THGBMJG6C1LBAIL

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THGBMJG6C1LBAIL

IC FLASH 64GBIT EMMC 153FBGA

  • Fabricant
  • Mfr. Partie #THGBMJG6C1LBAIL
  • Paquet FBGA-153
  • Fiche de données
  • En stock2857

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Spécifications

Package Tray
Series e•MMC™
ProductStatus Last Time Buy
MemoryType Non-Volatile
MemoryFormat FLASH
Technology FLASH - NAND
MemorySize 64Gb (8G x 8)
MemoryInterface eMMC
OperatingTemperature -25°C ~ 85°C (TA)
MountingType Surface Mount
Package/Case 153-WFBGA

Vue d'ensemble

Description

THGBMJG6C1LBAIL is a specific model of NAND flash memory chip produced by Toshiba (now Kioxia). It is designed for use in a variety of consumer electronics, including smartphones, tablets, and laptops. This chip typically features high-density storage, fast read/write speeds, and is available in various capacities, making it suitable for applications requiring reliable and efficient data storage.
The THGBMJG series utilizes advanced NAND technology, which helps enhance durability and performance, ensuring longevity in devices. Additionally, it may support features like error correction and wear leveling to maintain data integrity over time.
Overall, THGBMJG6C1LBAIL contributes to the growing demand for high-performance memory solutions in modern digital devices, enabling better user experiences and increased functionality.

Features

THGBMJG6C1LBAIL is a NAND flash memory chip manufactured by Toshiba, typically used in consumer electronics like smartphones and tablets. Key features include:
1. Storage Capacity: Offers up to 16GB of storage, catering to devices requiring compact data solutions.

2. Interface: Utilizes a serial interface, enabling efficient data transfer and integration with various electronic systems.
3. Form Factor: Designed in a small package, allowing it to fit in space-constrained applications.
4. Performance: Provides fast read and write speeds, enhancing overall device performance and user experience.
5. Endurance: Built for durability, supporting a significant number of program/erase cycles to ensure long-term reliability.
6. Power Efficiency: Designed to consume low power, which helps extend battery life in portable devices.
This chip is ideal for applications where compact size and efficiency are paramount, making it a popular choice in the embedded memory market.

Package

The THGBMJG6C1LBAIL is a NAND flash memory chip packaged in a BGA (Ball Grid Array) format. BGA packages are known for their compact size and efficient thermal and electrical performance, making them suitable for various consumer electronics applications.

Pinout

The THGBMJG6C1LBAIL is a NAND flash memory chip manufactured by Toshiba. It typically features a pin count of 48 pins in a BGA (Ball Grid Array) package. The primary function of this device is to provide non-volatile storage, which means it retains data even when power is turned off. This particular model is used in various applications, including smartphones, tablets, and other consumer electronics, where reliable and fast storage is essential. It implements advanced NAND flash technology to ensure efficient read and write speeds, improving overall device performance.

Manufacturer

The THGBMJG6C1LBAIL is manufactured by Toshiba Corporation, a Japanese multinational conglomerate. Toshiba is known for its diverse range of products and services, including electronics, semiconductors, and storage solutions. The specific part number refers to a NAND flash memory chip, which is often used in consumer electronics, mobile devices, and various computing applications. Founded in 1875, Toshiba has a long history of innovation and is recognized as a key player in the technology sector, focusing on quality and advanced manufacturing processes.

Application

THGBMJG6C1LBAIL is a NAND flash memory chip commonly used in various applications, including smartphones, tablets, digital cameras, and other consumer electronics. It is also utilized in automotive systems, IoT devices, and industrial applications due to its high-speed data storage capabilities and reliability.

Equivalent

The THGBMJG6C1LBAIL is a Toshiba NAND Flash memory chip, often used in smartphones and other devices. Equivalent products include the Samsung KLM8G1GEMB, Micron MT29F8G08ABAEAWP, and SK Hynix H26M51003GMR. When looking for alternatives, ensure they have similar specifications such as capacity, interface, and performance characteristics to ensure compatibility. Always consult the manufacturer's datasheets for precise details.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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