XC2S50-5FG256C

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XC2S50-5FG256C

IC FPGA 176 I/O 256FBGA

  • Fabricant
  • Mfr. Partie #XC2S50-5FG256C
  • Paquet BGA256
  • Fiche de données
  • En stock3532

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Spécifications

Package Tray
Series Spartan®-II
ProductStatus Active
NumberofLABs/CLBs 384
NumberofLogicElements/Cells 1728
TotalRAMBits 32768
NumberofI/O 176
NumberofGates 50000
Voltage-Supply 2.375V ~ 2.625V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 256-BGA

Vue d'ensemble

Description

The XC2S50-5FG256C is a member of the Xilinx Spartan-2 FPGA family, designed for cost-sensitive applications requiring moderate logic capacity and low power consumption. It features 50,000 logic cells, making it suitable for various digital designs, including telecommunications, automotive, and industrial applications.
The device is packaged in a Fine-Pitch Ball Grid Array (FBGA) format with 256 balls, allowing for high-density connections. The Spartan-2 architecture includes dedicated memory blocks, digital signal processing (DSP) slices, and a range of I/O standards, providing versatility in design.
With a maximum operating frequency of 200 MHz and support for various development tools, the XC2S50-5FG256C allows designers to implement complex algorithms and functionalities efficiently. It is particularly valued for its balance of performance, flexibility, and cost, making it a popular choice for embedded systems and prototyping in various electronic applications.

Features

The XC2S50-5FG256C is a member of Xilinx's Spartan-2 FPGA family, designed for various digital logic applications. Key features include:
1. Logic Cells: 50,000 system gates, with a rich set of configurable logic blocks.
2. I/O Pins: 256 I/O pins, supporting various voltage standards.
3. Performance: Operates at a maximum clock frequency of up to 200 MHz, depending on design complexity.
4. Configurable Resources: Includes dedicated RAM blocks and multiplier blocks for efficient data processing.
5. Power Consumption: Low power operation, making it suitable for battery-powered devices.
6. Development Tools: Compatible with Xilinx ISE software for design implementation and verification.
7. Package: Available in a Fine-Pitch Ball Grid Array (FBGA) package, facilitating compact designs.
8. Temperature Range: Supports industrial-grade temperature ranges, enhancing reliability in various environments.
The XC2S50-5FG256C is ideal for applications in communications, automotive, industrial control, and consumer electronics.

Package

The XC2S50-5FG256C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 256-ball configuration. This package type provides a compact design and facilitates efficient thermal management and signal integrity for the FPGA.

Pinout

The XC2S50-5FG256C is a Spartan-2 FPGA from Xilinx with a pin count of 256. This device features a variety of I/O pins that support different voltage levels and standards, allowing for flexible interfacing with other components.
The primary functions of the XC2S50-5FG256C include:
1. Programmable Logic: It provides configurable logic blocks (CLBs) for implementing custom digital logic.
2. I/O Functionality: Supports multiple I/O standards and configurations, enabling connections to various peripheral devices.
3. Memory Interfaces: Capable of interfacing with RAM and other memory types.
4. Dedicated Features: Includes digital signal processing (DSP) blocks, RAM blocks, and configuration interfaces for programming.
This FPGA is designed for a range of applications, including telecommunications, automotive, and consumer electronics.

Manufacturer

The XC2S50-5FG256C is manufactured by Xilinx, Inc., a company known for designing and producing programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), CPLDs (Complex Programmable Logic Devices), and associated software tools. Founded in 1984, Xilinx is a pioneer in the field of programmable logic and has played a significant role in the advancement of digital design technologies. The company serves a wide range of industries, including telecommunications, automotive, aerospace, and consumer electronics, providing solutions that enable customers to create customized hardware for various applications. Xilinx was acquired by Advanced Micro Devices (AMD) in 2022, enhancing its portfolio in high-performance computing and adaptive computing solutions.

Application

The XC2S50-5FG256C is a Xilinx Spartan-2 FPGA used in various application areas, including digital signal processing, communication systems, robotics, automotive electronics, industrial automation, and consumer electronics. Its versatility allows for custom logic implementation, efficient data handling, and integration of multiple functions in a compact form, making it suitable for prototyping and low-volume production in diverse fields.

Equivalent

The XC2S50-5FG256C is a Spartan-2 FPGA from Xilinx. Equivalent products include:
1. XC3S50-5FG256C - Spartan-3 series
2. Lattice iCE40 LP1K - Lattice Semiconductor
3. Altera/Intel EP2S15 - Stratix II series
These alternatives can provide similar logic capacity and performance, but ensure to verify specific requirements for compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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