XA6SLX25-2CSG324Q

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XA6SLX25-2CSG324Q

IC FPGA 226 I/O 324CSBGA

  • Fabricant
  • Mfr. Partie #XA6SLX25-2CSG324Q
  • Paquet
  • Fiche de données
  • En stock2840

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Spécifications

Series Spartan®-6 LX XA
Part Status Active
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 24051
Total RAM Bits 958464
Number of I/O 226
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 324-LFBGA, CSPBGA
Supplier Device Package 324-CSPBGA (15x15)
Base Product Number XA6SLX25
Number of LABs/CLBs 1879
Grade Automotive
Qualification AEC-Q100

Vue d'ensemble

Description

The XA6SLX25-2CSG324Q is a member of the Xilinx Spartan-6 FPGA family, designed for low-cost, low-power applications. It features 25,000 logic cells, making it suitable for a variety of applications including consumer electronics, automotive, and industrial automation. The device is implemented in a 324-ball CSP (Chip Scale Package) form factor, which provides a compact footprint for space-constrained designs.
With programmable logic, DSP capabilities, and multiple I/O options, the XA6SLX25-2CSG324Q supports a wide range of digital signal processing applications. The architecture allows for efficient power management and high performance, with support for various communication protocols. It also includes integrated features like block RAM and configurable I/O standards, facilitating flexible design implementations.
Overall, the XA6SLX25-2CSG324Q is well-suited for developers seeking a versatile and cost-effective FPGA solution for diverse electronic projects.

Features

The XA6SLX25-2CSG324Q is a device from Xilinx's Spartan-6 FPGA family. Key features include:
1. Logic Cells: It contains 25,000 logic cells, allowing for complex design implementations.
2. I/O Capabilities: Supports up to 88 user I/O pins, facilitating various interfacing options.
3. DSP Slices: Equipped with 20 DSP slices for high-performance signal processing.
4. Block RAM: Includes 1.5 Mbits of dedicated Block RAM for efficient data storage.
5. Configurable I/O Standards: Supports multiple I/O standards including LVTTL, LVCMOS, and others, providing flexibility in interfacing.
6. Low Power: Designed for low power consumption, making it suitable for portable applications.
7. Integrated Configuration Support: Features JTAG and serial configuration options for ease of programming.
8. Temperature Range: Available in industrial temperature range options, enhancing reliability in demanding environments.
This FPGA is ideal for applications in communications, automotive, and industrial automation.

Package

The XA6SLX25-2CSG324Q is packaged in a 324-ball Fine Pitch Ball Grid Array (FBGA) form factor. This type of package is designed for efficient thermal performance and space-saving on printed circuit boards.

Pinout

The XA6SLX25-2CSG324Q is a member of the Xilinx Artix-7 FPGA family, specifically designed for low-power applications. It features a total pin count of 324. This FPGA is part of the 7 Series and offers a combination of logic cells, DSP slices, and I/O capabilities.
The primary functions of the FPGA include:
1. Configurable Logic Blocks (CLBs): Used for implementing digital logic.
2. Digital Signal Processing (DSP): Provides dedicated resources for high-performance arithmetic operations.
3. Memory: Embedded block RAM (BRAM) for data storage.
4. I/O Pins: Configurable for various interfaces, including LVDS, SPI, UART, etc.
5. Clock Management: Clock resources for managing timing and synchronization.
This FPGA is suitable for applications in communications, automotive, and industrial control, among others, due to its scalable performance and efficiency.

Manufacturer

The manufacturer of the XA6SLX25-2CSG324Q is Xilinx, Inc., which is a semiconductor company known for producing programmable logic devices, including Field-Programmable Gate Arrays (FPGAs) and Complex Programmable Logic Devices (CPLDs). Xilinx specializes in adaptive computing solutions and is recognized for its innovations in the FPGA market. The company was founded in 1984 and has played a significant role in the advancement of digital technology across various industries, including telecommunications, automotive, aerospace, and industrial applications. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in high-performance computing and adaptive processing.

Application

The XA6SLX25-2CSG324Q is a Spartan-6 FPGA from Xilinx, suitable for various applications, including digital signal processing, embedded systems, video and image processing, automotive electronics, communications, and industrial automation. Its low power consumption and flexibility make it ideal for applications requiring real-time data processing and interfacing with sensors or other hardware.

Equivalent

The XA6SLX25-2CSG324Q chip is a Xilinx Spartan-6 FPGA. Equivalent products include the Lattice ECP5 series, Intel (formerly Altera) Cyclone IV FPGA, and Microsemi SmartFusion2. For specific applications, consider other Spartan-6 variants or newer families like Xilinx Artix-7. Always verify specifications and compatibility for your project needs.

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FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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