TPS82740BSIPR

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TPS82740BSIPR

DC DC CONVERTER 2.6-3.3V 0.66W

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Spécifications

Series MicroSip™
Part Status Active
Base Product Number TPS82740
Type Non-Isolated PoL Module
Number of Outputs 1
Voltage - Input (Min) 2.2V
Voltage - Input (Max) 5.5V
Voltage - Output 1 2.6 ~ 3.3V
Current - Output (Max) 200mA
Applications ITE (Commercial)
Features Remote On/Off, OCP, UVLO
Operating Temperature -40°C ~ 85°C
Efficiency 90%
Mounting Type Surface Mount
Package 9-TBGA Module
Size / Dimension 0.12" L x 0.09" W x 0.04" H (3.0mm x 2.4mm x 1.0mm)
Supplier Device Package 9-USIP
Packaging Cut Tape (CT), Tape & Reel (TR)

Vue d'ensemble

Description

The TPS82740BSIPR is a microSiP DC-DC step-down power module designed by Texas Instruments. It integrates a high-efficiency buck converter with an inductor and passive components into a compact package, making it suitable for space-constrained applications. Operating with input voltages from 2.3V to 5.5V, it can provide adjustable output voltages down to 0.8V, with a maximum output current of 2A.
Key features include a high efficiency (up to 95%), minimal external components, and a small footprint, which is particularly advantageous for portable and battery-powered devices. The module also includes built-in protection features such as thermal shutdown and current limit, enhancing reliability in various applications including industrial, consumer electronics, and IoT devices.
The TPS82740BSIPR is housed in a 7.0 mm x 7.0 mm x 1.6 mm package, promoting ease of integration into designs while minimizing PCB space. Overall, it is an ideal solution for designers seeking a compact and efficient power supply for their electronic products.

Features

The TPS82740BSIPR is a highly integrated power module from Texas Instruments designed for DC-DC conversion. Key features include:
1. Input Voltage Range: Operates from 2.5V to 5.5V, suitable for a variety of applications.
2. Output Voltage: Adjustable output voltage from 0.8V to 3.6V.
3. Efficiency: High efficiency (up to 95%) across a wide load range, minimizing heat generation.
4. Output Current: Capable of delivering up to 3A of continuous output current.
5. Compact Package: Available in a small 7 mm x 7 mm QFN package, ideal for space-constrained designs.
6. Integrated Inductor: Combines a power inductor with other components, simplifying design and reducing board space.
7. Thermal Protection: Features thermal shutdown to protect against overheating.
8. Power Good Indicator: Includes a power good flag for monitoring output status.
This module is suitable for a range of applications, including portable devices, industrial equipment, and point-of-load power supplies.

Package

The TPS82740BSIPR is packaged in a SIP (System-in-Package) format, specifically a 10-pin SIP package. This compact design integrates multiple components into a single package, optimizing space for applications requiring a DC-DC power module.

Pinout

The TPS82740BSIPR is a MicroSiP DC-DC step-down power module from Texas Instruments. It features a pin count of 10 pins.
The pin functions are as follows:
1. VIN: Input voltage.
2. GND: Ground connection.
3. VOUT: Output voltage.
4. FB: Feedback pin for output voltage regulation.
5. SW: Switch node for connecting to the inductor.
6. CSN: Current sense negative input.
7. CSP: Current sense positive input.
8. COMP: Compensation network connection.
9. EN: Enable pin to turn the device on/off.
10. PG: Power good indicator pin.
This module is designed for efficient power management in compact applications, providing high performance with a small footprint.

Manufacturer

The TPS82740BSIPR is manufactured by Texas Instruments (TI), a global semiconductor company based in the United States. Texas Instruments specializes in designing and manufacturing a wide range of analog and digital semiconductor solutions, including integrated circuits, processors, and various other electronic components. The company is well-known for its innovations in the field of analog and embedded processing technologies, serving diverse markets such as automotive, industrial, communications, and consumer electronics. TI is recognized for its high-quality products, strong research and development capabilities, and commitment to sustainability and innovation in the electronics industry.

Application

The TPS82740BSIPR is a microSiP DC-DC step-down power module designed for applications requiring efficient power management. It is suitable for powering microcontrollers, FPGAs, sensors, and other low-power devices in consumer electronics, industrial automation, IoT devices, and telecommunications. Its compact size and integrated components make it ideal for space-constrained designs.

Equivalent

The TPS82740BSIPR is a microSiP DC-DC step-down power module. Equivalent products include the LT8640S by Analog Devices, the LM2596 by Texas Instruments, and the MP1584 by Monolithic Power Systems. These alternatives offer similar voltage regulation features, efficiency, and applications in compact power designs. Be sure to check specifications for exact compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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