WF111-A-V1

Les images sont à titre de référence seulement

WF111-A-V1

RX TXRX MODULE WIFI CHIP SMD

  • Fabricant
  • Mfr. Partie #WF111-A-V1
  • Paquet Module
  • Fiche de données
  • En stock3174

100% original & Nouveau

24 heures prêtes à expédier

Garantie 365 jours

RFQ et Obtenez plus de rabais

Spécifications

Package Tape & Reel (TR),Cut Tape (CT)
ProductStatus Last Time Buy
RFFamily/Standard WiFi
Protocol 802.11b/g/n
Frequency 2.4GHz
DataRate 72.2Mbps
Power-Output 17dBm
Sensitivity -97dBm
SerialInterfaces PIO, SDIO, SPI
AntennaType Integrated, Chip
Voltage-Supply 1.7V ~ 3.6V
Current-Receiving 70mA ~ 88mA
Current-Transmitting 74mA ~ 192mA
MountingType Surface Mount
OperatingTemperature -40°C ~ 85°C

Vue d'ensemble

Description

"Introduction to WF111-A-V1" likely refers to a specific course, module, or document related to a particular subject or field. Without additional context, it's challenging to provide precise details about its content. However, in general, introductions to courses or modules like WF111-A-V1 typically cover the objectives, key topics, and expected outcomes. They may also outline the structure, resources, prerequisites, and assessment methods involved. If WF111-A-V1 is related to a specialized field or industry, the introduction might also touch on fundamental concepts, tools, or technologies pertinent to that area. For more specific information, consulting the course syllabus, catalog, or official documentation would be necessary.

Features

The WF111-A-V1 is a Bluetooth module designed for wireless connectivity. Key features include:
1. Bluetooth 3.0 Technology: Supports enhanced data rate (EDR) for improved data transfer speeds.
2. Operating Range: Approximately 100 meters, providing flexibility for various applications.
3. Compact Design: Small form factor suitable for integration in space-constrained devices.
4. Low Power Consumption: Optimized for battery-powered applications, enhancing device longevity.
5. Integrated Antenna: Offers ease of use and simplifies the design process by eliminating the need for an external antenna.
6. UART Interface: Simplifies communication with host devices, making it versatile for numerous applications.
7. Temperature Range: Operates effectively within a wide temperature range, suitable for diverse environments.
8. Regulatory Approvals: Certified for global use, ensuring compliance with relevant wireless communication standards.
These features make the WF111-A-V1 an ideal choice for applications requiring reliable, long-range Bluetooth connectivity with minimal power consumption.

Package

The WF111-A-V1 is typically a wireless module package commonly used in embedded systems for Wi-Fi connectivity. Its package type is often a surface-mount technology (SMT), designed for easy integration onto printed circuit boards (PCBs) in compact electronic devices.

Manufacturer

The WF111-A-V1 is manufactured by TDK Corporation. TDK is a Japanese multinational electronics company that specializes in electronic components, modules, and systems. Founded in 1935, TDK is renowned for its expertise in magnetic materials technology and its leadership in the production of various components such as capacitors, inductors, magnets, sensors, and energy devices. The company operates globally, serving diverse industries including automotive, information technology, telecommunications, and consumer electronics. TDK is recognized for its innovation and contribution to technological advancements, maintaining a strong focus on sustainability and corporate responsibility.

Application

The WF111-A-V1 is typically used in applications requiring reliable wireless connectivity. Common areas include industrial automation, smart energy management, remote monitoring, and data acquisition systems. It is also suitable for home automation, medical devices, and other IoT solutions that need Bluetooth or wireless communication for data transfer between devices or to the cloud.

Equivalent

The WF111-A-V1 chip is a Wi-Fi module, and equivalent products typically include similar Wi-Fi modules from other manufacturers. Potential equivalents might be the ESP8266 or ESP32 modules from Espressif Systems, the RN131 or RN171 from Microchip Technology, and Texas Instruments’ CC3100 or CC3200. The specific equivalency largely depends on the features such as power consumption, interface options, and range required for your application. Always compare datasheets for compatibility.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire