TLSR8269F512ET32

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TLSR8269F512ET32

RF System on a Chip - SoC BLE

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Vue d'ensemble

Description

The TLSR8269F512ET32 is a highly integrated System-on-Chip (SoC) designed for low-power IoT applications. It features a 32-bit ARM Cortex-M4 processor with a floating-point unit, enabling efficient computation and processing capabilities. The chip includes 512KB of flash memory and 128KB of SRAM, providing ample storage for applications.
Key features include support for Bluetooth Low Energy (BLE) connectivity, a range of peripherals such as UART, SPI, I2C, and ADC, making it versatile for various IoT devices. It operates with a low power consumption profile, making it suitable for battery-operated devices.
The TLSR8269F512ET32 is ideal for applications in smart home devices, wearables, health monitoring systems, and industrial automation. Its combination of processing power, memory capacity, and connectivity options positions it as a robust choice for developers looking to create efficient and responsive IoT solutions.

Features

The TLSR8269F512ET32 is a Bluetooth 5.0 System-on-Chip (SoC) designed for low-power, high-performance applications. Key features include:
1. 512 KB Flash Memory: Ample storage for complex applications.
2. 64 KB RAM: Supports multitasking and efficient data handling.
3. Ultra-Low Power Consumption: Optimized for battery-operated devices, extending operational life.
4. Integrated RF Transceiver: Supports BLE 5.0 for reliable wireless connectivity.
5. ARM Cortex-M4 Core: Delivers high processing capability with DSP instructions for enhanced signal processing.
6. Multiple I/O Interfaces: Includes GPIO, UART, SPI, I2C, and PWM for versatile connectivity options.
7. On-chip ADC: Facilitates analog signal processing for sensor applications.
8. Flexible Power Management: Supports various sleep modes to conserve energy.
9. Robust Security Features: Includes hardware encryption to secure data transmission.
This combination of features makes the TLSR8269F512ET32 suitable for IoT devices, wearables, and smart home applications.

Package

The TLSR8269F512ET32 is packaged in a QFN (Quad Flat No-lead) type, specifically a 32-pin QFN package. This compact package type is designed for efficient thermal performance and space-saving in electronic applications.

Pinout

The TLSR8269F512ET32 is a microcontroller from the TLSR8 series by Telink Semiconductor, featuring a 32-pin QFN package. This device is designed for low-power, wireless applications such as Bluetooth and IoT devices.
The pin count is 32, and the pins serve various functions, including:
- Digital I/O: General-purpose input/output pins for interfacing with other devices.
- Analog Inputs: ADC (Analog-to-Digital Converter) channels for sensor input.
- PWM Outputs: Pulse Width Modulation outputs for controlling motors or LEDs.
- Communication Interfaces: SPI, I2C, UART for communication with other peripherals.
- Power Management: Pins for power supply and ground connections.
- Reset and Programming: Dedicated pins for reset and programming functions.
The TLSR8269F512ET32 is optimized for energy efficiency, making it suitable for battery-operated applications.

Manufacturer

The TLSR8269F512ET32 is manufactured by Telink Semiconductor, a company that specializes in designing and manufacturing wireless communication and low-power microcontroller solutions. Founded in 2009 and headquartered in Shanghai, China, Telink focuses on the Internet of Things (IoT), smart home, and wearable devices, offering a range of products that include Bluetooth, Zigbee, and other wireless technologies. The company is recognized for its innovations in low-power design and high-performance wireless solutions, catering to a growing demand for connectivity in various consumer and industrial applications.

Application

The TLSR8269F512ET32 is a versatile SoC designed for low-power wireless applications. Its primary application areas include smart home devices, IoT sensors, wearables, Bluetooth mesh networking, and industrial automation. It supports BLE 5.0 for efficient data transmission and is suitable for applications requiring long battery life and reliable wireless connectivity.

Equivalent

The TLSR8269F512ET32 chip is part of the TLSR8269 series of Bluetooth Low Energy SoCs by Telink. Equivalent products generally include similar Bluetooth SoCs with low power consumption and integrated features. Alternatives may include TI's CC2640R2F, Nordic Semiconductor's nRF52832, or Silicon Labs' EFR32BG series. Always check specific features and compatibility for your application.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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