W631GU6NB-11

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W631GU6NB-11

IC DRAM 1GBIT PAR 96VFBGA

  • Fabricant
  • Mfr. Partie #W631GU6NB-11
  • Paquet
  • Fiche de données
  • En stock6900

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Spécifications

Part Status Obsolete
Base Product Number W631GU6
DigiKey Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3L
Memory Size 1Gbit
Memory Organization 64M x 16
Memory Interface Parallel
Clock Frequency 933 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.283V ~ 1.45V, 1.425V ~ 1.575V
Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount
Package 96-VFBGA
Supplier Device Package 96-VFBGA (7.5x13)
Packaging Tray
Access Time 20 ns

Vue d'ensemble

Description

The W631GU6NB-11 is a specific model of DRAM (Dynamic Random-Access Memory) chip produced by a semiconductor manufacturer. It typically features a DDR3 or DDR4 technology, which indicates its generation and performance characteristics. This memory chip is designed for use in a variety of applications, including computers, servers, and embedded systems, where efficient data processing and storage are required.
Key specifications may include data rate, capacity (often available in several gigabyte options), power consumption, and operational voltage. These chips are essential for enhancing system performance by providing fast and reliable temporary storage for active data. The "11" in the model number could signify a specific version or manufacturing batch, influencing compatibility and performance metrics.
When considering the W631GU6NB-11 for a project or system upgrade, it's crucial to review the compatibility with the motherboard and other components to ensure optimal performance.

Features

The W631GU6NB-11 is a versatile electronic component often used in various applications. Key features typically include:
1. High Performance: Designed for efficient operation, offering reliable performance in demanding environments.
2. Compact Design: Its small footprint allows for easy integration into different systems without requiring excessive space.
3. Durability: Built to withstand harsh conditions, ensuring longevity and reduced maintenance needs.
4. Power Efficiency: Optimized for low power consumption, making it eco-friendly and cost-effective.
5. Versatile Connectivity: Supports multiple communication protocols, facilitating seamless integration with existing systems.
6. User-Friendly Interface: Features intuitive controls and indicators for ease of operation and monitoring.
7. Enhanced Security: Incorporates advanced security features to protect against unauthorized access and data breaches.
These attributes make the W631GU6NB-11 suitable for a wide range of applications, from industrial to consumer electronics.

Package

The W631GU6NB-11 is a DDR3 SDRAM memory chip that typically comes in a 78-ball TFBGA (Thin Fine-pitch Ball Grid Array) package type. This package type is designed for compact space and efficient thermal performance in electronic devices.

Pinout

The W631GU6NB-11 is a DDR3 SDRAM memory chip manufactured by Winbond. It comes in a 78-ball FBGA (Fine Ball Grid Array) package. The chip features a pin count of 78 balls, with each ball serving different functions related to the operation of the memory module, including data inputs/outputs, address lines, control signals, and power supply connections.
Key functions of some pins include:
- Data Pins (DQ0-DQ31): Used for data transfer.
- Address Pins (A0-A14): Define the address of the memory location to be accessed.
- Control Pins (CS, RAS, CAS, WE): Manage read/write operations, chip selection, and row/column addressing.
- Power Pins (VDD, VSS): Supply power to the chip.
This configuration allows for efficient data processing and high-speed memory performance suitable for various applications in computing.

Manufacturer

The W631GU6NB-11 is manufactured by Winbond Electronics Corporation, a company based in Taiwan. Winbond specializes in semiconductor manufacturing, particularly memory products such as DRAM and Flash memory. Established in 1987, the company is known for producing a wide range of memory solutions that serve various applications, including consumer electronics, automotive, and industrial sectors. Winbond is recognized for its commitment to innovation and quality in the semiconductor industry.

Application

The W631GU6NB-11 is a low-power, high-performance SRAM chip commonly used in applications such as mobile devices, embedded systems, automotive electronics, and consumer electronics. Its features make it suitable for cache memory, data buffering, and temporary storage in applications requiring fast access and low latency.

Equivalent

The W631GU6NB-11 is a DDR3 SDRAM memory chip. Equivalent products typically include other DDR3 SDRAM chips with similar specifications, such as the Hynix H5TQ2G83AFR, Micron MT41K256M16HA-125, and Samsung K4B4G0846F-BCK0. Always verify compatibility with your specific application and system requirements before replacement.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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