TLV9001SIDCKR

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TLV9001SIDCKR

IC CMOS 1 CIRCUIT SC70-6

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  • Mfr. Partie #TLV9001SIDCKR
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Spécifications

Part Status Active
Amplifier Type CMOS
Number of Circuits 1
Output Type Rail-to-Rail
Slew Rate 2V/µs
Current - Input Bias 5 pA
Voltage - Input Offset 400 µV
Current - Supply 60µA
Current - Output / Channel 40 mA
Voltage - Supply Span (Min) 1.8 V
Voltage - Supply Span (Max) 5.5 V
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 6-TSSOP, SC-88, SOT-363
Supplier Device Package SC-70-6
Base Product Number TLV9001
Gain Bandwidth Product 1 MHz

Vue d'ensemble

Description

The TLV9001SIDCKR is a precision, low-power operational amplifier (op-amp) designed by Texas Instruments. It is part of the TLV9001 series, known for its high performance and versatility in various applications, including signal conditioning, data acquisition, and sensor interfacing.
Key features include a low supply voltage (1.8V to 5.5V), low input bias current, and a rail-to-rail output, allowing it to maximize dynamic range. The op-amp offers a high gain bandwidth product and low total harmonic distortion, making it suitable for audio and other high-fidelity applications.
The "SIDCKR" designation indicates that this specific variant comes in a small, compact package (SOT-23) suitable for space-constrained designs, facilitating easy integration into printed circuit boards (PCBs). Its low quiescent current makes it ideal for battery-powered applications. Overall, the TLV9001SIDCKR combines performance, efficiency, and compactness, making it an excellent choice for both consumer and industrial electronic devices.

Features

The TLV9001SIDCKR is a low-power, precision operational amplifier designed for various applications. Key features include:
1. Low Supply Current: Consumes only 150 µA, making it suitable for battery-powered devices.
2. Rail-to-Rail Output: Provides output voltage close to the supply rails, maximizing signal range.
3. Wide Supply Voltage Range: Operates from 2.7 V to 16 V, supporting diverse applications.
4. Low Offset Voltage: Typically 0.5 mV, ensuring high accuracy in signal processing.
5. High Gain Bandwidth Product: Approximately 1 MHz, allowing for good performance in frequency response.
6. Low Input Bias Current: Typically 5 pA, which is beneficial for high-impedance applications.
7. Temperature Range: Operates over a wide temperature range from -40°C to +125°C, suitable for harsh environments.
8. Small Package: Available in a SOT-23 package, enabling compact designs.
These features make the TLV9001 ideal for applications like sensor signal conditioning, audio processing, and portable instrumentation.

Package

The TLV9001SIDCKR is packaged in a SOT-23-5 (Small Outline Transistor) format. This package type is compact and suitable for surface-mount applications, featuring five pins for easy integration into electronic circuits.

Pinout

The TLV9001SIDCKR is a single-supply, operational amplifier with a total of 8 pins. Its pin configuration and functions are as follows:
1. Pin 1 (Offset Null): Used to adjust the offset voltage.
2. Pin 2 (Inverting Input, V−): The inverting input terminal for the op-amp.
3. Pin 3 (Non-Inverting Input, V+): The non-inverting input terminal for the op-amp.
4. Pin 4 (Output): The output terminal where the amplified signal is provided.
5. Pin 5 (Power Supply, V−): Connects to the negative power supply or ground.
6. Pin 6 (Power Supply, V+ or VCC): Connects to the positive power supply.
7. Pin 7 (NC): No connection; not internally connected.
8. Pin 8 (NC): No connection; not internally connected.
This amplifier is known for its low power consumption and wide bandwidth, making it suitable for a variety of applications in signal conditioning and amplification.

Manufacturer

The TLV9001SIDCKR is manufactured by Texas Instruments (TI), a leading global semiconductor company. Texas Instruments designs and produces a wide range of analog and embedded processing chips, including operational amplifiers, microcontrollers, and digital signal processors. Founded in 1930, TI is known for its innovation in electronics and technology solutions across various industries, including automotive, industrial, consumer electronics, and communications. The company emphasizes research and development to provide high-performance products that meet the needs of engineers and designers worldwide. Additionally, TI is recognized for its commitment to sustainability and corporate responsibility.

Application

The TLV9001SIDCKR is a low-power, high-speed operational amplifier commonly used in applications such as signal conditioning, data acquisition, active filters, audio amplifiers, and sensor interfaces. Its features make it suitable for portable devices, battery-operated equipment, and precision measurement systems, where low power consumption and high performance are essential.

Equivalent

The TLV9001SIDCKR is a low-power, precision operational amplifier. Equivalent products include the MCP602, LM358, and OPA2134. Each of these alternatives offers similar characteristics like low noise, low offset voltage, and low power consumption, making them suitable substitutes depending on specific application requirements. Always verify the specific parameters such as supply voltage, bandwidth, and package type to ensure compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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