconductor company that specializes in the design and production of programmable logic devices, including Field Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and software development tools. Founded in 1984, Xilinx is known for pioneering the FPGA technology and has become a crucial player in various industries, including telecommunications, automotive, aerospace, and consumer electronics. The company focuses on providing flexible hardware solutions that enable engineers to create customizable applications, catering to the demands of modern electronic design. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its capabilities and market reach.

Application

The XC2V3000-4FF1152I is a field-programmable gate array (FPGA) from Xilinx, commonly used in applications such as digital signal processing, telecommunications, embedded systems, video processing, and industrial control. Its versatility allows for custom hardware solutions in areas like aerospace, automotive, and consumer electronics, enabling rapid prototyping and design flexibility.

Equivalent

The XC2V3000-4FF1152I is a Virtex-II FPGA by Xilinx. Equivalent products include the Altera Stratix series (e.g., EP1S40), Lattice ECP2, and Microsemi SmartFusion FPGAs. When considering alternatives, focus on similar logic density, I/O capabilities, and performance characteristics. Always verify specific requirements and features for compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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