TLSR8267F512ET32

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TLSR8267F512ET32

RF System on a Chip - SoC

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Spécifications

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Vue d'ensemble

Description

The TLSR8267F512ET32 is a versatile, low-power System on Chip (SoC) designed for Internet of Things (IoT) applications. It features a 32-bit ARM Cortex-M3 processor, operating at up to 48 MHz, and includes 512 KB of Flash memory and 64 KB of RAM, making it suitable for complex tasks and data handling.
Key features include integrated Bluetooth 5.0 support, enabling efficient wireless communication, and various peripherals such as UART, SPI, I2C, and GPIO to facilitate connectivity with sensors and other devices. Its low power consumption is ideal for battery-operated applications, allowing for extended operational life.
The chip also supports advanced features like hardware encryption for secure data transmission, making it suitable for applications in smart homes, wearables, and industrial automation. Its compact design and robust performance provide a strong foundation for developers looking to create innovative IoT solutions.

Features

The TLSR8267F512ET32 is a low-power, highly integrated System on Chip (SoC) designed for Bluetooth Low Energy (BLE) applications. Key features include:
1. Core: ARM Cortex-M4 processor with a DSP extension, enabling efficient processing and low power consumption.
2. Memory: 512 KB of Flash memory and 128 KB of SRAM, providing ample storage for applications.
3. Connectivity: Integrated BLE 5.0 support for enhanced range and data rates, suitable for IoT devices.
4. Power Management: Ultra-low power consumption with various sleep modes, ideal for battery-operated devices.
5. Peripherals: Multiple interfaces including UART, I2C, SPI, and PWM, facilitating versatile connectivity options.
6. ADC/DAC: Integrated analog-to-digital and digital-to-analog converters for sensor and audio applications.
7. Temperature Range: Operating range suitable for industrial applications.
8. Development Support: Compatible with various development tools and software ecosystems, enabling efficient design and prototyping.
This SoC is particularly well-suited for wearables, smart home devices, and other IoT applications.

Package

The TLSR8267F512ET32 is packaged in a 32-pin QFN (Quad Flat No-lead) format.

Pinout

The TLSR8267F512ET32 is a low-power SoC (System on Chip) designed for Bluetooth Low Energy (BLE) applications. It features a total of 32 pins.
Key functions of these pins include:
1. GPIOs: General-purpose input/output pins for various interfacing tasks.
2. ADC: Analog-to-digital converter pins for sensor inputs.
3. PWM: Pulse-width modulation outputs for controlling motors or LEDs.
4. I2C/SPI: Communication interfaces for connecting to peripherals.
5. UART: Serial communication port for debugging or external device connection.
6. Power Management: Pins for VDD and GND connections to power the device.
7. Reset: A pin for resetting the chip.
The TLSR8267F512ET32 is optimized for low power consumption, making it suitable for battery-operated devices in IoT applications.

Manufacturer

The TLSR8267F512ET32 is manufactured by Tsinghua Unigroup, a Chinese semiconductor company. Tsinghua Unigroup is involved in the design and production of microcontrollers and system-on-chip (SoC) solutions, primarily for Internet of Things (IoT) applications. The company focuses on developing innovative technologies and products in the fields of telecommunications, data processing, and consumer electronics. Tsinghua Unigroup aims to enhance the capabilities of smart devices through its integrated circuits and support the growing demand for connected solutions across various industries.

Application

The TLSR8267F512ET32 is a low-power Bluetooth SoC widely used in applications such as smart home devices, wearable technology, health monitoring systems, industrial automation, and IoT solutions. Its capabilities support wireless communication, sensor data transmission, and energy-efficient operations, making it suitable for various connected devices and applications requiring reliable, low-latency connectivity.

Equivalent

The TLSR8267F512ET32 chip is a low-power Bluetooth SoC by Telink. Equivalent products include the Nordic Semiconductor nRF52832, Silicon Labs EFR32BG1, and the Dialog Semiconductor DA14531. These alternatives also support Bluetooth Low Energy and have similar features for IoT and wearable applications. Always verify specific functionality and compatibility for your project needs.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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