XC2S200-5FGG256I

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XC2S200-5FGG256I

IC FPGA 176 I/O 256FBGA

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  • Mfr. Partie #XC2S200-5FGG256I
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  • Fiche de données
  • En stock7271

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Spécifications

Series Spartan®-II
Part Status Obsolete
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 5292
Total RAM Bits 57344
Number of I/O 176
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17x17)
Base Product Number XC2S200
Number of LABs/CLBs 1176
Number of Gates 200000

Vue d'ensemble

Description

The XC2S200-5FGG256I is a field-programmable gate array (FPGA) from Xilinx's Spartan-2 family. It features 200,000 system gates and is designed for cost-sensitive applications requiring moderate performance and efficiency. The device comes in a 256-pin Fine Pitch Ball Grid Array (FBGA) package, facilitating compact designs.
Key specifications include a maximum operating frequency of 200 MHz, 56 I/O pins, and support for various I/O standards such as LVTTL and LVCMOS. The FPGA architecture allows for flexible hardware configurations, enabling users to customize functionality post-manufacturing.
Ideal applications include digital signal processing, communications, and control systems. The XC2S200 is often utilized in embedded systems and consumer electronics where adaptability and integration of multiple functions into a single chip are crucial. Overall, it combines a balance of performance, flexibility, and cost-effectiveness, making it popular among engineers for prototyping and production designs.

Features

The XC2S200-5FGG256I is a member of the Xilinx Spartan-2 FPGA family, designed for high-performance applications. Key features include:
1. Logic Cells: It contains 200,000 system gates and 4,000 logic cells, providing flexibility for various designs.
2. I/O Pins: The device has up to 256 I/O pins, supporting multiple signaling standards.
3. Speed Grade: The "-5" denotes a speed grade, indicating a performance optimized for faster operation.
4. Configuration: It supports various configuration modes, including JTAG and slave serial.
5. Memory: Includes distributed RAM and support for larger external memory interfacing.
6. Power Consumption: Optimized for low power, making it suitable for battery-powered applications.
7. Development Tools: Compatible with Xilinx development environments for design and verification.
Overall, the XC2S200-5FGG256I is suitable for a variety of applications, including telecommunications, automotive, and consumer electronics, providing a balance of performance, flexibility, and cost-effectiveness.

Package

The XC2S200-5FGG256I is packaged in a Fine-Pitch Ball Grid Array (FBGA) format, specifically with 256 balls. This package type offers a compact design and efficient thermal performance, suitable for high-density applications.

Pinout

The XC2S200-5FGG256I is a Spartan-2 FPGA from Xilinx with a pin count of 256. It features multiple I/O pins that support various functions, including general-purpose I/O, dedicated clock inputs, and configuration pins. The device is designed for high-performance applications and supports a wide range of interfacing options, making it suitable for various digital logic designs. The "5" in the part number indicates the speed grade, with "-5" representing a maximum operating frequency of 200 MHz. The "I" at the end signifies that it is a commercial-grade device with standard temperature specifications. Overall, the XC2S200-5FGG256I provides flexibility and scalability for diverse applications in embedded systems, digital signal processing, and more.

Manufacturer

The XC2S200-5FGG256I is manufactured by Xilinx, Inc., a company known for designing and producing programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-chip (SoC) solutions. Founded in 1984 and headquartered in San Jose, California, Xilinx is a leader in the semiconductor industry, particularly in the domain of adaptive and intelligent computing technologies. Their products are widely used in various applications such as telecommunications, automotive, aerospace, defense, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its reach and capabilities in the market.

Application

The XC2S200-5FGG256I is a Spartan-2 FPGA from Xilinx, commonly used in areas such as digital signal processing, telecommunications, automotive systems, industrial automation, and embedded systems. Its flexibility allows for applications in video processing, data acquisition, and control systems, making it suitable for both prototyping and production in various electronic designs.

Equivalent

The XC2S200-5FGG256I is a Xilinx Spartan-2 FPGA. Equivalent products include:
1. Lattice MachXO2-256 - Similar low-density FPGA.
2. Altera MAX 10 - Low-power, low-cost FPGA options.
3. Lattice ispLEVER - Another comparable low-density FPGA family.
Always verify specific features and compatibility for your application before substitution.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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